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74HC74D-Q100,653

NXP Semiconductors

74HC74D-Q100,653 by NXP Semiconductors

NXP Semiconductors' 74HC74D-Q100,653 is a CMOS latch with 2 functions, operating at 5V. It has a propagation delay of 265ns and can handle temperatures from -40 to 125°C. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

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Digiode

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France . 3,218 parts In-Stock

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Anansix

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Vyrian

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Netroflash

USA . 50 parts In-Stock

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Corohmni

South Africa . 269 parts In-Stock

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AZTECH Wire

Italy . 227 parts In-Stock

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Ampacity Inc.

Singapore . 1,220 parts In-Stock

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Semicontronic

India . 910 parts In-Stock

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One Stop Electronics

USA . 1,152 parts In-Stock

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Component Stockers USA

USA . 705 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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UNI Independent Distributors

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Corphita

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Argo Parts USA

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Overview

Unlock the potential of your automotive electronics with the 74HC74D-Q100,653 by NXP Semiconductors. This high-quality latch & flip-flop device offers reliable performance in extreme temperatures, making it ideal for automotive applications. With a compact design and advanced CMOS technology, this product delivers fast response times and efficient power usage. Trust NXP Semiconductors for cutting-edge solutions that enhance the functionality and reliability of your automotive systems. Elevate your designs with the 74HC74D-Q100,653 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, making it compatible with many existing systems.

Propagation Delay (tpd): 265 ns

Provides fast response times for signal processing, improving overall performance.

Maximum Operating Temperature: 125 °C

Suitable for use in high-temperature environments, ideal for automotive and industrial applications.

Trigger Type: POSITIVE EDGE

Offers precise triggering mechanism for accurate data capture and synchronization.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring efficient operation.

Technical Specifications

Latches & Flip-Flops 74HC74D-Q100,653 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

265 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

24 MHz

Trade Compliance

74HC74D-Q100,653 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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