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ACST12-7CG

STMicroelectronics

ACST12-7CG by STMicroelectronics

ACST12-7CG by STMicroelectronics is a single TRIAC designed for efficient AC control, featuring a max RMS on-state current of 12 A and repetitive peak off-state voltage of 700 V. It operates in temperatures from -40 °C to 125 °C. Ideal for applications requiring compact surface mount solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,684 parts In-Stock

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3,684

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Digiode

USA . 3,072 parts In-Stock

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3,072

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Anansix

USA . 2,169 parts In-Stock

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2,169

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Distributors (Availability)

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Native Components

USA . 623 parts In-Stock

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$0.123

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-

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-

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$0.118

623

$0.123

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$0.118

Northwest PG Solutions

USA . 1,870 parts In-Stock

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$0.135

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$0.119

1,870

$0.135

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$0.119

IDEA Electronic Components Group

UK . 468 parts In-Stock

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$2.029

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$1.826

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468

$2.029

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$1.826

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MKK Technologies

India . 613 parts In-Stock

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$3.815

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613

$3.815

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DigiPath Technology Company

USA . 613 parts In-Stock

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$3.815

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613

$3.815

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Corohmni

South Africa . 21 parts In-Stock

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$4.852

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21

$4.852

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$5.560

100+ parts

$5.060

1k+ parts

$4.559

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70

$5.560

$5.060

$4.559

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AZTECH Wire

Italy . 891 parts In-Stock

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$11.940

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Corphita

USA . 4,096 parts In-Stock

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Parana Technologies

USA . 1,751 parts In-Stock

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$2.426

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$2.426

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Overview

Elevate your electronic designs with the ACST12-7CG from STMicroelectronics, a leading name in innovation and quality. This compact TRIAC delivers reliable performance for a multitude of applications, from lighting controls to motor drives. With its robust temperature tolerance and low leakage current, you can trust it to perform under demanding conditions. Experience enhanced efficiency and durability, ensuring your projects meet the highest standards without compromise. Choose ACST12-7CG for superior value and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection from moisture and mechanical stress, ensuring reliable performance.

Maximum DC Gate Trigger Current: 35 mA

A higher gate trigger current allows for reliable operation with a variety of control signals, making it versatile for different applications.

Configuration: SINGLE

A single configuration simplifies integration into circuits and helps to reduce overall system complexity.

Surface Mount: YES

Surface mount capability enables compact assembly on PCBs, saving valuable space and improving thermal performance.

Package Shape: RECTANGULAR

The rectangular shape is efficient for layout design on PCBs and provides optimal heat dissipation.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and can accommodate different board thicknesses, making assembly easier.

Maximum Leakage Current: 1.5 mA

Minimal leakage current contributes to energy efficiency and reduces the risk of overheating, making it safe for continuous operation.

No. of Terminals: 2

Having only two terminals simplifies wiring and connectors, reducing potential points of failure in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for High-Density designs, enabling more efficient use of PCB space.

Maximum Operating Temperature: 125 °C

A higher operating temperature rating ensures reliability and performance under demanding conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant operation provides flexibility for controlling AC loads in both directions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

A low operating temperature range makes the product suitable for extreme environments, broadening its applicability.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, ensuring long-lasting connections.

Terminal Position: SINGLE

Single terminal position reduces complexity in design and easily accommodates various PCB layouts.

Maximum RMS On-state Current: 12 A

With a high on-state current capability, this TRIAC can manage significant loads, making it suitable for power applications.

Maximum DC Gate Trigger Voltage: 1 V

A low gate trigger voltage enables operation with lower control signal voltages, facilitating compatibility with many control circuits.

Repetitive Peak Off-state Voltage: 700 V

High off-state voltage allows this TRIAC to be used in high voltage applications, increasing versatility.

Minimum Critical Rate of Rise of Off-state Voltage: 2000 V/us

A fast rate of rise accommodates quick switching requirements, suitable for dynamic applications.

Maximum Holding Current: 50 mA

A low holding current ensures minimal power consumption during operation, contributing to overall system efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

The defined reflow temperature time ensures compatibility with standard soldering processes, streamlining assembly.

Peak Reflow Temperature: 245 C

A high peak reflow temperature supports proper soldering while maintaining the integrity of the component, enhancing reliability.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST12-7CG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

2000 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

1.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACST12-7CG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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