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M34C00-WMN6

STMicroelectronics

M34C00-WMN6 by STMicroelectronics

M34C00-WMN6 by STMicroelectronics is a 384-bit EEPROM with I2C interface, ideal for industrial applications. It operates at 3.3V, supports synchronous mode, and features software write protection. Its compact SO8 package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,847 parts In-Stock

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2,847

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Anansix

USA . 1,259 parts In-Stock

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1,259

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Digiode

USA . 778 parts In-Stock

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778

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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90

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IDEA Electronic Components Group

UK . 1,917 parts In-Stock

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$3.261

100+ parts

-

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$2.935

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1,917

$3.261

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$2.935

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MKK Technologies

India . 1,579 parts In-Stock

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$6.133

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1,579

$6.133

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DigiPath Technology Company

USA . 1,579 parts In-Stock

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$6.133

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1,579

$6.133

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Perfect Parts

USA . 4,403 parts In-Stock

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4,403

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Parana Technologies

USA . 2,008 parts In-Stock

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$3.900

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2,008

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$3.900

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Cyclops Electronics Ltd (Excess)

UK . 1,763 parts In-Stock

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1,763

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Corphita

USA . 1,715 parts In-Stock

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1,715

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Glotronic Ltd.

UK . 72 parts In-Stock

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Overview

Unlock the potential of your designs with the M34C00-WMN6 EEPROM from STMicroelectronics, a trusted leader in semiconductor innovation. This compact, high-quality memory solution excels in performance and reliability, ensuring seamless data storage across diverse applications—from industrial automation to consumer electronics. With robust write protection and exceptional temperature resilience, it delivers unmatched value, empowering you to create smarter, more efficient products. Choose STMicroelectronics for quality that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on circuit boards, which is ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient space utilization on PCBs, allowing for flexible layout designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances communication speed and efficiency, improving overall system performance.

Nominal Supply Voltage / Vsup: 3.3V

A nominal voltage of 3.3V is compatible with modern low-power electronics, making it energy-efficient.

No. of Terminals: 8

Having 8 terminals provides sufficient I/O options for versatile circuit configurations without complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space-saving designs, making it a favored choice for portable devices.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C makes this EEPROM suitable for industrial environments where higher temperatures may be encountered.

Organization: 48X8

The 48x8 organization offers a balanced memory structure, allowing for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Suitable for extreme conditions, the -40 °C minimum operating temperature expands its usability in diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent conductivity and resistance to oxidation, ensuring reliable connections over time.

I2C Control Byte: 1010111R

The specified I2C control byte facilitates straightforward integration with I2C-compatible systems for easy communication.

Terminal Position: DUAL

Dual terminal positioning enhances the flexibility of PCB layout, allowing for efficient circuit designs.

Write Protection: SOFTWARE

Software write protection enhances data integrity and security, safeguarding stored information from accidental modification.

Maximum Seated Height: 1.75 mm

A low seated height allows for lower profile designs in compact applications, contributing to overall design efficiency.

Maximum Clock Frequency (fCLK): 0.4 MHz

A satisfactory clock frequency meets the requirements of many applications, ensuring reliable communication speeds.

Width: 3.9 mm

The compact width is ideal for tight spaces, optimizing circuit board real estate without compromising functionality.

Minimum Supply Voltage (Vsup): 2.5V

Operating at a minimum supply voltage of 2.5V allows flexibility in power design for various devices.

Length: 4.9 mm

The length is designed for compact layout applications, making it easy to incorporate this component into any circuit.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliability in demanding applications, ensuring long-lasting performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed, which is ideal for energy-sensitive applications.

Parallel or Serial: SERIAL

Serial communication reduces pin count and complexity, making it easier to connect and manage multiple devices.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and improve reliability in connections, allowing for easier assembly processes.

No. of Words: 48 words

Offering 48 words of memory provides sufficient storage for moderately sized data while keeping costs manageable.

Memory Width: 8

An 8-bit width allows for data structuring in common byte-sized units, enabling easier data management.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard, ensuring compatibility with a wide range of circuit board designs.

No. of Words Code: 48

The provision of 48 words of code contributes to versatile applications, from simple data logging to complex control systems.

Maximum Supply Voltage (Vsup): 5.5V

A maximum supply voltage of 5.5V allows it to be used in a variety of systems operating at different voltage levels.

Serial Bus Type: I2C

I2C bus type enables multiple devices to communicate over two wires, reducing the complexity of circuit design.

Maximum Write Cycle Time (tWC): 10 ms

The fast write cycle time of 10 ms allows for quick data updates, enhancing system performance in data-intensive applications.

Memory Density: 384 bit

With a memory density of 384 bits, this EEPROM meets the storage needs for a variety of applications while remaining efficient.

Memory IC Type: EEPROM

As an EEPROM, this memory type offers non-volatile storage, making it ideal for applications where data retention is critical.

Technical Specifications

EEPROM M34C00-WMN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

I2C Control Byte:

1010111R

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

48 words

No. of Words Code:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

48X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Sub-Category:

EEPROMs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M34C00-WMN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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