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M74HC109B1R

STMicroelectronics

M74HC109B1R by STMicroelectronics

M74HC109B1R by STMicroelectronics is a CMOS latch with 2 functions, operating at 4.5V and supporting a max frequency of 21MHz. It has a propagation delay of 225ns, suitable for military-grade applications requiring positive edge triggering in temperatures ranging from -55 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,333 parts In-Stock

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3,333

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Vyrian

USA . 2,393 parts In-Stock

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LWI Electronics Inc

India . 529 parts In-Stock

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Anansix

USA . 483 parts In-Stock

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Inland Empire Components Inc.

USA . 27 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 253 parts In-Stock

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$0.938

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$0.938

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IDEA Electronic Components Group

UK . 361 parts In-Stock

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$8.218

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$7.397

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361

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MKK Technologies

India . 343 parts In-Stock

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$15.454

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343

$15.454

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DigiPath Technology Company

USA . 343 parts In-Stock

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$15.454

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$15.454

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AZTECH Wire

Italy . 299 parts In-Stock

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$18.130

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Component Stockers USA

USA . 491 parts In-Stock

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$99.990

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491

$99.990

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A-Z Elektronik GmbH

Germany . 5,193 parts In-Stock

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Corphita

USA . 3,577 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,462 parts In-Stock

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Parana Technologies

USA . 1,333 parts In-Stock

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$9.826

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$9.826

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Kepictronics

USA . 100 parts In-Stock

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Overview

Elevate your electronic projects with the M74HC109B1R by STMicroelectronics, a top-tier manufacturer known for superior quality and innovation. This powerful latch & flip-flop component offers unmatched reliability and performance, making it ideal for a wide range of applications. With its advanced technology and military-grade temperature tolerance, this product ensures seamless operation under any conditions. Trust STMicroelectronics to provide you with the best in electronic components for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the latch/flip-flop.

No. of Functions: 2

Having 2 functions allows for more versatility and usage options in a single component.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V falls within a common range, making it compatible with many power systems.

Propagation Delay (tpd): 225 ns

With a low propagation delay of 225 ns, this latch/flip-flop can quickly respond to input signals, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows this product to withstand elevated temperatures, making it suitable for a variety of environments.

Technology: CMOS

The CMOS technology used in this latch/flip-flop offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops M74HC109B1R attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC109B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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