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HCF40106BEY

STMicroelectronics

HCF40106BEY by STMicroelectronics

HCF40106BEY by STMicroelectronics is a CMOS logic gate with 6 functions, 280 ns propagation delay at 5V. It operates in temperature range -55 to 125 °C and has Schmitt Trigger feature. Widely used in military applications due to MILITARY grade and through-hole terminal form.

Median Price

$0.151

Lifecycle Status

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14

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Nova Conductors

Japan . 61 parts In-Stock

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Vyrian

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Digiode

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Semtec, LLC

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Anansix

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LIBRA Elektronik GmbH

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Bristol Electronics

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Atlantic Semiconductor

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ComSIT Distribution GmbH

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Carlin Systems, Inc.

USA . 60 parts In-Stock

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Manotoh

Italy . 25 parts In-Stock

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Resion

USA . 16 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Argo Parts USA

USA . 1,590 parts In-Stock

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Continental Prestige Electronics

USA . 554 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Microchip USA

USA . 316 parts In-Stock

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$6.871

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AZTECH Wire

Italy . 672 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,630 parts In-Stock

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Corohmni

South Africa . 1,242 parts In-Stock

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Ampacity Inc.

Singapore . 1,241 parts In-Stock

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IDEA Electronic Components Group

UK . 2,310 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Semicontronic

India . 636 parts In-Stock

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MKK Technologies

India . 397 parts In-Stock

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DigiPath Technology Company

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Lixinc

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Perfect Parts

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A-Z Elektronik GmbH

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Parana Technologies

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Cyclops Electronics Ltd (Excess)

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Overview

Looking for high-quality logic gates that offer reliable performance and versatility? Look no further than the HCF40106BEY by STMicroelectronics. With a reputation for excellence in semiconductor manufacturing, STMicroelectronics delivers top-notch products like this one, which boasts six functions in a compact rectangular package. Ideal for a wide range of applications, this logic gate operates at a nominal supply voltage of 5V and features a propagation delay of 280ns. Trust STMicroelectronics to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the HCF40106BEY today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 280 ns

Fast propagation delay ensures quick response time in processing signals.

No. of Functions: 6

Capable of performing multiple logic functions, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient performance and signal processing.

Power Supplies (V): 5/15

Compatible with different power supply voltages, offering flexibility in usage.

No. of Terminals: 14

Sufficient number of terminals for connecting to external components or circuits.

Schmitt Trigger: YES

Incorporation of Schmitt trigger ensures noise immunity and stable output signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient operation.

Maximum Supply Voltage (Vsup): 20 V

Can safely handle high supply voltages for increased robustness and versatility.

Technical Specifications

Logic Gates HCF40106BEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF40106BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-469-6021, 5962144696021

NIIN

144696021

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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