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M34C02-RDW6TP

STMicroelectronics

M34C02-RDW6TP by STMicroelectronics

M34C02-RDW6TP by STMicroelectronics is a compact EEPROM with a 256x8 organization, operating b/w -40 °C to 85 °C. It features I2C control, a max clock frequency of 0.4 MHz, and supports hardware/software write protection. Ideal for industrial applications requiring reliable data retention and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,164 parts In-Stock

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13,164

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Quantum Digital Technology

USA . 12,000 parts In-Stock

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12,000

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

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4,000

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ComSIT USA

USA . 4,000 parts In-Stock

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4,000

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Digiode

USA . 3,894 parts In-Stock

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3,894

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Anansix

USA . 1,105 parts In-Stock

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Bristol Electronics

USA . 489 parts In-Stock

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489

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Dan-Mar Components

USA . 489 parts In-Stock

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489

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Cyclops Electronics Ltd

UK . 321 parts In-Stock

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321

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Distributors (Availability)

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Microchip USA

USA . 368 parts In-Stock

1+ parts

$3.660

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368

$3.660

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IDEA Electronic Components Group

UK . 98 parts In-Stock

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$3.951

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$3.556

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98

$3.951

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$3.556

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MKK Technologies

India . 1,656 parts In-Stock

1+ parts

$7.430

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1,656

$7.430

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DigiPath Technology Company

USA . 1,656 parts In-Stock

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$7.430

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1,656

$7.430

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AZTECH Wire

Italy . 962 parts In-Stock

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$17.010

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962

$17.010

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RC Electronics

USA . 94,146 parts In-Stock

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Perfect Parts

USA . 15,355 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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GreenTree Electronics

Israel . 3,389 parts In-Stock

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3,389

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A-Z Elektronik GmbH

Germany . 2,181 parts In-Stock

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Kepictronics

USA . 2,143 parts In-Stock

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2,143

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Corphita

USA . 1,755 parts In-Stock

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1,755

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Parana Technologies

USA . 1,533 parts In-Stock

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$4.724

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1,533

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$4.724

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Alle Elektronik GmbH

Germany . 1,454 parts In-Stock

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1,454

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Cyclops Electronics Ltd (Excess)

UK . 637 parts In-Stock

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637

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Overview

Unlock exceptional performance with the M34C02-RDW6TP EEPROM from STMicroelectronics—a leader in innovation and quality. This compact, reliable memory solution ensures seamless data storage for your devices, operating efficiently across a wide temperature range. With robust write protection and impressive endurance, it’s perfect for industrial applications where reliability matters most. Elevate your designs with ST’s trusted technology and experience unparalleled value for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, enhancing reliability in various applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient use of PCB space, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the PCB and better thermal management.

Operating Mode: SYNCHRONOUS

Synchronous operation facilitates faster data transfers, making this EEPROM suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 2.2 V

Low supply voltage improves power efficiency, making this EEPROM suitable for battery-operated devices.

Power Supplies (V): 2/5

The flexibility of power supply options allows for compatibility with a wide range of systems.

No. of Terminals: 8

The 8 terminals provide all necessary connections while keeping the footprint small, promoting efficient design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are perfect for space-constrained applications, enhancing design versatility.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance ensures reliability in harsh environments and extended usage.

Organization: 256X8

This memory organization optimizes data storage and retrieval, making it efficient for various applications.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures increases the range of environments where this EEPROM can be used.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent solderability and enhanced long-term reliability.

I2C Control Byte: 1010DDDR

The I2C control interface simplifies connectivity with microcontrollers, facilitating ease of integration in designs.

Terminal Position: DUAL

Dual terminal position enhances PCB layout flexibility and improves heat dissipation.

Write Protection: HARDWARE/SOFTWARE

Flexible write protection mechanisms safeguard against accidental data corruption, enhancing data integrity.

Maximum Seated Height: 1.2 mm

A low seated height allows for compact designs and compatibility with slim form factor products.

Maximum Clock Frequency (fCLK): 0.4 MHz

Sufficient clock frequency for moderate-speed applications while keeping power consumption low.

Width: 3 mm

Compact width facilitates high-density circuit designs, making it suitable for small devices.

Minimum Supply Voltage (Vsup): 1.8 V

Operating at a minimum of 1.8 V makes this EEPROM compatible with low-power designs and energy-efficient applications.

Length: 4.4 mm

Short length contributes to a compact footprint, enhancing PCB layout efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and durability in demanding conditions.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high performance.

Parallel or Serial: SERIAL

Serial communication reduces pin count, thus enabling easier and more efficient PCB designs.

Terminal Form: GULL WING

Gull wing terminals are designed for enhanced soldering and mechanical strength, ensuring reliable connections.

Maximum Supply Current: 1 mA

Low maximum supply current indicates minimal power usage, making it favorable for battery-operated devices.

No. of Words: 256 words

Adequate word count for various applications, providing a balance of capacity and efficiency.

Memory Width: 8

An 8-bit memory width complements a variety of data types, enhancing versatility for multiple applications.

Minimum Data Retention Time: 40 years

Long data retention time ensures that stored information remains intact over extended periods, vital for critical applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for compact layout while still being suitable for automated assembly processes.

No. of Words Code: 256

Limited code size is manageable and sufficient for various common data storage requirements.

Maximum Supply Voltage (Vsup): 5.5 V

A wide supply voltage range supports a variety of operational contexts, allowing flexibility across applications.

Endurance: 1,000,000 Write/Erase Cycles

High endurance guarantees reliability even in frequently written applications, making it suitable for demanding tasks.

Serial Bus Type: I2C

I2C interface simplifies communication with microcontrollers and reduces wiring complexity, facilitating integration.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time allows for efficient data writing, enhancing overall system performance.

Memory Density: 2048 bit

2048 bit memory density strikes a good balance between capacity and cost, suitable for many standard applications.

Memory IC Type: EEPROM

As an EEPROM, it allows for non-volatile storage which is crucial for applications that need to retain data after power loss.

Maximum Standby Current: 0.0000005 Amp

Extremely low standby current ensures minimal power usage in idle states, prolonging battery life in portable devices.

Technical Specifications

EEPROM M34C02-RDW6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34C02-RDW6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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