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HCF4002BM1

STMicroelectronics

HCF4002BM1 by STMicroelectronics

HCF4002BM1 by STMicroelectronics is a CMOS Logic Gates IC with 4 inputs, 2 functions, and a propagation delay of 200 ns at 5V. It operates in temperatures ranging from -55 to 125 °C and has a small outline package suitable for military-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 3,744 parts In-Stock

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Anansix

USA . 1,964 parts In-Stock

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Vyrian

USA . 1,727 parts In-Stock

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ComSIT Distribution GmbH

Germany . 450 parts In-Stock

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450

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IDEA Electronic Components Group

UK . 2,029 parts In-Stock

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$29.832

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$26.849

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2,029

$29.832

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$26.849

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MKK Technologies

India . 2,083 parts In-Stock

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$56.097

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DigiPath Technology Company

USA . 2,083 parts In-Stock

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$56.097

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$56.097

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Corphita

USA . 4,262 parts In-Stock

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Northwest PG Solutions

USA . 1,587 parts In-Stock

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Native Components

USA . 430 parts In-Stock

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Parana Technologies

USA . 148 parts In-Stock

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$35.669

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Overview

Discover the HCF4002BM1 by STMicroelectronics, a top-quality logic gate that offers unparalleled performance and reliability. Manufactured by industry leader STMicroelectronics, this product is perfect for a wide range of applications, from industrial automation to consumer electronics. With its advanced technology and innovative design, the HCF4002BM1 provides customers with the value they deserve, delivering fast propagation delay, high precision, and exceptional durability. Upgrade your projects today with the HCF4002BM1 and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight, ideal for portable electronic devices.

Propagation Delay At Nominal Supply: 200 ns

Low propagation delay ensures quick response time in signal processing.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto printed circuit boards.

No. of Functions: 2

Having 2 functions in one component saves space and simplifies circuit design.

No. of Inputs: 4

4 input capability provides flexibility for various logic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V supply voltage is common and easily attainable in many electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps in reducing signal distortion and improving high-frequency performance.

Power Supplies (V): 5/15

Supporting multiple power supply voltages (5V/15V) allows for versatile compatibility with different systems.

No. of Terminals: 14

Having 14 terminals enables connectivity with other components and peripherals for complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand elevated temperatures in various environments.

Minimum Operating Temperature: -55 °C

Operating at a minimum temperature of -55 °C ensures functionality in cold climates or environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and component placement.

Maximum Seated Height: 1.75 mm

Low seated height of 1.75 mm allows for slim and compact circuit designs.

Width: 3.9 mm

Narrow width of 3.9 mm saves space on the PCB.

Minimum Supply Voltage (Vsup): 3 V

Supporting a minimum supply voltage of 3V enables operation in lower power applications.

Length: 8.65 mm

Compact length of 8.65 mm contributes to overall space-saving design.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting onto PCBs.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm allows for compatibility with common PCB layouts and connectors.

Maximum Supply Voltage (Vsup): 20 V

Supporting a maximum supply voltage of 20V provides flexibility for use in a wide range of applications.

Technical Specifications

Logic Gates HCF4002BM1 attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

200 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF4002BM1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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