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HCF4099M013TR

STMicroelectronics

HCF4099M013TR by STMicroelectronics

HCF4099M013TR by STMicroelectronics is a CMOS latch with a 400 ns propagation delay, operating b/w 3-20 V. It features a compact SO package and operates in extreme temperatures from -55 °C to 125 °C. Ideal for military applications requiring reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,865 parts In-Stock

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LWI Electronics Inc

India . 4,930 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,200 parts In-Stock

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Anansix

USA . 2,071 parts In-Stock

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2,071

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Digiode

USA . 325 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 102 parts In-Stock

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IDEA Electronic Components Group

UK . 1,792 parts In-Stock

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$16.002

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-

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$14.401

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$16.002

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$14.401

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Ampacity Inc.

Singapore . 858 parts In-Stock

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$18.000

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858

$18.000

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AZTECH Wire

Italy . 530 parts In-Stock

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$21.750

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530

$21.750

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MKK Technologies

India . 316 parts In-Stock

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$30.090

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$30.090

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DigiPath Technology Company

USA . 316 parts In-Stock

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$30.090

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Component Stockers USA

USA . 573 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 9,583 parts In-Stock

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Kepictronics

USA . 7,700 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,409 parts In-Stock

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Microchip USA

USA . 5,270 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,939 parts In-Stock

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Northwest PG Solutions

USA . 1,154 parts In-Stock

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Native Components

USA . 956 parts In-Stock

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Corphita

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Parana Technologies

USA . 205 parts In-Stock

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$19.132

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Overview

Elevate your designs with the HCF4099M013TR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile latch and flip-flop device combines reliability with advanced performance, perfectly suited for military applications and demanding environments. Designed for efficient surface mount technology, it ensures seamless integration while offering exceptional durability and stability. Trust in STMicroelectronics for unmatched quality that drives innovation and enhances your projects' success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection against environmental factors, ensuring reliability in various applications.

Propagation Delay At Nominal Supply: 400 ns

With a propagation delay of 400 ns, this latch/flip-flop ensures quick response times, making it suitable for high-speed data applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration on modern PCBs, saving space and facilitating automated assembly.

Package Shape: RECTANGULAR

The rectangular package shape optimizes PCB space utilization, allowing for more efficient circuit layouts.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard for many digital circuits, making this product versatile for various applications.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF makes this product suitable for moderate signal loads, ensuring stable performance in most electronic circuits.

Power Supplies (V): 5/15

Compatibility with both 5V and 15V supply voltages enhances flexibility across different circuit designs.

No. of Terminals: 16

With 16 terminals, this device can support complex functionalities, making it suitable for a wide range of applications.

Package Style (Meter): SMALL OUTLINE

A small outline package style saves space on the PCB, allowing for more compact designs.

Maximum Operating Temperature: 125 °C

Operating at temperatures up to 125 °C makes this flip-flop suitable for high-temperature environments, enhancing its reliability.

Trigger Type: LOW LEVEL

The low-level trigger type provides robust operation in a variety of logic systems, improving design flexibility.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this device is ideal for extreme environments, ensuring performance under harsh conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This premium terminal finish improves solderability and ensures reliable connections, enhancing the product's longevity.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, enhancing design flexibility.

Maximum Seated Height: 1.75 mm

A low seated height simplifies placement on the PCB, contributing to a sleek design.

Width: 3.9 mm

A compact width of 3.9 mm ensures that the device fits well in tight spaces on the PCB.

Output Polarity: TRUE

The true output polarity aligns with standard logic levels, ensuring compatibility with most digital circuits.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V extends the range of suitable applications for low-power designs.

Maximum Time At Peak Reflow Temperature: 30 s

The capability of withstanding a peak reflow temperature for up to 30 seconds is advantageous during PCB assembly.

Peak Reflow Temperature: 260 °C

Handling peak reflow temperatures of 260 °C ensures the device can survive high-temperature soldering processes.

Length: 9.9 mm

A length of 9.9 mm allows for easy integration into a wide range of devices while maintaining a compact form factor.

Temperature Grade: MILITARY

MILITARY temperature grade indicates that this product is built to endure harsh conditions, suitable for defense and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this device efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals enhance the ease of soldering, improving manufacturing efficiency and connection reliability.

Packing Method: TR

Tape and reel (TR) packing method facilitates automated assembly processes, making it ideal for high-volume production.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between density and accessibility for soldering.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, it requires standard precautions for handling, making it reliable and safe for storage.

Maximum Supply Voltage (Vsup): 20 V

A maximum supply voltage of 20V allows for versatility in various circuit applications, accommodating different operational scenarios.

Technical Specifications

Latches & Flip-Flops HCF4099M013TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

HCF4099M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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