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HCF40106BM1

STMicroelectronics

HCF40106BM1 by STMicroelectronics

STMicroelectronics HCF40106BM1 logic gates have 6 functions with a propagation delay of 280 ns at 5V. It operates in a temperature range of -55 to 125 °C and supports Schmitt Trigger technology. Ideal for military-grade applications requiring CMOS technology and a small outline package style.

Median Price

$0.575

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 16 parts In-Stock

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$0.150

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Ace Electronics

USA . 1,734 parts In-Stock

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$1.000

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ComSIT Distribution GmbH

Germany . 16,161 parts In-Stock

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QIE Inc.

USA . 1,925 parts In-Stock

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Anansix

USA . 1,856 parts In-Stock

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Digiode

USA . 1,311 parts In-Stock

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Vyrian

USA . 594 parts In-Stock

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First Choice Components Inc.

USA . 200 parts In-Stock

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200

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Sogenti Electronics

Canada . 169 parts In-Stock

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Ashlea Components Ltd

UK . 131 parts In-Stock

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MISTER SPROCKETS

USA . 50 parts In-Stock

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50

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ACDS - Activité Composants Distribution Service

France . 14 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,414 parts In-Stock

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$0.150

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$0.147

6,414

$0.150

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$0.147

Argo Parts USA

USA . 3,766 parts In-Stock

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$0.150

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$0.146

3,766

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Netroflash

USA . 1,000 parts In-Stock

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$0.150

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$0.143

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$0.140

1,000

$0.150

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$0.143

$0.140

AZTECH Wire

Italy . 594 parts In-Stock

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$8.475

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594

$8.475

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Aztec Data Supply Inc.

USA . 3,922 parts In-Stock

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$8.679

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$8.679

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

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$21.393

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$19.253

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Corohmni

South Africa . 422 parts In-Stock

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$23.388

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422

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MKK Technologies

India . 1,976 parts In-Stock

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$40.228

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DigiPath Technology Company

USA . 1,976 parts In-Stock

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$40.228

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Semicontronic

India . 229 parts In-Stock

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$49.000

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$47.775

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$47.530

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229

$49.000

$47.775

$47.530

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Ampacity Inc.

Singapore . 227 parts In-Stock

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$64.000

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Lixinc

USA . 12,953 parts In-Stock

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Corphita

USA . 4,617 parts In-Stock

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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Parana Technologies

USA . 1,118 parts In-Stock

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$25.578

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Kepictronics

USA . 555 parts In-Stock

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Perfect Parts

USA . 479 parts In-Stock

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Assy Fe

Spain . 15 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 14 parts In-Stock

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Overview

Discover the high-quality HCF40106BM1 logic gates by STMicroelectronics, designed to provide reliable performance in a variety of applications. With a focus on value and efficiency, this product offers customers fast propagation delays, low power consumption, and a wide operating temperature range. Whether you're working on military-grade projects or industrial applications, the HCF40106BM1 is the perfect choice for your logic gate needs. Trust in STMicroelectronics for cutting-edge technology and superior products that deliver results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 280 ns

Low propagation delay ensures fast response times in logic operations, making this product suitable for high-speed applications.

Surface Mount: YES

Easy to mount on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, making it compatible with a wide range of systems.

Package Shape: RECTANGULAR

Compact design allows for efficient use of space on the PCB.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates HCF40106BM1 attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF40106BM1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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