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ACST2-8SB-TR

STMicroelectronics

ACST2-8SB-TR by STMicroelectronics

ACST2-8SB-TR by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 2 A, repetitive peak off-state voltage of 800 V, and operates b/w -40 °C to 125°C. Ideal for compact surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,979 parts In-Stock

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8,979

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Digiode

USA . 3,608 parts In-Stock

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3,608

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Anansix

USA . 1,905 parts In-Stock

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1,905

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 76 parts In-Stock

1+ parts

$0.206

100+ parts

-

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-

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$0.198

76

$0.206

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$0.198

Northwest PG Solutions

USA . 1,293 parts In-Stock

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$0.227

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-

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$0.200

1,293

$0.227

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$0.200

IDEA Electronic Components Group

UK . 1,769 parts In-Stock

1+ parts

$2.339

100+ parts

-

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$2.105

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1,769

$2.339

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$2.105

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MKK Technologies

India . 837 parts In-Stock

1+ parts

$4.398

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837

$4.398

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DigiPath Technology Company

USA . 837 parts In-Stock

1+ parts

$4.398

100+ parts

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837

$4.398

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AZTECH Wire

Italy . 278 parts In-Stock

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$17.450

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278

$17.450

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Parana Technologies

USA . 2,028 parts In-Stock

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$2.796

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2,028

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$2.796

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Corphita

USA . 178 parts In-Stock

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178

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Overview

Unlock unparalleled performance with the ACST2-8SB-TR from STMicroelectronics, your go-to solution for efficient power management. This snubberless TRIAC enhances reliability in diverse applications, from home automation to industrial controls. With STMicroelectronics' renowned commitment to quality and innovation, you can trust this robust component to deliver exceptional durability and low leakage currents, ensuring optimal energy efficiency and peace of mind for your projects. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers excellent durability and resistance to environmental factors, making this TRIAC reliable in various applications.

Maximum DC Gate Trigger Current: 10 mA

A low maximum gate trigger current supports efficient operation, reducing power loss and allowing for integration in low-power circuits.

Configuration: SINGLE

The single configuration simplifies circuit design, making it easier to implement in various applications while keeping the footprint minimal.

Surface Mount: YES

Surface mount compatibility allows for compact PCB designs and automated assembly processes, enhancing productivity and space efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the circuit board, making it ideal for high-density designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring reliable connections and enhanced performance in assembly.

Maximum Leakage Current: 0.5 mA

Low leakage current enhances the efficiency of the circuit, minimizing energy loss and improving overall system performance.

No. of Terminals: 2

With only two terminals, this TRIAC simplifies circuit integration, making it suitable for straightforward designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables efficient space utilization on PCBs, contributing to compact product designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature offers stability in demanding environments, making it reliable for various applications.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces the need for external components, simplifying application design and improving reliability.

Minimum Operating Temperature: -40 °C

A wide temperature range enables operation in extreme conditions, making this component versatile for varying environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and ensures strong, reliable electrical connections during assembly.

Terminal Position: DUAL

Dual terminal positions facilitate flexible connections, allowing for convenient integration in different circuit configurations.

Maximum RMS On-state Current: 2 A

A maximum on-state current of 2 A supports a wide range of load applications, making this TRIAC versatile for different uses.

Maximum DC Gate Trigger Voltage: 1.1 V

Low gate trigger voltage minimizes the power required to activate the TRIAC, enhancing overall circuit efficiency.

Case Connection: MAIN TERMINAL 2

Integrating the main terminal connection optimizes the component's performance in power applications, ensuring robustness.

Repetitive Peak Off-state Voltage: 800 V

A high off-state voltage rating grants this TRIAC the ability to handle significant loads, making it reliable in high-voltage scenarios.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/µs

The high rate of rise enhances the device's performance in dynamic applications, ensuring reliable operation under fast switching conditions.

Maximum Holding Current: 10 mA

A low maximum holding current ensures sensitive operation, making it suitable for applications where precise control is necessary.

Maximum Time At Peak Reflow Temperature: 30 s

The specified reflow time ensures compatibility with standard soldering processes, enhancing reliability during manufacturing.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance allows for robust soldering processes, ensuring durability and longevity in the final product.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST2-8SB-TR attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1.1 V

Maximum Holding Current:

10 mA

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

2 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Device Type:

Trade Compliance

ACST2-8SB-TR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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