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AT24C512C-SSHM-T-989

Microchip Technology

AT24C512C-SSHM-T-989 by Microchip Technology

AT24C512C-SSHM-T-989 by Microchip: 64KX8 organization, 524288 bit memory density, I2C serial bus type. Ideal for industrial applications requiring EEPROM with 1 MHz clock frequency and -40 to 85 °C operating temperature range.

Median Price

$4.152

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 500 parts In-Stock

1+ parts

$4.152

100+ parts

$3.944

1k+ parts

$3.944

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500

$4.152

$3.944

$3.944

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Distributors (In-Stock)

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VNN

France . 4,768 parts In-Stock

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Vyrian

USA . 3,522 parts In-Stock

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3,522

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,628 parts In-Stock

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$2.131

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1,628

$2.131

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Ampacity Inc.

Singapore . 483 parts In-Stock

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$3.530

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483

$3.530

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Semicontronic

India . 207 parts In-Stock

1+ parts

$3.530

100+ parts

$3.442

1k+ parts

$3.424

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207

$3.530

$3.442

$3.424

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Corohmni

South Africa . 72 parts In-Stock

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$3.792

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72

$3.792

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$4.152

100+ parts

$3.944

1k+ parts

$3.944

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500

$4.152

$3.944

$3.944

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AZTECH Wire

Italy . 830 parts In-Stock

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$15.136

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830

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RGB Technical Solutions

Ukraine . 2,897 parts In-Stock

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2,897

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Continental Prestige Electronics

USA . 2,331 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Argo Parts USA

USA . 393 parts In-Stock

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393

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Overview

Unlock a world of possibilities with the AT24C512C-SSHM-T-989 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality EEPROM products that guarantee reliability and performance. This versatile device is perfect for a wide range of applications, offering seamless integration and superior data storage capabilities. Experience the value and benefits of this innovative product, providing customers with a convenient solution for their memory needs. Choose Microchip Technology for cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the EEPROM, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and integration of the EEPROM into various electronic devices, saving space and simplifying the design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this EEPROM can withstand harsh environmental conditions, making it suitable for industrial applications.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics provide flexibility in connecting the EEPROM to other components, allowing for customization and compatibility with different systems.

Memory Density: 524288 bit

With a high memory density of 524288 bits, this EEPROM can store a large amount of data, making it ideal for applications requiring extensive memory capacity.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1,000,000 write/erase cycles ensures the reliability and longevity of the EEPROM, making it a robust choice for frequent data read/write operations.

Technical Specifications

EEPROM AT24C512C-SSHM-T-989 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 1.7V TO 2.5V @0.4MHZ

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.925 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000006 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

AT24C512C-SSHM-T-989 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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