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HCF4001BC1

STMicroelectronics

HCF4001BC1 by STMicroelectronics

HCF4001BC1 by STMicroelectronics is a CMOS logic gate with 4 functions and 2 inputs. It has a propagation delay of 250 ns at 5V, suitable for industrial applications. This chip carrier package features matte tin finish, operates b/w -40 to 85 °C, and supports surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,600 parts In-Stock

1+ parts

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2,600

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Anansix

USA . 1,843 parts In-Stock

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1,843

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Digiode

USA . 1,090 parts In-Stock

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1,090

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 111 parts In-Stock

1+ parts

$24.942

100+ parts

-

1k+ parts

$22.448

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111

$24.942

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$22.448

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MKK Technologies

India . 1,601 parts In-Stock

1+ parts

$46.902

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1,601

$46.902

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DigiPath Technology Company

USA . 1,601 parts In-Stock

1+ parts

$46.902

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1,601

$46.902

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Parana Technologies

USA . 2,150 parts In-Stock

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$29.822

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2,150

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$29.822

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Corphita

USA . 1,878 parts In-Stock

1+ parts

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1,878

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Native Components

USA . 803 parts In-Stock

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803

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Northwest PG Solutions

USA . 673 parts In-Stock

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673

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Overview

Discover the ultimate solution for your logic gate needs with the HCF4001BC1 by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics offers a wide range of applications in the logic gates category. This versatile chip carrier package provides 4 functions and 2 inputs, making it ideal for a variety of projects. With a nominal supply voltage of 5V and fast propagation delay of 250ns, this product guarantees efficient performance. Elevate your designs with the HCF4001BC1 and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and cost-effective.

Propagation Delay At Nominal Supply: 250 ns

The low propagation delay ensures quick signal processing, making this product efficient for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving time and effort in assembly.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional components, saving space and cost in the overall design.

No. of Inputs: 2

Having multiple inputs allows for more complex logic operations to be performed, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with other components in a circuit easier and more compatible.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in calculating the overall power consumption and stability of the circuit when connected to external devices.

Power Supplies (V): 3/15

Supporting a range of power supply voltages makes this product adaptable to different environments and power sources.

No. of Terminals: 20

Having a sufficient number of terminals allows for easy connection to other components and peripherals in a circuit.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor, making it suitable for use in space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables this product to be used in a wide range of temperature conditions without risking performance or damage.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and oxidation resistance for a reliable electrical connection.

Terminal Position: QUAD

The quad terminal position offers easy access to all the terminals for efficient testing, troubleshooting, and connection in a circuit.

Maximum Seated Height: 4.57 mm

The low seated height of the package allows for a slim and compact design, making it suitable for use in portable or space-constrained devices.

Width: 8.965 mm

The specified width provides a standard size for easy integration with other components and fitting into standard PCB layouts.

Minimum Supply Voltage (Vsup): 3 V

Supporting a low minimum supply voltage allows for operation in low-power applications and extends the product's versatility.

Length: 8.965 mm

The specified length provides a standard size for easy integration with other components and fitting into standard PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making this product energy-efficient and reliable.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and provides mechanical stability for the connections, ensuring a secure and reliable connection.

Terminal Pitch: 1.27 mm

The specified terminal pitch provides a standard spacing for easy soldering and connection to other components on a PCB.

Maximum Supply Voltage (Vsup): 15 V

Supporting a high maximum supply voltage ensures compatibility with a wide range of power sources and applications, enhancing the product's versatility.

Technical Specifications

Logic Gates HCF4001BC1 attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

HCF4001BC1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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