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M34E02-FMB1TG

STMicroelectronics

M34E02-FMB1TG by STMicroelectronics

M34E02-FMB1TG by STMicroelectronics is a compact EEPROM with a 256x8 organization, operating at 2.5V and supporting I2C communication. It features a max clock frequency of 400 kHz and offers hardware/software write protection. Ideal for low-power applications, it ensures reliable data retention with up to 1M write/erase cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Electronics Depot

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Vyrian

USA . 2,800 parts In-Stock

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2,800

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Digiode

USA . 2,461 parts In-Stock

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2,461

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Anansix

USA . 2,251 parts In-Stock

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2,251

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$2.929

100+ parts

-

1k+ parts

$2.636

10k+ parts

-

1,462

$2.929

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$2.636

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MKK Technologies

India . 147 parts In-Stock

1+ parts

$5.508

100+ parts

-

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147

$5.508

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DigiPath Technology Company

USA . 147 parts In-Stock

1+ parts

$5.508

100+ parts

-

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147

$5.508

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Microchip USA

USA . 373 parts In-Stock

1+ parts

$10.912

100+ parts

-

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373

$10.912

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AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$21.200

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890

$21.200

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Component Stockers USA

USA . 605 parts In-Stock

1+ parts

$99.990

100+ parts

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605

$99.990

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A-Z Elektronik GmbH

Germany . 15,000 parts In-Stock

1+ parts

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15,000

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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Authorized Procurement Solutions

USA . 8,200 parts In-Stock

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8,200

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Perfect Parts

USA . 4,398 parts In-Stock

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4,398

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Corphita

USA . 3,205 parts In-Stock

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3,205

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,101 parts In-Stock

1+ parts

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$3.502

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1,101

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$3.502

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Overview

Unlock unparalleled reliability and performance with the M34E02-FMB1TG EEPROM from STMicroelectronics. Renowned for its innovation, STMicroelectronics ensures this compact, synchronous memory solution thrives in diverse applications—from consumer electronics to industrial automation. With robust write protection and a minimal footprint, it delivers exceptional endurance and efficiency, allowing you to enhance your designs while reducing power consumption. Experience quality you can trust!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, making it ideal for compact designs.

Package Shape: RECTANGULAR

Rectangular packages are advantageous for efficient space utilization on printed circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for higher data transfer rates and more efficient communication.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal voltage of 2.5V ensures compatibility with a range of modern low-power systems.

Power Supplies (V): 1.8/3.3 V

Support for multiple supply voltages makes it versatile for different applications in various electronic devices.

No. of Terminals: 8

An 8-terminal configuration simplifies connections and allows for compact circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

The slim profile and advanced package design improve thermal performance and board density.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this EEPROM is suitable for a variety of commercial environments.

Organization: 256X8

The 256x8 organization efficiently utilizes storage, aligning with common data structures.

Minimum Operating Temperature: 0 °C

Operation from 0 °C allows usage in slightly colder environments while maintaining functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent reliability and conductivity, extending product lifespan.

I2C Control Byte: 1010DDDR

Compatible with the I2C interface, this EEPROM supports easy integration into existing designs.

Terminal Position: DUAL

Dual terminal positioning allows flexibility in board design and easier placement on PCBs.

Write Protection: HARDWARE/SOFTWARE

Flexible write protection options enhance data integrity, making it reliable for critical applications.

Maximum Seated Height: 0.6 mm

A low seating height facilitates small product designs, crucial for miniaturized electronics.

Maximum Clock Frequency (fCLK): 0.4 MHz

With a maximum clock frequency of 0.4 MHz, this EEPROM enables reasonably fast data operations.

Width: 2 mm

Compact width is essential for space-constrained applications, contributing to a compact assembly.

Minimum Supply Voltage (Vsup): 1.7 V

Operating down to 1.7V provides more flexibility in power management and design choices.

Length: 3 mm

Short length is ideal for densely packed circuits, maximizing design space efficiency.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, ensuring reliability in standard applications.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption while maintaining performance.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and can lead to lower overall system complexity.

Terminal Form: NO LEAD

No-lead terminals reduce the environmental impact and are compatible with modern PCB manufacturing.

Maximum Supply Current: 2 mA

Low supply current results in energy efficiency, making it suitable for battery-powered devices.

No. of Words: 256 words

A capacity of 256 words fits various applications where moderate data storage is required.

Memory Width: 8 bits

An 8-bit memory width allows for standard data representation, easing data handling in applications.

Minimum Data Retention Time: 40 years

Exceptional data retention time enhances reliability in data-critical applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports dense packing of components without sacrificing performance.

No. of Words Code: 256

The consistent word count in code makes it easy for developers to interface with and manage data.

Maximum Supply Voltage (Vsup): 3.6 V

Compatible with a maximum of 3.6V ensures robust operation across varying loads.

Endurance: 1,000,000 Write/Erase Cycles

High endurance ensures longevity and reliability, lowering maintenance costs and downtime.

Serial Bus Type: I2C

I2C compatibility simplifies multi-device communication in complex systems.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time supports efficient data processing, beneficial for real-time applications.

Memory Density: 2048 bits

Adequate memory density is ideal for various applications, providing ample storage for small data sets.

Memory IC Type: EEPROM

EEPROM technology is well-suited for applications requiring non-volatile memory with low power consumption.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current ensures maximum energy efficiency, making it ideal for portable devices.

Technical Specifications

EEPROM M34E02-FMB1TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34E02-FMB1TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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