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HCF4071BEY

STMicroelectronics

HCF4071BEY by STMicroelectronics

HCF4071BEY by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 3-20V, with a propagation delay of 350ns. Ideal for military-grade applications requiring high-speed signal processing in harsh environments.

Median Price

$6.150

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 20 parts In-Stock

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$6.150

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$4.620

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$4.000

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$4.000

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Vyrian

USA . 4,813 parts In-Stock

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Digiode

USA . 3,370 parts In-Stock

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Anansix

USA . 859 parts In-Stock

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Bristol Electronics

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599

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ACDS - Activité Composants Distribution Service

France . 423 parts In-Stock

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Pegasus Components GmbH

Germany . 21 parts In-Stock

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Inland Empire Components Inc.

USA . 21 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 416 parts In-Stock

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$1.547

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416

$1.547

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AZTECH Wire

Italy . 619 parts In-Stock

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$11.130

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619

$11.130

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IDEA Electronic Components Group

UK . 77 parts In-Stock

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$21.148

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$19.033

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77

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MKK Technologies

India . 379 parts In-Stock

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$39.768

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DigiPath Technology Company

USA . 379 parts In-Stock

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$39.768

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,942 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,961 parts In-Stock

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Northwest PG Solutions

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Authorized Procurement Solutions

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Parana Technologies

USA . 1,382 parts In-Stock

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Corphita

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Perfect Parts

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Glotronic Ltd.

UK . 338 parts In-Stock

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Native Components

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Cyclops Electronics Ltd (Excess)

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Overview

Enhance your electronic projects with the high-quality HCF4071BEY logic gates from STMicroelectronics. With a focus on reliability and innovation, STMicroelectronics is a trusted manufacturer in the industry. These logic gates are versatile and ideal for a wide range of applications. Experience the value and benefits of using this product, whether you are a hobbyist or a professional. Upgrade your circuits with the HCF4071BEY for improved performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 350 ns

The low propagation delay ensures fast signal processing, making the logic gates suitable for high-speed applications.

No. of Functions: 4

With 4 functions in a single package, this product offers versatility and compact design for space-saving solutions.

No. of Inputs: 2

Having 2 inputs enables the logic gates to perform various logical operations effectively, making them versatile in different circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, these logic gates are compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient signal transmission and reception within the circuit, reducing the risk of signal distortion.

Power Supplies (V): 5/15

Supporting dual power supply options of 5V and 15V, these logic gates can be used in different types of circuits without compatibility issues.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, these logic gates can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the logic gates to function reliably in cold environments or during temperature fluctuations.

Technology: CMOS

Based on CMOS technology, these logic gates consume low power and offer high noise immunity, making them energy-efficient and reliable for long-term use.

Technical Specifications

Logic Gates HCF4071BEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4071BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-241-8649, 5962012418649

NIIN

012418649

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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