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M74HC279B1R

STMicroelectronics

M74HC279B1R by STMicroelectronics

M74HC279B1R by STMicroelectronics is a CMOS latch with 4 functions, 2 bits, and 39 ns propagation delay. Ideal for military applications, it operates b/w -55 to 125 °C with a supply voltage range of 2-6 V. The package style is in-line with 16 terminals and matte tin finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,847 parts In-Stock

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Vyrian

USA . 1,367 parts In-Stock

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Anansix

USA . 1,111 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 858 parts In-Stock

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$7.713

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858

$7.713

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IDEA Electronic Components Group

UK . 1,974 parts In-Stock

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$18.540

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$16.686

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$16.686

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MKK Technologies

India . 1,799 parts In-Stock

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$34.863

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$34.863

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$34.863

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$34.863

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Ampacity Inc.

Singapore . 329 parts In-Stock

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$51.000

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Corphita

USA . 3,172 parts In-Stock

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Parana Technologies

USA . 2,294 parts In-Stock

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$22.167

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Argo Parts USA

USA . 2,171 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,985 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the M74HC279B1R from STMicroelectronics. Known for their high-quality components, STMicroelectronics delivers reliable solutions for latches & flip-flops. This versatile product offers 4 functions in a compact package, perfect for various applications. With a low propagation delay and wide operating temperature range, the M74HC279B1R provides value and performance to customers looking for precision and efficiency in their projects. Elevate your designs with this innovative component from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 39 ns

The low propagation delay ensures quick response times, making this product suitable for applications requiring fast switching speeds.

No. of Functions: 4

With multiple functions available, this product offers flexibility and versatility in its applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement on circuit boards, optimizing space utilization.

No. of Bits: 2

The 2-bit design provides sufficient capacity for data storage and processing, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps reduce power consumption and improve overall efficiency.

Power Supplies (V): 2/6

The availability of power supplies ranging from 2V to 6V offers flexibility in voltage requirements for different applications.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance processes, making it a convenient choice for users.

Maximum I (ol): 4 Amp

The high maximum output current of 4A enables this product to drive power-hungry loads without any issues.

Propagation Delay (tpd): 195 ns

Despite a slightly higher propagation delay, the overall fast response time of 195 ns is still suitable for most applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and performance in a wide range of environmental conditions.

Trigger Type: LOW LEVEL

The low-level trigger type provides precise control and stability in signal processing, making it ideal for critical applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures functionality in harsh and extreme environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers excellent conductivity and corrosion resistance, improving the overall lifespan and performance of the product.

Terminal Position: DUAL

The dual terminal position provides flexibility in mounting options and facilitates easy installation in various configurations.

Maximum Seated Height: 5.1 mm

With a maximum seated height of 5.1mm, this product is compact and suitable for applications with space constraints.

Width: 7.62 mm

The narrow width of 7.62mm allows for efficient utilization of space on circuit boards, making it suitable for compact designs.

Output Polarity: TRUE

The true output polarity ensures accurate signal processing and compatibility with other components, enhancing system performance.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V allows for operation in low-power scenarios and enhances energy efficiency.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and durability in harsh operating conditions, making it suitable for demanding applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it an efficient choice for battery-operated devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies soldering and assembly processes, ensuring secure connections and robust mechanical strength.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54mm, this product is compatible with common PCB layouts and facilitates ease of integration.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6V provides versatility in power source compatibility, catering to a wide range of applications.

Technical Specifications

Latches & Flip-Flops M74HC279B1R attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

WITH DUAL S INPUT FOR TWO FUNCTIONS

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

39 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

M74HC279B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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