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BUF420

STMicroelectronics

BUF420 by STMicroelectronics

BUF420 by STMicroelectronics is an NPN power BJT designed for switching applications. It features a max VCEsat of 2V, supports up to 30A collector current, and operates at temperatures up to 150 °C. Ideal for high-power circuits with a compact flange mount design.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,741 parts In-Stock

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4,741

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Vyrian

USA . 2,871 parts In-Stock

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Anansix

USA . 640 parts In-Stock

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640

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ACDS - Activité Composants Distribution Service

France . 97 parts In-Stock

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ECAB

Sweden . 7 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 1,220 parts In-Stock

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$1.383

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$1.244

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$1.383

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$1.244

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MKK Technologies

India . 223 parts In-Stock

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$2.600

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DigiPath Technology Company

USA . 223 parts In-Stock

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$2.600

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$2.600

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Northwest PG Solutions

USA . 144 parts In-Stock

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$3.453

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$3.453

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Infinite Electronics LLP (Excess)

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Corphita

USA . 2,452 parts In-Stock

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Native Components

USA . 461 parts In-Stock

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$3.045

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$3.045

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Parana Technologies

USA . 229 parts In-Stock

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$1.653

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$1.653

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Overview

Unleash the power of innovation with the BUF420 by STMicroelectronics—a robust NPN power BJT designed for top-tier switching performance. Renowned for their reliability and quality, STMicroelectronics ensures that every BUF420 meets the highest standards, making it perfect for demanding applications in automotive, industrial, and consumer electronics. With its impressive power handling and durability, this transistor empowers your designs to achieve peak efficiency and longevity. Elevate your projects with a trusted solution that delivers exceptional value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides insulation, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN configuration allows for efficient switching and amplification, making it ideal for many electronic circuits.

Configuration: SINGLE

A single configuration simplifies circuit design and integration into existing systems.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can effectively control power in electronic devices.

Maximum VCEsat: 2 V

A low maximum saturation voltage ensures efficient operation with minimal power loss during switching.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, facilitating easier mounting and connections in circuits.

Terminal Form: THROUGH-HOLE

Through-hole design makes it easy to solder onto PCBs, ensuring a stable connection and reliability.

No. of Terminals: 3

Three terminals allow for versatile circuit configurations, making it adaptable to various electronic designs.

Maximum Power Dissipation (Abs): 200 W

High power dissipation capability allows for handling substantial loads without overheating, ensuring longevity.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure attachment, enhancing mechanical stability in various applications.

Maximum Power Dissipation Ambient: 200 W

Consistency in power dissipation ratings ensures optimal performance under different ambient conditions.

Maximum Operating Temperature: 150 °C

High operating temperature limit makes this transistor suitable for demanding environments without performance degradation.

Maximum Collector-Emitter Voltage: 450 V

A generous voltage rating offers design flexibility for high-voltage applications, increasing its utility.

Transistor Element Material: SILICON

Silicon construction ensures effective performance, reliability, and cost efficiency in electronic applications.

Maximum Collector Current (IC): 30 A

High collector current capability allows it to drive substantial loads, making it suitable for heavy-duty applications.

Maximum Turn Off Time (toff): 3620 ns

Fast turn-off time enhances switching speed, contributing to improved performance in high-frequency applications.

Terminal Position: SINGLE

Single terminal position aids in straightforward installation and integration into existing electronic designs.

Nominal Transition Frequency (fT): 0.1 MHz

A nominal frequency allows for adequate operation in various applications, supporting signal processing needs.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUF420 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

450 V

Configuration:

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

200 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

3620 ns

Maximum VCEsat:

2 V

Trade Compliance

BUF420 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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