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M34C00-WMN6T

STMicroelectronics

M34C00-WMN6T by STMicroelectronics

M34C00-WMN6T by STMicroelectronics is a 384-bit EEPROM with I2C interface, ideal for industrial applications. It operates at 3.3V, supports up to 1M write/erase cycles, and functions in temperatures from -40 °C to 85°C. Its compact SO8 package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,899 parts In-Stock

1+ parts

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100+ parts

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3,899

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Anansix

USA . 2,851 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,851

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Digiode

USA . 653 parts In-Stock

1+ parts

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100+ parts

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653

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 294 parts In-Stock

1+ parts

$2.582

100+ parts

-

1k+ parts

$2.323

10k+ parts

-

294

$2.582

-

$2.323

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MKK Technologies

India . 1,645 parts In-Stock

1+ parts

$4.854

100+ parts

-

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10k+ parts

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1,645

$4.854

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DigiPath Technology Company

USA . 1,645 parts In-Stock

1+ parts

$4.854

100+ parts

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10k+ parts

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1,645

$4.854

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-

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Parana Technologies

USA . 1,875 parts In-Stock

1+ parts

-

100+ parts

$3.087

1k+ parts

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1,875

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$3.087

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Corphita

USA . 1,125 parts In-Stock

1+ parts

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1,125

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Overview

Elevate your designs with the M34C00-WMN6T EEPROM from STMicroelectronics, a trusted name in high-quality embedded solutions. This compact and robust memory chip is perfect for industrial applications, offering exceptional durability with a wide temperature range and impressive write endurance. Benefit from rapid data access, low power consumption, and seamless integration, ensuring your projects are both efficient and reliable. Choose STMicroelectronics for excellence that powers innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensuring long-lasting performance and resistance to environmental conditions.

Surface Mount: YES

Suitable for modern PCB designs, allowing for efficient use of board space.

Package Shape: RECTANGULAR

Optimizes layout and integration onto circuit boards.

Operating Mode: SYNCHRONOUS

Faster data transfer rates enhance overall system performance.

Nominal Supply Voltage / Vsup: 3.3 V

Standard voltage level that is widely used in various applications, ensuring compatibility.

Power Supplies (V): 3/5

Flexible supply voltage options make it versatile for different electronic setups.

No. of Terminals: 8

Compact design with sufficient terminals for connecting multiple components without overcrowding.

Package Style (Meter): SMALL OUTLINE

Space-saving design, perfect for compact electronic devices.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it suitable for industrial applications.

Organization: 48X8

Provides a structured memory organization that helps in efficient data management.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold environments, ideal for outdoor and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish that ensures excellent conductivity and resistance to corrosion.

I2C Control Byte: 1010111R

Standard I2C control format that simplifies communication with microcontrollers.

Terminal Position: DUAL

Allows for easy integration and routing on PCB layouts.

Write Protection: SOFTWARE

Enhanced data security feature safeguards against accidental data alteration.

Maximum Seated Height: 1.75 mm

Low profile facilitates design in compact electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

Adequate speed for various applications, balancing performance with power consumption.

Width: 3.9 mm

Compact width that allows flexibility in design without compromising functionality.

Minimum Supply Voltage (Vsup): 2.5 V

Lower voltage operation increases energy efficiency and extends battery life in portable devices.

Length: 4.9 mm

Compact length facilitates easy integration into small spaces in circuit boards.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and maintain reliability.

Technology: CMOS

Power-efficient technology that contributes to lower overall power consumption.

Parallel or Serial: SERIAL

Simplified interface for reduced complexity in communication protocols.

Terminal Form: GULL WING

Common form factor that aids in secure mounting and soldering.

Maximum Supply Current: 2 mA

Low current consumption translates to better efficiency and battery life.

No. of Words: 48 words

Provides adequate storage for various application needs.

Memory Width: 8

Sufficient data width enhances processing capabilities.

Minimum Data Retention Time: 40

Ensures long-term data integrity, making it reliable for critical applications.

Terminal Pitch: 1.27 mm

Common pitch that fits well with standard PCB hole designs.

No. of Words Code: 48

Consistent storage capability provides reliable data management solutions.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages to accommodate various device requirements.

Endurance: 1000000 Write/Erase Cycles

High endurance capability ensures long-lasting performance in write-intensive applications.

Serial Bus Type: I2C

Widely used communication protocol that simplifies connection with multiple devices.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time allows for efficient data processing in dynamic environments.

Memory Density: 384 bit

Adequate memory density for storing small data sets efficiently.

Memory IC Type: EEPROM

Non-volatile memory type ensures data retention even when powered off.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current enhances battery life in battery-operated devices.

Technical Specifications

EEPROM M34C00-WMN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010111R

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

48 words

No. of Words Code:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

48X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M34C00-WMN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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