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M74HC377RM13TR

STMicroelectronics

M74HC377RM13TR by STMicroelectronics

M74HC377RM13TR by STMicroelectronics is an 8-bit latch with a max frequency of 24 MHz and a propagation delay of 210 ns. It operates b/w 2V to 6V, making it ideal for military applications. Its compact SO package ensures efficient surface mounting.

Median Price

$0.381

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 280 parts In-Stock

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-

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$0.381

280

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$0.381

Distributors (In-Stock)

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Digiode

USA . 498 parts In-Stock

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$0.969

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498

$0.969

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Vyrian

USA . 7,022 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,000 parts In-Stock

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Tectiva GmbH

Germany . 2,680 parts In-Stock

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2,680

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Anansix

USA . 2,491 parts In-Stock

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Bristol Electronics

USA . 1,542 parts In-Stock

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$0.377

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$0.282

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$0.262

1,542

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$0.377

$0.282

$0.262

Dan-Mar Components

USA . 1,542 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 542 parts In-Stock

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542

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J2 Sourcing AB

Sweden . 454 parts In-Stock

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454

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LIBRA Elektronik GmbH

Germany . 370 parts In-Stock

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370

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Distributors (Availability)

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Corphita

USA . 4,651 parts In-Stock

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$0.918

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4,651

$0.918

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Microchip USA

USA . 399 parts In-Stock

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$4.774

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399

$4.774

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$19.589

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$17.826

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$16.063

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2,500

$19.589

$17.826

$16.063

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IDEA Electronic Components Group

UK . 900 parts In-Stock

1+ parts

$23.538

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$21.184

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900

$23.538

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$21.184

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MKK Technologies

India . 924 parts In-Stock

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$44.262

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924

$44.262

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DigiPath Technology Company

USA . 924 parts In-Stock

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$44.262

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$44.262

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Perfect Parts

USA . 8,618 parts In-Stock

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8,618

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A-Z Elektronik GmbH

Germany . 6,774 parts In-Stock

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6,774

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Alle Elektronik GmbH

Germany . 4,516 parts In-Stock

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4,516

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 2,234 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,335 parts In-Stock

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1,335

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Parana Technologies

USA . 781 parts In-Stock

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$28.144

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781

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$28.144

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Overview

Elevate your designs with the M74HC377RM13TR from STMicroelectronics, a trusted leader in high-performance semiconductor solutions. This robust 8-bit latch promises reliability for a variety of applications—from industrial automation to consumer electronics—delivering exceptional speed and low power consumption. With superior build quality and military-grade specifications, you can trust it to perform flawlessly even in demanding environments. Invest in excellence and experience seamless integration paired with unmatched support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials contributes to a lightweight and cost-effective product.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation on PCBs, saving space and improving performance.

Package Shape: RECTANGULAR

The rectangular shape is suitable for high-density applications and allows for better layout flexibility on circuit boards.

No. of Bits: 8

An 8-bit configuration is ideal for applications requiring moderate data handling, offering a balance between complexity and performance.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at 4.5 V provides efficient power consumption while maintaining reliable operation.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures compatibility with a variety of applications while maintaining fast signal integrity.

Power Supplies (V): 2/6

The flexible voltage range (2-6V) allows for compatibility with different systems and power supply configurations.

No. of Terminals: 20

With 20 terminals, it provides ample connectivity options for more complex designs.

Package Style (Meter): SMALL OUTLINE

The small outline package offers a compact size, making it suitable for space-constrained applications.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps allows the device to drive higher loads effectively, suitable for powerful applications.

Propagation Delay (tpd): 210 ns

A propagation delay of 210 ns favors applications requiring moderate speeds, ensuring efficient data transmission.

Maximum Operating Temperature: 125 °C

With a max operating temperature of 125 °C, it's designed for reliable operation in demanding environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering enables reliable data sampling, making it a good fit for synchronous applications.

Minimum Operating Temperature: -55 °C

The ability to operate at -55 °C enables use in extreme temperature applications, such as aerospace and military.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish enhances solderability and corrosion resistance, providing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for easy integration and layout flexibility on circuit boards.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm supports space-efficient design in compact electronic devices.

Width: 7.5 mm

A width of 7.5 mm accommodates standard PCB layout designs and provides easy integration into various systems.

Output Polarity: TRUE

True output polarity simplifies logic design in digital circuits, making it easier to interface with other components.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V supports battery-operated devices, maximizing power efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures reliable solder connections during manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is suitable for modern SMT processes, ensuring compatibility with various assembly methods.

Length: 12.8 mm

A length of 12.8 mm strikes a balance between size and functionality, fitting various circuit board designs.

Temperature Grade: MILITARY

Being MIL-STD rated provides assurance for high-reliability applications in harsh environments, such as defense and aerospace.

Maximum Frequency At Nominal Supply: 24000000 Hz

A maximum operating frequency of 24 MHz allows for high-speed applications, facilitating efficient data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical strength and facilitate easier soldering and assembly.

Packing Method: TR

Tape and reel (TR) packing method allows for automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports standard PCB layouts and facilitates compact design.

Minimum fmax: 28 MHz

A minimum frequency of 28 MHz enables its use in various applications, supporting basic signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL Level 3 indicates proper handling and storage precautions, ensuring the product's reliability during assembly.

Maximum Supply Voltage (Vsup): 6 V

The capability to handle a maximum voltage of 6V broadens the range of applications and systems it can be integrated with.

Technical Specifications

Latches & Flip-Flops M74HC377RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

24000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

28 MHz

Trade Compliance

M74HC377RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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