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M74HC574TTR

STMicroelectronics

M74HC574TTR by STMicroelectronics

M74HC574TTR by STMicroelectronics is an 8-bit bus driver with a 3-state output, ideal for high-speed data transfer. It operates b/w 2V and 6V, featuring a max frequency of 21 MHz and a propagation delay of just 285 ns. Its compact design suits various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 48,791 parts In-Stock

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48,791

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Vyrian

USA . 4,930 parts In-Stock

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4,930

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Digiode

USA . 3,259 parts In-Stock

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3,259

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Anansix

USA . 2,825 parts In-Stock

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2,825

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,683 parts In-Stock

1+ parts

$1.765

100+ parts

-

1k+ parts

$1.694

10k+ parts

$1.694

3,683

$1.765

-

$1.694

$1.694

AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$8.630

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642

$8.630

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IDEA Electronic Components Group

UK . 849 parts In-Stock

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$22.045

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$19.841

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849

$22.045

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$19.841

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MKK Technologies

India . 192 parts In-Stock

1+ parts

$41.454

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192

$41.454

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DigiPath Technology Company

USA . 192 parts In-Stock

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$41.454

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192

$41.454

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Component Stockers USA

USA . 388 parts In-Stock

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$99.990

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388

$99.990

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Corphita

USA . 2,688 parts In-Stock

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2,688

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Parana Technologies

USA . 1,058 parts In-Stock

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$26.358

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1,058

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$26.358

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Overview

Elevate your designs with the M74HC574TTR from STMicroelectronics, a trusted leader in innovation. This 8-bit bus driver combines exceptional quality and performance in a sleek, space-saving package, making it ideal for advanced applications in automotive, industrial, and consumer electronics. Experience superior reliability, fast switching speeds, and low power consumption that significantly enhance your system's efficiency. Choose STMicroelectronics for cutting-edge solutions and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology reduces space requirements, allowing for compact designs and easier integration into modern electronics.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient space utilization on printed circuit boards (PCBs).

No. of Bits: 8

With 8 bits, this driver can handle a reasonable amount of data, making it suitable for various applications.

Nominal Supply Voltage / Vsup: 4.5 V

Optimized nominal supply voltage of 4.5 V enhances power efficiency while ensuring reliable operation.

Load Capacitance (CL): 50 pF

Low load capacitance allows for faster switching times, improving performance in high-speed applications.

Power Supplies (V): 2/6

Dual power supply range enables versatility in different design configurations and application requirements.

No. of Terminals: 20

With 20 terminals, it offers sufficient connectivity options for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design allow for high-density mounting on PCBs, ideal for space-constrained applications.

Maximum I (ol): 6 Amp

A high output current capability of 6 Amps ensures robust performance, especially in power-intensive applications.

Propagation Delay (tpd): 285 ns

The relatively low propagation delay indicates high-speed performance, making it suitable for fast data transmission.

Maximum Operating Temperature: 125 °C

High operating temperature threshold makes it suitable for demanding environments, ensuring reliability under extreme conditions.

Output Characteristics: 3-STATE

3-state output allows for easy bus sharing and helps reduce contention in multi-device configurations.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides synchronized operation, essential for timing-critical applications.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for usage in extreme cold environments, ensuring reliability in harsher climates.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and prevents oxidation, enhancing longevity of connections.

Terminal Position: DUAL

Dual terminal position improves accessibility and ease of soldering on PCBs.

No. of Ports: 2

Two ports enable multiple data paths, improving flexibility in circuit designs and applications.

Maximum Seated Height: 1.2 mm

The low seated height ensures compatibility with low-profile designs, making it valuable for compact assemblies.

Width: 4.4 mm

Narrow width aids in space-efficient PCB layouts without compromising performance.

Output Polarity: TRUE

True output polarity helps ensure consistent output signals, which is crucial for reliable circuit operation.

Minimum Supply Voltage (Vsup): 2 V

The minimal supply voltage supports low-power applications, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for modern PCB manufacturing processes while ensuring component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance confirms the component's ability to withstand soldering processes without damage.

Length: 6.5 mm

Compact length, enabling high-density component placement for space-limited designs.

Temperature Grade: MILITARY

Military-grade certification indicates robustness and reliability, suitable for defense and aerospace applications.

Maximum Frequency At Nominal Supply: 21 MHz

High frequency allows for fast data transfer rates, making this device ideal for high-speed communication links.

Technology: CMOS

CMOS technology ensures low power consumption while providing high switching speeds, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and support automatic placement processes effectively.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for compact designs without sacrificing signal integrity.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level indicates a well-rounded balance between manufacturability and reliability.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V provides flexibility in circuit design while ensuring robust performance.

Technical Specifications

Bus Driver & Transceivers M74HC574TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

285 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

M74HC574TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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