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CD74HC74M96

Texas Instruments

CD74HC74M96 by Texas Instruments

CD74HC74M96 by Texas Instruments is a dual-function latch with 53ns propagation delay, suitable for military-grade applications. It operates at supply voltages of 2-6V, with a max frequency of 20MHz. With surface mount capability and small outline packaging, it is ideal for compact electronic designs.

Median Price

$0.212

Lifecycle Status

Suppliers In-Stock

28

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1k+

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Texas Instruments

USA . 432,413 parts In-Stock

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Arrow

USA . 26 parts In-Stock

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Mouser Electronics

USA . 12,236 parts In-Stock

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DigiKey

USA . 4,387 parts In-Stock

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Chip1Stop

Japan . 1,048 parts In-Stock

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Verical

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Rochester

USA . 2 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 3,011 parts In-Stock

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EXC GmbH

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Nova Conductors

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TME

Poland . 959 parts In-Stock

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Forefront Electronics and Design

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Component Electronics Inc.

Canada . 2,508 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Bristol Electronics

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Chip Stock

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Florida Circuit

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Connector Distribution Corp

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Right Parts Inc.

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Inventory MP

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Cyclops Electronics Ltd

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NAC Semi

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South Electronics

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PC Components Company LLC

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Semicontronic

India . 64,258 parts In-Stock

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Corphita

USA . 2,646 parts In-Stock

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Argo Parts USA

USA . 741 parts In-Stock

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Continental Prestige Electronics

USA . 415 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

USA . 3,257 parts In-Stock

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Parana Technologies

USA . 120 parts In-Stock

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$21.416

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$1,988.807

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$19.274

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DigiPath Technology Company

USA . 360 parts In-Stock

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

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$22.860

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$21.657

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ChromeModa Solutions

Germany . 853 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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Glotronic Ltd.

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A-Z Elektronik GmbH

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Metaverse IC Inc.

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Supply Digital

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Overview

Discover the top-quality CD74HC74M96 by Texas Instruments, a must-have in the Latches & Flip-Flops category. With a reputable manufacturer like Texas Instruments, you can trust in superior performance and reliability. This versatile component offers incredible value with its fast propagation delay and efficient power consumption. Perfect for a wide range of applications, this product is a game-changer for any electronics project. Get your hands on the CD74HC74M96 today and experience the benefits firsthand!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 53 ns

The low propagation delay ensures fast and efficient operation of the latch or flip-flop.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V is a common and easily attainable voltage for most applications.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting the latch or flip-flop to other components in a circuit.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability in various environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and accurate data storage in the latch or flip-flop.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops CD74HC74M96 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC74M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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