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M34C02-LDW6T

STMicroelectronics

M34C02-LDW6T by STMicroelectronics

M34C02-LDW6T by STMicroelectronics is a compact EEPROM with a 256x8 organization, operating at 2.5V to 5.5V and featuring I2C control for easy integration. It supports up to 1M write/erase cycles and operates in temperatures from -40 °C to 85°C. Ideal for industrial applications requiring reliable data retention and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,290 parts In-Stock

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11,290

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Digiode

USA . 4,803 parts In-Stock

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4,803

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Anansix

USA . 1,750 parts In-Stock

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1,750

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ComSIT Distribution GmbH

Germany . 91 parts In-Stock

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91

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Prism Electronics

USA . 55 parts In-Stock

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55

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 817 parts In-Stock

1+ parts

$3.659

100+ parts

-

1k+ parts

$3.293

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817

$3.659

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$3.293

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MKK Technologies

India . 264 parts In-Stock

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$6.880

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264

$6.880

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DigiPath Technology Company

USA . 264 parts In-Stock

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$6.880

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264

$6.880

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AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$8.780

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620

$8.780

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Microchip USA

USA . 6,749 parts In-Stock

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6,749

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Corphita

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,011 parts In-Stock

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$4.375

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1,011

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$4.375

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock the potential of your designs with the M34C02-LDW6T EEPROM from STMicroelectronics—a trusted leader in semiconductor solutions. This compact, high-performance memory device offers exceptional reliability and versatility for industrial applications, ensuring robust data retention in challenging environments. With features like write protection and a wide operating voltage range, it delivers peace of mind while enhancing efficiency and longevity in your projects. Elevate your innovations with ST's commitment to quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures lightweight and durable packaging, making it suitable for various applications.

Surface Mount: YES

Surface mount compatibility facilitates easy integration into modern circuit boards, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape helps optimize board space utilization, allowing for more compact designs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster read and write speeds, improving overall performance.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V is ideal for low-power applications, making it energy-efficient.

Power Supplies (V): 2.5/5

Dual supply options (2.5V and 5V) offer flexibility for integration into various systems.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connectivity for a range of applications without excessive complexity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact design is perfect for applications with space constraints, enabling high-density board layouts.

Maximum Operating Temperature: 85 °C

Rated for high operating temperatures, this EEPROM is suitable for industrial environments that experience heat.

Organization: 256X8

The 256X8 memory organization allows for flexible data storage options while maintaining compact structure.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, it is suitable for applications in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin-lead termination provides excellent solderability and corrosion resistance, ensuring reliability.

I2C Control Byte: 1010DDDR

The I2C control interface allows for simple communication with microcontrollers, streamlining integration.

Terminal Position: DUAL

Dual terminal positioning enhances mounting options, contributing to versatility in design.

Write Protection: HARDWARE/SOFTWARE

The dual write protection options help safeguard data integrity, crucial for mission-critical applications.

Maximum Seated Height: 1.2 mm

A low seated height permits use in slim designs, making this EEPROM ideal for compact electronic products.

Maximum Clock Frequency (fCLK): 0.4 MHz

With a maximum clock frequency of 0.4 MHz, the EEPROM supports moderate-speed applications effectively.

Width: 3 mm

Narrow width contributes to space efficiency in applications where board real estate is a premium.

Minimum Supply Voltage (Vsup): 2.2 V

The practical minimum supply voltage allows for flexible power supply options, enhancing compatibility.

Length: 4.4 mm

Compact length aids in space-saving designs, especially in mobile and handheld devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in harsh environments, suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it efficient for various applications.

Parallel or Serial: SERIAL

Serial communication simplifies circuitry and reduces pin count, enhancing design simplicity.

Terminal Form: GULL WING

Gull wing terminals are ideal for surface mount applications, ensuring secure soldering on PCB.

Maximum Supply Current: 2 mA

Low maximum supply current ensures energy efficiency, extending battery life in portable applications.

No. of Words: 256 words

With 256 words capacity, it provides sufficient memory for moderate data storage needs.

Memory Width: 8

An 8-bit memory width enables efficient data handling while keeping complexity manageable.

Minimum Data Retention Time: 40 years

Exceptional data retention ensures long-term reliability, crucial for data-preserving applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is compatible with many modern surface mount designs, facilitating ease of use.

No. of Words Code: 256

A codable capacity of 256 words allows for adaptable storage solutions in various applications.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a maximum of 5.5V enables compatibility with a variety of systems and reduces design constraints.

Endurance: 1000000 Write/Erase Cycles

High endurance supports frequent data updates, making it suitable for applications requiring extensive write operations.

Serial Bus Type: I2C

Using the I2C serial bus type enhances interoperability with various devices, simplifying system design.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time ensures quick data updates, improving system responsiveness and overall performance.

Memory Density: 2048 bit

With a density of 2048 bits, it strikes a balance between size and storage capacity, ideal for various applications.

Memory IC Type: EEPROM

EEPROM technology provides non-volatile memory, ensuring data retention even without power.

Maximum Standby Current: 0.0000005 Amp

The ultra-low standby current enhances battery life in portable applications, promoting energy efficiency.

Technical Specifications

EEPROM M34C02-LDW6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34C02-LDW6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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