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BDV64B

STMicroelectronics

BDV64B by STMicroelectronics

PNP; Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Nominal Transition Frequency (fT): .1 MHz; Maximum Power Dissipation (Abs): 125 W; Maximum Collector Current (IC): 12 A;

Median Price

$1.241

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Rochester

USA . 249 parts In-Stock

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$1.220

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$1.010

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$0.903

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$0.903

Verical

USA . 249 parts In-Stock

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$1.262

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$1.129

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Digiode

USA . 2,077 parts In-Stock

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$0.947

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Bristol Electronics

USA . 50 parts In-Stock

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Vyrian

USA . 6,254 parts In-Stock

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Anansix

USA . 2,327 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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R&J Components

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Digital Electronic Gebert Verwaltungs UG

Germany . 190 parts In-Stock

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ECAB

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Pegasus Components GmbH

Germany . 55 parts In-Stock

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

USA . 50 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 44 parts In-Stock

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PC Components Company LLC

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Halfin

Belgium . 20 parts In-Stock

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Tech-Mark Corp

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Euro-Tech

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Resion

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LWI Electronics Inc

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Pride Electronics

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LittleDiode

UK . 2 parts In-Stock

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GES GmbH

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Distributors (Availability)

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Northwest PG Solutions

USA . 3,260 parts In-Stock

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$0.665

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$0.665

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$0.850

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$0.850

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IDEA Electronic Components Group

UK . 1,294 parts In-Stock

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$0.882

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$0.794

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Corphita

USA . 2,067 parts In-Stock

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$0.897

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Corohmni

South Africa . 224 parts In-Stock

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$0.997

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Component Stockers USA

USA . 5,503 parts In-Stock

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$0.960

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MKK Technologies

India . 1,284 parts In-Stock

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DigiPath Technology Company

USA . 1,284 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,579 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 6,731 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,530 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,020 parts In-Stock

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Problanco Electronics

Mexico . 2,579 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 1,803 parts In-Stock

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SupplyDigital Components

Austria . 1,052 parts In-Stock

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Native Components

USA . 788 parts In-Stock

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Kulean Microsystems

USA . 349 parts In-Stock

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UHIMA Technologies

Türkiye . 344 parts In-Stock

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Technical Specifications

Power Bipolar Junction Transistors (BJT) BDV64B attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

100 V

Minimum DC Current Gain (hFE):

1000

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Maximum Power Dissipation Ambient:

125 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

2 V

Trade Compliance

BDV64B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-12-315-2435, 5961123152435, 5961-01-339-3271, 5961013393271, 5961-99-772-7376, 5961997727376

NIIN

123152435, 013393271, 997727376

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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