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HCF4093BM1

STMicroelectronics

HCF4093BM1 by STMicroelectronics

HCF4093BM1 by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage range of 3-20V, with a propagation delay of 380ns. Ideal for military-grade applications requiring Schmitt trigger functionality in small outline packages.

Median Price

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15

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1k+

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Digiode

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ComSIT Distribution GmbH

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Anansix

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Electronic Expediters

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Vyrian

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Pegasus Components GmbH

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Corel Iberica Componentes, S.L.

Spain . 100 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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Fibra_Brandt Electronic GMBH

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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ABC Electronics Ltd.

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Elcom Components

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LIBRA Elektronik GmbH

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LittleDiode

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Holdelec - ElecDif-Pro

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Corohmni

South Africa . 168 parts In-Stock

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$8.371

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Ampacity Inc.

Singapore . 1,576 parts In-Stock

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$12.000

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Aztec Data Supply Inc.

USA . 1,239 parts In-Stock

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$12.900

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AZTECH Wire

Italy . 568 parts In-Stock

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Semicontronic

India . 708 parts In-Stock

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IDEA Electronic Components Group

UK . 2,191 parts In-Stock

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MKK Technologies

India . 1,747 parts In-Stock

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DigiPath Technology Company

USA . 1,747 parts In-Stock

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Argo Parts USA

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Corphita

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Alle Elektronik GmbH

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Parana Technologies

USA . 1,606 parts In-Stock

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Lixinc

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Glotronic Ltd.

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Cyclops Electronics Ltd (Excess)

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Bastille Electronics

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Overview

Enhance your electronic designs with the reliable HCF4093BM1 logic gates by STMicroelectronics. Crafted with precision and quality, this product boasts a multitude of applications in various industries. With its advanced technology and Schmitt trigger feature, the HCF4093BM1 ensures optimal performance and efficiency. Experience seamless functionality and dependable results with this versatile component. Upgrade your projects today and unlock endless possibilities with the STMicroelectronics HCF4093BM1.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This durable material ensures a long-lasting and reliable product.

Propagation Delay At Nominal Supply

380 ns - With a low propagation delay, this product ensures speedy signal transmission.

Surface Mount

YES - The surface mount design allows for easy and convenient installation.

No. of Functions

4 - With multiple functions, this product offers versatility and flexibility.

No. of Inputs

2 - The dual inputs allow for more complex logic operations to be performed.

Package Shape

RECTANGULAR - The compact rectangular shape makes this product space-efficient.

Nominal Supply Voltage / Vsup (V)

5 - Compatible with a common supply voltage, ensuring easy integration into existing systems.

Load Capacitance (CL)

50 pF - The low load capacitance minimizes signal distortion and improves performance.

Power Supplies (V)

5/15 - Compatible with multiple power supplies, offering flexibility in usage.

No. of Terminals

14 - With multiple terminals, this product can accommodate various connections and configurations.

Package Style (Meter)

SMALL OUTLINE - The small outline design saves space and allows for dense circuit layouts.

Propagation Delay (tpd)

380 ns - Low propagation delay ensures quick response times in logic operations.

Maximum Operating Temperature

125 °C - Able to withstand high temperatures, making it suitable for a variety of environments.

Minimum Operating Temperature

55 °C - Can operate in extreme cold temperatures without performance issues.

Terminal Finish

NICKEL PALLADIUM GOLD - The high-quality terminal finish ensures reliable connections and longevity.

Terminal Position

DUAL - Dual terminal position allows for versatile placement and installation options.

Maximum Seated Height

1.75 mm - The low seated height allows for compact PCB designs.

Width

3.9 mm - The slim width makes this product ideal for applications with space constraints.

Minimum Supply Voltage (Vsup)

3 V - Can operate at low supply voltages, conserving power and extending battery life.

Length

8.65 mm - The moderate length provides a good balance between compactness and accessibility.

Temperature Grade

MILITARY - Designed to meet military-grade specifications for durability and reliability.

Schmitt Trigger

YES - The Schmitt trigger feature ensures clean and reliable signal processing.

Technology

CMOS - Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form

GULL WING - The gull wing terminal form offers secure soldering and easy PCB mounting.

Packing Method

TUBE - Packaged in a tube for protection and easy handling during transportation and storage.

Terminal Pitch

1.27 mm - The standard terminal pitch allows for easy PCB layout and compatibility with existing designs.

Maximum Supply Voltage (Vsup)

20 V - Can handle high supply voltages, making it versatile for a wide range of applications.

Technical Specifications

Logic Gates HCF4093BM1 attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

380 ns

Propagation Delay (tpd):

380 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF4093BM1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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