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M34C02-FBN1TP

STMicroelectronics

M34C02-FBN1TP by STMicroelectronics

M34C02-FBN1TP by STMicroelectronics is a 2048-bit EEPROM with a synchronous operating mode and I2C serial bus type. It operates b/w 1.7V to 3.6V, features an 8-terminal dual position design, and supports up to 70 °C. Ideal for commercial applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,740 parts In-Stock

1+ parts

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2,740

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Digiode

USA . 2,557 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,557

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Vyrian

USA . 1,413 parts In-Stock

1+ parts

-

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1,413

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 205 parts In-Stock

1+ parts

$4.678

100+ parts

-

1k+ parts

$4.210

10k+ parts

-

205

$4.678

-

$4.210

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MKK Technologies

India . 2,037 parts In-Stock

1+ parts

$8.797

100+ parts

-

1k+ parts

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10k+ parts

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2,037

$8.797

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DigiPath Technology Company

USA . 2,037 parts In-Stock

1+ parts

$8.797

100+ parts

-

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2,037

$8.797

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Corphita

USA . 1,945 parts In-Stock

1+ parts

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1,945

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Parana Technologies

USA . 1,119 parts In-Stock

1+ parts

-

100+ parts

$5.594

1k+ parts

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1,119

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$5.594

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Overview

Unlock the potential of your designs with the M34C02-FBN1TP EEPROM from STMicroelectronics, a leader in innovation and quality. This reliable and efficient memory solution is perfect for diverse applications, from consumer electronics to industrial systems. With its compact design and impressive performance, it provides seamless data storage and retrieval while ensuring low power consumption. Enhance your projects with unmatched durability and trust the excellence that comes with STMicroelectronics expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making the EEPROM reliable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, integrating smoothly into a variety of circuit designs.

Operating Mode: SYNCHRONOUS

Synchronous operation leads to faster data transfer rates, enhancing performance in time-sensitive applications.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V allows for lower power consumption, which is crucial for battery-operated devices.

No. of Terminals: 8

With 8 terminals, this EEPROM is versatile for various circuit configurations while maintaining simplicity in connections.

Package Style (Meter): IN-LINE

The in-line package style offers easy integration into existing systems and is ideal for through-hole soldering.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in moderate thermal environments, meeting the needs of many commercial applications.

Organization: 256X8

The 256x8 organization supports efficient data storage and retrieval, making it suitable for applications requiring moderate memory capacity.

Minimum Operating Temperature: 0 °C

The minimum operating temperature guarantees functionality in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: DUAL

The dual terminal position facilitates flexible PCB layouts, catering to diverse design requirements.

Maximum Seated Height: 5.33 mm

A relatively low seated height allows for compact designs, making this EEPROM suitable for space-constrained applications.

Maximum Clock Frequency (fCLK): 0.1 MHz

With a maximum clock frequency of 0.1 MHz, this EEPROM operates adequately for many general-purpose applications.

Width: 7.62 mm

A width of 7.62 mm maintains a compact form factor, allowing for greater design flexibility.

Minimum Supply Voltage (Vsup): 1.7 V

Operating down to a minimum supply voltage of 1.7 V enhances compatibility with low-voltage systems.

Length: 9.27 mm

This length contributes to a compact profile, making it suitable for applications with limited board space.

Temperature Grade: COMMERCIAL

A commercial temperature grade supports usage in standard commercial environments, making it versatile for various applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher integration density, benefitting energy-sensitive applications.

Parallel or Serial: SERIAL

Serial communication offers a simpler interface and requires fewer pins, making it easier to integrate into complex systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and are ideal for prototyping and robust applications.

No. of Words: 256 words

With 256 words of memory, this EEPROM fits applications requiring moderate data storage without excessive complexity.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and processing, suitable for a variety of applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm (0.1”) is standard in many designs, facilitating easy integration with existing hardware.

No. of Words Code: 256

The EEPROM's ability to store 256 words makes it practical for applications requiring straightforward data management.

Maximum Supply Voltage (Vsup): 3.6 V

Support for a maximum supply voltage of 3.6 V ensures stability and functionality in higher voltage systems.

Serial Bus Type: I2C

The I2C bus type enhances compatibility with a wide array of microcontrollers and makes daisy-chaining multiple devices easy.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms ensures adequate performance for applications requiring frequent updates without delays.

Memory Density: 2048 bit

At a memory density of 2048 bits, this EEPROM meets the needs of applications requiring moderate data storage without unnecessary complexity.

Memory IC Type: EEPROM

As an EEPROM, it provides non-volatile storage, retaining data without power, essential for applications needing data persistence.

Technical Specifications

EEPROM M34C02-FBN1TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M34C02-FBN1TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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