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BUF410A

STMicroelectronics

BUF410A by STMicroelectronics

BUF410A by STMicroelectronics is a powerful NPN BJT designed for switching applications. It features a max VCEsat of 2.8V, supports up to 15A collector current, and operates at temperatures up to 150 °C. Ideal for high-power circuits with efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,261 parts In-Stock

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2,261

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Digiode

USA . 1,523 parts In-Stock

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1,523

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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600

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Q Components

USA . 152 parts In-Stock

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152

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ECAB

Sweden . 70 parts In-Stock

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70

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Vyrian

USA . 46 parts In-Stock

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46

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Fibra_Brandt Electronic GMBH

Germany . 37 parts In-Stock

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37

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LIBRA Elektronik GmbH

Germany . 30 parts In-Stock

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30

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ComSIT Distribution GmbH

Germany . 29 parts In-Stock

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Legend Electronics Inc.

USA . 9 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,947 parts In-Stock

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$0.517

100+ parts

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$0.465

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1,947

$0.517

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$0.465

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MKK Technologies

India . 76 parts In-Stock

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$0.972

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76

$0.972

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DigiPath Technology Company

USA . 76 parts In-Stock

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$0.972

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76

$0.972

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Component Stockers USA

USA . 717 parts In-Stock

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$99.990

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717

$99.990

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Corphita

USA . 3,483 parts In-Stock

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3,483

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Northwest PG Solutions

USA . 1,721 parts In-Stock

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$4.483

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Native Components

USA . 903 parts In-Stock

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$4.438

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903

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$4.438

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 465 parts In-Stock

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$0.618

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465

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$0.618

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Assy Fe

Spain . 60 parts In-Stock

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the BUF410A from STMicroelectronics, a trusted leader in high-performance components. This robust NPN power transistor excels in switching applications, delivering impressive efficiency and reliability for diverse projects. With its superior thermal management and ability to handle significant power loads, the BUF410A ensures your systems operate seamlessly. Experience enhanced performance and peace of mind, knowing you have a quality solution backed by ST's legacy of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction is offered with plastic/epoxy materials, ensuring reliability in various applications.

Polarity or Channel Type: NPN

NPN configuration is commonly used for switching and amplification, making this transistor versatile for different applications.

Configuration: SINGLE

Single configuration makes it easy to integrate into simple circuits, reducing complexity for designers.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides effective control in power management.

Maximum VCEsat: 2.8 V

Low saturation voltage ensures higher efficiency and reduced power loss, enhancing overall performance.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and simplifies mounting options.

Terminal Form: THROUGH-HOLE

Through-hole mounting offers robust connections and ease of handling for power applications.

No. of Terminals: 3

Three terminals provide straightforward connections, simplifying circuit design and integration.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability allows the transistor to handle significant loads, suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure and stable positioning in various setups, enhancing reliability.

Maximum Power Dissipation Ambient: 125 W

Maintaining high power dissipation ambient ensures performance consistency in demanding conditions.

Maximum Operating Temperature: 150 °C

High operating temperature range means this transistor can function effectively in harsher environments.

Maximum Collector-Emitter Voltage: 450 V

This high voltage rating allows it to be used in high-voltage applications without risk of breakdown.

Transistor Element Material: SILICON

Silicon material is standard for semiconductor devices, providing good performance characteristics.

Maximum Collector Current (IC): 15 A

Ability to handle significant current rating makes this transistor suitable for a variety of heavy-duty applications.

Maximum Turn Off Time (toff): 3320 ns

Fast turn off time enhances switching efficiency, making it suitable for high-speed applications.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and reliable electrical connections.

Terminal Position: SINGLE

Single terminal position simplifies design and layout in PCB designs.

Nominal Transition Frequency (fT): 0.1 MHz

While lower frequency, this specification suits applications requiring stable switching without high-frequency operation.

Technical Specifications

Power Bipolar Junction Transistors (BJT) BUF410A attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

450 V

Configuration:

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

125 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum Turn Off Time (toff):

3320 ns

Maximum VCEsat:

2.8 V

Trade Compliance

BUF410A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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