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M74HC259B1R

STMicroelectronics

M74HC259B1R by STMicroelectronics

M74HC259B1R by STMicroelectronics is an 8-bit latch with a propagation delay of 57 ns at 4.5V, suitable for military-grade applications. It operates within a temperature range of -55 to 125°C and has a max supply voltage of 6V, making it ideal for high-performance electronic systems. With a low-level trigger type and true output polarity, this CMOS technology-based device offers reliable performance in demanding environments.

Median Price

$0.435

Lifecycle Status

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11

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1k+

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Nova Conductors

Japan . 99 parts In-Stock

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$0.188

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DF Sales Co.

USA . 43 parts In-Stock

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$0.435

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DF Sales Co.

USA . 43 parts In-Stock

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Digiode

USA . 4,358 parts In-Stock

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Vyrian

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Anansix

USA . 745 parts In-Stock

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LWI Electronics Inc

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PC Components Company LLC

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 18 parts In-Stock

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Ashlea Components Ltd

UK . 15 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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$0.184

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$0.177

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Continental Prestige Electronics

USA . 3,166 parts In-Stock

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$0.188

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Argo Parts USA

USA . 2,392 parts In-Stock

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$0.188

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$0.182

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Microchip USA

USA . 212 parts In-Stock

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$6.638

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AZTECH Wire

Italy . 864 parts In-Stock

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$8.039

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Corohmni

South Africa . 215 parts In-Stock

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$18.440

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IDEA Electronic Components Group

UK . 1,416 parts In-Stock

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$20.500

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$18.450

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Ampacity Inc.

Singapore . 1,504 parts In-Stock

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$24.000

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Aztec Data Supply Inc.

USA . 3,801 parts In-Stock

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$28.348

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MKK Technologies

India . 1,115 parts In-Stock

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$38.550

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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$38.550

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Parana Technologies

USA . 1,748 parts In-Stock

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Corphita

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Assy Fe

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your electronics projects with the M74HC259B1R from STMicroelectronics, a leading manufacturer known for superior quality and reliability. As part of the Latches & Flip-Flops category, this versatile component offers 8 bits of high-performance functionality, perfect for a wide range of applications. With a nominal supply voltage of 4.5V and a low propagation delay of just 57ns, this product provides exceptional value and efficiency. Trust STMicroelectronics to deliver cutting-edge technology that enhances your designs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the latch reliable for long-term use.

Propagation Delay At Nominal Supply: 57 ns

Fast propagation delay ensures quick response time for data transfer and processing.

Package Shape: RECTANGULAR

Compact rectangular shape allows for easy integration into various electronic systems.

No. of Bits: 8

8 bits provides sufficient memory storage capacity for data handling.

Nominal Supply Voltage / Vsup (V): 4.5

Operates efficiently at a standard voltage of 4.5V.

Load Capacitance (CL): 50 pF

Suitable for handling a variety of loads with a capacitance of 50 pF.

Power Supplies (V): 2/6

Compatible with a range of power supplies, allowing for versatile use.

No. of Terminals: 16

Provides multiple connection points for enhanced functionality and input/output options.

Package Style (Meter): IN-LINE

Streamlined in-line design for space-saving and organized installation.

Maximum I (ol): 4 Amp

Can handle a maximum output current of 4 Amp, ensuring reliable performance under heavy loads.

Propagation Delay (tpd): 210 ns

Slightly higher propagation delay allows for more complex data processing and signal synchronization.

Maximum Operating Temperature: 125 °C

Capable of functioning in high-temperature environments up to 125°C.

Trigger Type: LOW LEVEL

Low-level trigger type offers precise control and responsiveness for triggering actions.

Minimum Operating Temperature: -55 °C

Operates efficiently in extreme cold temperatures down to -55°C.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable and corrosion-resistant terminal finish for long-lasting connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and wiring configurations.

Maximum Seated Height: 5.1 mm

Low-profile design with a maximum seated height of 5.1 mm for space-constrained installations.

Width: 7.62 mm

Compact width of 7.62 mm for easy integration and placement in electronic systems.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with other components.

Minimum Supply Voltage (Vsup): 2 V

Operates smoothly at a minimum supply voltage of 2V, allowing for low-power consumption applications.

Temperature Grade: MILITARY

Military-grade temperature rating for reliable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure and stable connections during installation.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm for compatibility with common connectors and PCB layouts.

Maximum Supply Voltage (Vsup): 6 V

Can safely operate at a maximum supply voltage of 6V for versatile power input options.

Technical Specifications

Latches & Flip-Flops M74HC259B1R attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

57 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

M74HC259B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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