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M34C00-WPB6

STMicroelectronics

M34C00-WPB6 by STMicroelectronics

M34C00-WPB6 by STMicroelectronics is a 384-bit EEPROM with a dual terminal configuration, operating in synchronous mode. It supports I2C serial communication and functions effectively within -40 °C to 85°C, making it ideal for industrial applications. With a compact size of 1.6mm x 2.9mm, it ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,392 parts In-Stock

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4,392

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Vyrian

USA . 1,241 parts In-Stock

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1,241

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Anansix

USA . 143 parts In-Stock

1+ parts

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 501 parts In-Stock

1+ parts

$3.253

100+ parts

-

1k+ parts

$2.928

10k+ parts

-

501

$3.253

-

$2.928

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MKK Technologies

India . 554 parts In-Stock

1+ parts

$6.117

100+ parts

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554

$6.117

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DigiPath Technology Company

USA . 554 parts In-Stock

1+ parts

$6.117

100+ parts

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554

$6.117

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Corphita

USA . 2,893 parts In-Stock

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2,893

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Parana Technologies

USA . 2,372 parts In-Stock

1+ parts

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$3.890

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2,372

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$3.890

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Overview

Unlock unparalleled performance with the M34C00-WPB6 EEPROM from STMicroelectronics, a trusted leader in semiconductor innovation. This compact, robust memory solution excels in demanding environments, ensuring reliable data retention and swift access for various applications—from automotive to industrial automation. With its low power consumption and wide temperature range, it delivers unbeatable value, making it the ideal choice for engineers seeking quality and efficiency in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material offers protection against environmental factors, making the EEPROM reliable for various applications.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, enabling efficient use of space and improved manufacturability.

Package Shape: RECTANGULAR

The rectangular shape is optimal for maximizing board space while maintaining a stable configuration.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer rates, improving overall performance in communication with other components.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal voltage of 3.3 V is commonly used in modern electronics, making it compatible with many systems and reducing power consumption.

No. of Terminals: 5

Five terminals provide adequate connectivity while allowing for a compact design, suitable for space-constrained applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low profile design enhances compatibility with slim devices and maximizes space on the circuit board.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can be trusted in demanding environments without performance degradation.

Organization: 48X8

The organization format allows for efficient data storage and retrieval, suitable for applications that require moderate memory capacity.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures operation in extreme conditions, making this EEPROM ideal for industrial and automotive applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, facilitating design in various layouts.

Maximum Seated Height: 1.45 mm

A low seated height is suitable for modern, compact designs, helping to keep overall device profiles slim.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz facilitates decent data rates for many standard applications.

Width: 1.6 mm

The narrow width provides versatility in design, allowing for use in tight spaces.

Minimum Supply Voltage (Vsup): 2.5 V

Operating down to 2.5 V enhances compatibility with a wide array of devices while contributing to lower power consumption.

Length: 2.9 mm

A compact length allows for efficient placement on circuit boards, accommodating designs with limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability in harsh conditions, vital for critical applications.

Technology: CMOS

CMOS technology emphasizes low power consumption and high density, making this EEPROM efficient in performance.

Parallel or Serial: SERIAL

Serial communication allows for simpler circuit design and reduces pin count, which is advantageous for small designs.

Terminal Form: GULL WING

Gull wing terminals facilitate strong solder joints and improve mechanical stability on PCB assemblies.

No. of Words: 48 words

This capacity is sufficient for many applications, making it a practical choice for devices requiring moderate data storage.

Memory Width: 8

With an 8-bit width, this EEPROM can handle standard data sizes efficiently, fitting well within common digital architecture.

Terminal Pitch: 0.95 mm

A 0.95 mm pitch is suitable for both hand-soldering and automated assembly, allowing flexibility in manufacturing processes.

No. of Words Code: 48

The designation of 48 words confirms its capacity, making it ideal for simple settings or applications.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum of 5.5 V provides versatility in applications requiring higher voltage, ensuring compatibility.

Serial Bus Type: I2C

I2C support enables easy integration in networks and multi-device communication, enhancing usability in complex designs.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms ensures reasonable write performance, suitable for many application needs.

Memory Density: 384 bit

With a density of 384 bits, this EEPROM provides an adequate amount of storage for small to medium applications.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatility, which is critical for retaining information even when power is lost.

Technical Specifications

EEPROM M34C00-WPB6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

Memory Density:

384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

5

No. of Words:

48 words

No. of Words Code:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

48X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M34C00-WPB6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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