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HCF4007UBEY

STMicroelectronics

HCF4007UBEY by STMicroelectronics

HCF4007UBEY by STMicroelectronics is a logic gate with 3 functions. It operates at a nominal voltage of 5V and has a propagation delay of 110ns. This CMOS technology device is commonly used in military applications due to its temperature grade and through-hole terminal form.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,580 parts In-Stock

1+ parts

$0.300

100+ parts

$0.160

1k+ parts

$0.133

10k+ parts

-

1,580

$0.300

$0.160

$0.133

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Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.234

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200

$0.234

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Digiode

USA . 408 parts In-Stock

1+ parts

$0.627

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408

$0.627

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ComSIT Distribution GmbH

Germany . 2,650 parts In-Stock

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R&J Components

USA . 2,000 parts In-Stock

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Vyrian

USA . 1,381 parts In-Stock

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1,381

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Anansix

USA . 1,162 parts In-Stock

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Zilex Electronics Inc.

Canada . 100 parts In-Stock

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100

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Connector Distribution Corp

USA . 47 parts In-Stock

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47

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Right Parts Inc.

USA . 47 parts In-Stock

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47

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Distributors (Availability)

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Argo Parts USA

USA . 4,914 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

$0.227

4,914

$0.234

-

-

$0.227

Continental Prestige Electronics

USA . 2,049 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

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10k+ parts

$0.229

2,049

$0.234

-

-

$0.229

Ampacity Inc.

Singapore . 1,196 parts In-Stock

1+ parts

$0.560

100+ parts

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1,196

$0.560

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Semicontronic

India . 1,144 parts In-Stock

1+ parts

$0.560

100+ parts

$0.546

1k+ parts

$0.543

10k+ parts

-

1,144

$0.560

$0.546

$0.543

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Corphita

USA . 251 parts In-Stock

1+ parts

$0.594

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251

$0.594

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

1+ parts

$23.903

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$21.513

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1,756

$23.903

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$21.513

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Corohmni

South Africa . 121 parts In-Stock

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$32.744

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121

$32.744

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Aztec Data Supply Inc.

USA . 1,460 parts In-Stock

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$32.895

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1,460

$32.895

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MKK Technologies

India . 888 parts In-Stock

1+ parts

$44.949

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888

$44.949

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DigiPath Technology Company

USA . 888 parts In-Stock

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$44.949

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888

$44.949

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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Kepictronics

USA . 20,000 parts In-Stock

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Perfect Parts

USA . 11,894 parts In-Stock

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Lixinc

USA . 10,028 parts In-Stock

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Microchip USA

USA . 7,464 parts In-Stock

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Assy Fe

Spain . 4,825 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,047 parts In-Stock

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3,047

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Parana Technologies

USA . 1,912 parts In-Stock

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$28.580

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1,912

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$28.580

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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Netroflash

USA . 500 parts In-Stock

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$0.229

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$0.222

10k+ parts

$0.218

500

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$0.229

$0.222

$0.218

Overview

Discover the HCF4007UBEY by STMicroelectronics, a high-quality logic gate that offers exceptional performance and reliability. With its advanced technology and military-grade temperature grade, this product is designed to meet the most demanding applications. Whether you need precise signal processing or efficient power management, this versatile logic gate is your solution. Its compact size and durable package make it easy to integrate into your designs. Trust in STMicroelectronics' expertise and choose the HCF4007UBEY for all your logic gate needs. Experience the value, benefits, and advantages this product brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and reduces the risk of damage during installation or transportation, making it a reliable choice.

No. of Functions: 3

With three functions, this logic gate product offers versatility and the ability to handle multiple inputs or outputs, increasing its usefulness in various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit boards and other devices, providing convenience during assembly and ensuring a compact design.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this logic gate is compatible with commonly used voltage levels, making it suitable for a wide range of electronic circuits and systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures efficient signal propagation and stability in high-frequency applications, enhancing the overall performance of this logic gate.

Power Supplies (V): 3/15

Supporting power supplies of 3V and 15V, this logic gate can be seamlessly integrated into diverse electronic setups, offering flexibility in power source compatibility.

No. of Terminals: 14

With 14 terminals, this logic gate allows for easy connection to other components or circuits, enabling efficient signal transfer and customization options.

Package Style (Meter): IN-LINE

The in-line package style simplifies the installation process, making it easy to incorporate this logic gate into existing systems or circuits seamlessly.

Propagation Delay (tpd): 110 ns

With a propagation delay of 110 ns, this logic gate ensures fast and efficient signal processing, reducing latency and enhancing overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables this logic gate to withstand harsh environmental conditions, making it suitable for demanding applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this logic gate remains functional even in extreme cold conditions, ensuring reliable performance in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, guaranteeing reliable and long-lasting connections for this logic gate.

Terminal Position: DUAL

The dual terminal position provides versatility in installation and connection options, allowing for different orientation possibilities and easing the integration of this logic gate into circuits.

Maximum Seated Height: 5.1 mm

With a maximum seated height of 5.1 mm, this logic gate boasts a compact design, enabling space-saving installations and enhancing overall system density.

Width: 7.62 mm

The width of 7.62 mm ensures compatibility with standard board spacing and makes it easy to integrate this logic gate into various electronic designs.

Minimum Supply Voltage (Vsup): 3V

The minimum supply voltage of 3V allows for low-power applications, making this logic gate suitable for energy-efficient electronic systems.

Temperature Grade: MILITARY

With a temperature grade of "MILITARY," this logic gate meets rigorous military standards, ensuring reliability and robust performance in extreme conditions.

Technology: CMOS

Utilizing CMOS technology, this logic gate offers low power consumption and high noise immunity, making it an optimal choice for a wide range of electronic applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and convenient soldering, ensuring reliable connections and ease of assembly during production and maintenance.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this logic gate is compatible with widely used connectors and circuit board layouts, providing easy integration and interchangeability.

Maximum Supply Voltage (Vsup): 20V

The maximum supply voltage of 20V allows for robust operation and compatibility with higher voltage systems, making this logic gate suitable for a variety of applications.

Technical Specifications

Logic Gates HCF4007UBEY attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Additional Features:

DUAL COMPLEMENTARY PAIR PLUS INVERTER

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/15

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4007UBEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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