Loading...

M34C00-WPB6T

STMicroelectronics

M34C00-WPB6T by STMicroelectronics

M34C00-WPB6T by STMicroelectronics is a 384-bit EEPROM with a dual terminal design, operating in synchronous mode. It supports I2C communication and functions effectively within -40 °C to 85°C, making it ideal for industrial applications. Its compact size (1.6mm x 2.9mm) ensures efficient integration in space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

-

-

-

-

Vyrian

USA . 623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

623

-

-

-

-

Anansix

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 800 parts In-Stock

1+ parts

$2.050

100+ parts

-

1k+ parts

$1.845

10k+ parts

-

800

$2.050

-

$1.845

-

MKK Technologies

India . 1,831 parts In-Stock

1+ parts

$3.854

100+ parts

-

1k+ parts

-

10k+ parts

-

1,831

$3.854

-

-

-

DigiPath Technology Company

USA . 1,831 parts In-Stock

1+ parts

$3.854

100+ parts

-

1k+ parts

-

10k+ parts

-

1,831

$3.854

-

-

-

Corphita

USA . 4,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,636

-

-

-

-

Parana Technologies

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$2.451

1k+ parts

-

10k+ parts

-

481

-

$2.451

-

-

Overview

Unlock the power of reliability with the M34C00-WPB6T EEPROM from STMicroelectronics. Crafted for excellence, this compact solution ensures seamless data management in diverse applications, from consumer electronics to industrial automation. With a robust temperature range and efficient I2C interface, it provides durability and performance that you can trust. Elevate your projects today with superior technology that maximizes efficiency and reduces downtime!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable packaging material that ensures long-term performance and stability of the EEPROM.

Surface Mount: YES

Allows for compact design and easy placement on printed circuit boards, optimizing space utilization.

Package Shape: RECTANGULAR

Provides efficient layout options for PCB design, contributing to better space management.

Operating Mode: SYNCHRONOUS

Enables faster data transfer and better performance in applications where timing is critical.

Nominal Supply Voltage / Vsup: 3.3 V

Compatible with modern low-power applications, enhancing energy efficiency in battery-operated devices.

No. of Terminals: 5

Sufficient terminals for connectivity while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Ideal for space-constrained environments and surface-mount technology applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications requiring reliable performance in higher temperature conditions.

Organization: 48X8

Provides a structured memory organization that efficiently supports data storage and access.

Minimum Operating Temperature: -40 °C

Ensures functionality in harsh environmental conditions, making it suitable for outdoor and industrial applications.

Terminal Position: DUAL

Offers flexible configuration options for circuit board layout, enhancing design versatility.

Maximum Seated Height: 1.45 mm

Low profile design reduces overall height on PCBs, beneficial for compact device designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

Adequate speed for many applications while maintaining reliable processing capabilities.

Width: 1.6 mm

Compact width allows for effective use of space in densely populated circuit layouts.

Minimum Supply Voltage (Vsup): 2.5 V

Flexibility to operate with lower voltage levels contributes to energy conservation.

Length: 2.9 mm

Short length permits easy integration into various electronic systems without adding bulk.

Temperature Grade: INDUSTRIAL

Designed for reliability in industrial environments, supporting long-term operation and resilience.

Technology: CMOS

Utilizes CMOS technology for high efficiency and performance in data storage.

Parallel or Serial: SERIAL

Serial communication simplifies connectivity, reducing the number of pins and optimizing board design.

Terminal Form: GULL WING

Facilitates easy soldering and enhances reliability in physical connections.

No. of Words: 48 words

Provides sufficient storage capacity for various applications, suitable for both simple and moderate data needs.

Memory Width: 8

Offers 8-bit wide data access, making it versatile for a range of applications.

Terminal Pitch: 0.95 mm

Provides a balance between density and ease of soldering, ensuring reliable connections.

No. of Words Code: 48

Consistency in word count enhances predictability in data handling and interface.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for operation across a wide voltage range, increasing compatibility with various systems.

Serial Bus Type: I2C

Supports I2C communication for easier integration with microcontrollers and other devices.

Maximum Write Cycle Time (tWC): 10 ms

Reasonably fast write cycles enhance data update processes, ensuring timely performance.

Memory Density: 384 bit

Suitable for applications that require moderate data storage capacity while being efficient.

Memory IC Type: EEPROM

Non-volatile memory technology retains data without power, making it suitable for applications requiring memory retention.

Technical Specifications

EEPROM M34C00-WPB6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Memory Density:

384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

5

No. of Words:

48 words

No. of Words Code:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

48X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M34C00-WPB6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19