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M29F800DB70N6E

STMicroelectronics

M29F800DB70N6E by STMicroelectronics

M29F800DB70N6E from STMicroelectronics is a 5V NOR Flash memory with a density of 8Mbit and an access time of 70ns. It features a compact SOIC package, operates in -40 °C to 85°C range, and supports asynchronous mode for industrial applications. Ideal for embedded systems requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Semi Source

USA . 17,176 parts In-Stock

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Vyrian

USA . 5,209 parts In-Stock

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Digiode

USA . 2,639 parts In-Stock

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Anansix

USA . 2,138 parts In-Stock

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Sternenhof Electronics

Switzerland . 1,152 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 799 parts In-Stock

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$2.334

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-

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$2.101

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799

$2.334

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$2.101

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MKK Technologies

India . 1,859 parts In-Stock

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$4.389

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$4.389

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DigiPath Technology Company

USA . 1,859 parts In-Stock

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$4.389

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1,859

$4.389

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AZTECH Wire

Italy . 847 parts In-Stock

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$12.570

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847

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Component Stockers USA

USA . 618 parts In-Stock

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$99.990

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Corphita

USA . 3,781 parts In-Stock

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Parana Technologies

USA . 2,155 parts In-Stock

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$2.791

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Kepictronics

USA . 317 parts In-Stock

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Microchip USA

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Overview

Unlock unparalleled performance with the M29F800DB70N6E flash memory from STMicroelectronics. Renowned for their commitment to innovation and quality, STMicroelectronics delivers this robust NOR-type memory solution perfect for a multitude of applications—from automotive systems to consumer electronics. Enjoy enhanced reliability and efficiency with its compact design and industrial-grade temperature range, ensuring your projects benefit from long-lasting durability and rapid access times. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, ensuring a reliable performance in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling higher circuit density and improved performance in modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for PCB layout, maximizing space utilization and simplifying manufacturing.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enhances speed and flexibility in data access, making it suitable for fast data retrieval applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply is compatible with a wide range of systems, simplifying integration with existing designs.

Power Supplies (V): 5

5V power supply ensures stable performance, minimizing the risk of voltage-related failures during operation.

No. of Terminals: 48

Having 48 terminals allows for comprehensive interfacing options and improved data handling capabilities in applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline, thin profile design saves space on the PCB while maintaining high performance, ideal for compact electronic devices.

Alternate Memory Width: 8

The 8-bit memory width supports versatile data handling requirements in various embedded systems.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Organization: 512KX16

The 512Kx16 organization offers ample storage capacity for a diverse range of applications, balancing performance and density.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for use in extreme conditions, ensuring consistent performance.

No. of Sectors/Size: 1, 2, 1, 15

The sector organization provides flexibility in memory management, allowing for efficient data writing and erasing capabilities.

Terminal Finish: TIN BISMUTH

Tin bismuth finish enhances solderability, improving reliability in connections and extending the lifespan of the product.

Terminal Position: DUAL

Dual terminal positioning aids in the stable mounting of the component on PCBs, enhancing mechanical strength.

Maximum Seated Height: 1.2 mm

A low seated height allows for easy integration into space-constrained designs without sacrificing performance.

Width: 12 mm

The compact width of 12mm makes it suitable for various applications where space is a premium.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V enables operation in a range of environments, ensuring flexibility in design.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, promoting longevity.

Type: NOR TYPE

NOR type architecture allows for fast random access times, making it ideal for code storage and execution.

Common Flash Interface: YES

A common flash interface simplifies integration with existing designs, ensuring compatibility with various controllers.

Length: 18.4 mm

The length of 18.4 mm assists in fitting within compact layouts while maintaining a high performance.

Programming Voltage (V): 5

With a programming voltage of 5V, it simplifies the interfacing and operation within conventional systems.

Temperature Grade: INDUSTRIAL

Rated as an industrial-grade component ensures robust performance in demanding environments and applications.

Technology: CMOS

CMOS technology minimizes power consumption while providing high-density memory, enhancing overall efficiency.

Parallel or Serial: PARALLEL

The parallel interface allows for faster data transfers compared to serial configurations, optimizing performance.

Terminal Form: GULL WING

Gull wing terminals facilitate efficient soldering and provide mechanical stability on the PCB.

Sector Size (Words): 16K, 8K, 32K, 64K

Various sector sizes offer flexibility in memory management, allowing tailored configurations based on application needs.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA allows for efficient power usage in low-power applications.

No. of Words: 524288 words

The generous word count provides significant storage capacity while ensuring efficient data management.

Toggle Bit: YES

Toggle bit capability supports data integrity checks, enhancing reliability in critical applications.

Memory Width: 16

The 16-bit memory width allows for optimized data handling and compatibility with various processors.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch facilitates compact designs while ensuring stable connections on printed circuit boards.

No. of Words Code: 512K

The 512K word capacity is suitable for a broad array of applications, providing ample storage and execution space.

Command User Interface: YES

A command user interface improves user-friendliness, simplifying control and operations for developers.

Ready or Busy: YES

The ready or busy indication enhances data transfer reliability by notifying the system of the device's status.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for safe operation under voltage variations, ensuring product longevity.

Boot Block: BOTTOM

Bottom boot block positioning is ideal for firmware storage, allowing for easy system recovery and upgrade.

Memory Density: 8388608 bit

With a memory density of 8388608 bits, this product supports dense data storage needs, catering to complex applications.

Memory IC Type: FLASH

As a flash memory IC, it provides fast erase and write cycles, making it suitable for non-volatile data storage.

Maximum Standby Current: 0.00015 Amp

The low maximum standby current minimizes power draw in idle conditions, making it suitable for battery-powered devices.

Maximum Access Time: 70 ns

A maximum access time of 70 ns enables rapid data retrieval, critical for performance-sensitive applications.

Data Polling: YES

Data polling capability allows the system to monitor the memory operation efficiently, enhancing data integrity.

Technical Specifications

Flash Memory M29F800DB70N6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e6

Length:

18.4 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,15

No. of Terminals:

48

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.00015 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29F800DB70N6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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