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M74HC366RM13TR

STMicroelectronics

M74HC366RM13TR by STMicroelectronics

M74HC366RM13TR by STMicroelectronics is a 6-bit bus driver with a propagation delay of just 27 ns, ideal for high-speed applications. It operates b/w 2V and 6V, featuring a compact SO package. This CMOS device supports dual ports and offers inverted output characteristics.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,789 parts In-Stock

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Digiode

USA . 1,946 parts In-Stock

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Anansix

USA . 1,086 parts In-Stock

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AZTECH Wire

Italy . 628 parts In-Stock

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$11.430

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IDEA Electronic Components Group

UK . 1,862 parts In-Stock

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$20.127

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$18.114

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MKK Technologies

India . 802 parts In-Stock

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$37.847

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802

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DigiPath Technology Company

USA . 802 parts In-Stock

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$37.847

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Component Stockers USA

USA . 464 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,451 parts In-Stock

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Microchip USA

USA . 5,085 parts In-Stock

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Corphita

USA . 4,513 parts In-Stock

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Parana Technologies

USA . 1,692 parts In-Stock

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Overview

Unlock unparalleled performance with the M74HC366RM13TR from STMicroelectronics, a leader in innovation and reliability. This 6-bit bus driver is expertly crafted for precision applications, ensuring seamless data transmission while maintaining robustness in extreme conditions. Its compact design fits effortlessly into any project, offering unmatched efficiency and low power consumption. Elevate your designs with a component that embodies quality and dependability, empowering you to achieve exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizes durable plastic/epoxy material that provides excellent protection against environmental factors, ensuring reliability.

Propagation Delay at Nominal Supply: 27 ns

Offers low propagation delay, enabling faster data transmission and improved overall system performance.

Surface Mount: YES

Designed for surface mounting, facilitating easier and more automated PCB assembly, effectively saving space.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, optimizing layout and design.

Number of Bits: 6

Supports 6-bit data handling, making it suitable for a variety of applications that require moderate data width.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a nominal supply voltage of 4.5 V, aligning with common voltage levels in digital circuits.

Load Capacitance (CL): 50 pF

Features a load capacitance of 50 pF, contributing to stable signal integrity and reduced load on the driving circuit.

Power Supplies (V): 2/6

Compatible with a range of supply voltages from 2V to 6V, providing flexibility for different circuit requirements.

Number of Terminals: 16

With 16 terminals, this product supports multiple connections for enhanced functionality in complex designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style enables compact design, perfect for space-constrained applications.

Maximum I (ol): 6 Amp

Capable of driving up to 6 Amps, making it suitable for applications with higher power demands.

Propagation Delay (tpd): 195 ns

Longer propagation delay of 195 ns allows it to handle certain applications where speed is less critical.

Maximum Operating Temperature: 125 °C

Rated for operation up to 125 °C, demonstrating robustness for use in high-temperature environments.

Output Characteristics: 3-STATE

3-state outputs facilitate multi-device communication on the same bus, improving data handling versatility.

Minimum Operating Temperature: -55 °C

Can function in extremely low temperatures down to -55 °C, making it ideal for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium finish ensures excellent conductivity and long-term reliability in various applications.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and simplified integration into diverse circuit layouts.

Number of Ports: 2

Having 2 ports allows for dual-channel operation; suitable for applications requiring multiple data lines.

Maximum Seated Height: 1.75 mm

Compact seated height enhances compatibility with low-profile designs, ideal for modern electronics.

Width: 3.9 mm

Narrow width makes it suitable for high-density PCB layouts where space efficiency is critical.

Output Polarity: INVERTED

Inverted output polarity is essential for specific circuit designs, enhancing versatility in applications.

Minimum Supply Voltage (Vsup): 2 V

Functions effectively at a minimum supply voltage of 2V, making it adaptable for low-power applications.

Length: 9.9 mm

Compact length allows for space-efficient design in crowded PCBs, suitable for various devices.

Temperature Grade: MILITARY

Meets military-grade specifications, ensuring reliability and robustness in critical applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, making it eco-friendly and cost-effective.

Terminal Form: GULL WING

Gull wing terminal form promotes ease of soldering and improves electrical connection reliability.

Packing Method: TR

Tape and reel (TR) packing method aids in efficient handling and automated assembly processes.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm allows compatibility with various PCBs and manufacturing processes.

Control Type: ENABLE LOW

Low-enable control type simplifies interface integration, enhancing the ease of use in circuit designs.

Moisture Sensitivity Level (MSL): 3

Rated at moisture sensitivity level 3, indicating appropriate handling during assembly to prevent damage.

Maximum Supply Voltage (Vsup): 6 V

Handles a maximum supply voltage of 6V, providing headroom for dynamic voltage conditions in circuits.

Technical Specifications

Bus Driver & Transceivers M74HC366RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

M74HC366RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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