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MAC4N

Onsemi

MAC4N by Onsemi

MAC4N by Onsemi is a TRIAC with 3 terminals, max. DC gate trigger current of 35mA, and max. RMS on-state current of 4A. It is used in applications requiring AC switching such as dimmers, motor speed control, and heating control due to its high repetitive peak off-state voltage of 800V and low leakage current of 0.01mA.

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Digiode

USA . 703 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$2.769

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$2.495

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SupplyDigital Components

Austria . 8,384 parts In-Stock

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TANS Electronics

Latvia . 6,456 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,226 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 730 parts In-Stock

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Corohmni

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Overview

Experience the power and reliability of the MAC4N from Onsemi, a leading manufacturer in the semiconductor industry. This TRIAC device offers seamless switching capabilities and exceptional performance in a variety of applications. With a maximum RMS on-state current of 4A and a repetitive peak off-state voltage of 800V, this product provides unmatched quality and efficiency. Whether you're looking to control AC power in lighting, motor control, or heating applications, the MAC4N has you covered. Trust Onsemi for top-notch products that deliver value and reliability to customers every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the component, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 35 mA

The high maximum DC gate trigger current allows for reliable and consistent triggering of the TRIAC.

Configuration: SINGLE

The single configuration simplifies installation and circuit design, making it convenient for use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into electronic circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure connections and stable performance.

Maximum Leakage Current: 0.01 mA

The low maximum leakage current helps in reducing power loss and improving efficiency.

No. of Terminals: 3

Having 3 terminals provides flexibility in circuit designs and allows for different connection options.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting and easy heat dissipation during operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can withstand elevated temperatures and harsh environments.

Trigger Device Type: TRIAC

Being a TRIAC, this component is suitable for AC switching applications and offers reliable performance in such scenarios.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good conductivity and solderability for easy installation.

Terminal Position: SINGLE

The single terminal position simplifies connection and installation processes.

Maximum RMS On-state Current: 4 A

The high maximum RMS on-state current rating enables the TRIAC to handle larger loads and currents.

Maximum DC Gate Trigger Voltage: 1.3 V

The low maximum DC gate trigger voltage helps in triggering the TRIAC with low power consumption.

Case Connection: MAIN TERMINAL 2

Having the case connection at main terminal 2 provides convenient access for grounding and improves safety.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage rating ensures reliable performance under high voltage conditions.

Minimum Critical Rate of Rise of Commutation Voltage: 6 V/us

The minimum critical rate of rise of commutation voltage ensures smooth switching operation and prevents voltage spikes.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

The minimum critical rate of rise of off-state voltage helps in reducing noise and interference during switching operations.

Maximum Holding Current: 35 mA

The high maximum holding current ensures stable operation and prevents unintentional turn-off of the TRIAC.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for reliable soldering and assembly processes without damaging the component.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC4N attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

6 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC4N Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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