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74V1T14STR

STMicroelectronics

74V1T14STR by STMicroelectronics

74V1T14STR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of just 11.5 ns and operates at a supply voltage of 5 V. It features a compact low-profile package, ideal for space-constrained applications. This device supports military-grade temperatures from -55 °C to 125°C, ensuring reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Pegasus Components GmbH

Germany . 12,000 parts In-Stock

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Vyrian

USA . 3,786 parts In-Stock

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Chip Stock

USA . 2,744 parts In-Stock

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Digiode

USA . 1,604 parts In-Stock

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Anansix

USA . 703 parts In-Stock

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703

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Sea View Technologies

USA . 67 parts In-Stock

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Bristol Electronics

USA . 67 parts In-Stock

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67

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Distributors (Availability)

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AZTECH Wire

Italy . 1,032 parts In-Stock

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$15.010

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$15.010

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Microchip USA

USA . 343 parts In-Stock

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$15.034

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IDEA Electronic Components Group

UK . 175 parts In-Stock

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$22.754

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$20.479

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175

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MKK Technologies

India . 178 parts In-Stock

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$42.788

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DigiPath Technology Company

USA . 178 parts In-Stock

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$42.788

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Native Components

USA . 453 parts In-Stock

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$77.250

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$74.160

453

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Northwest PG Solutions

USA . 1,440 parts In-Stock

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$84.975

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Perfect Parts

USA . 37,878 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,935 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Corphita

USA . 2,421 parts In-Stock

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Parana Technologies

USA . 2,294 parts In-Stock

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$27.206

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Overview

Elevate your designs with the 74V1T14STR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile logic gate offers exceptional performance with rapid propagation delays and reliable operation across a wide temperature range. Ideal for military and industrial applications, it ensures durability and efficiency, providing you with the confidence to innovate without compromise. Unlock your project's potential with ST's trusted technology—where quality meets cutting-edge performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, ensuring longevity in various applications.

Propagation Delay At Nominal Supply: 11.5 ns

With a short propagation delay, this logic gate enables high-speed operation, making it suitable for applications requiring rapid signal processing.

Surface Mount: YES

The surface mount design allows for efficient use of space on PCBs, facilitating compact circuit designs and simplifying automated assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package aids in organized layout designs, optimizing the placement of components on a circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows easy integration into standard digital circuits and systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures compatibility with a variety of circuit designs while providing stable performance.

No. of Terminals: 5

With 5 terminals, this device allows for sufficient connections for common logic gate configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline package style reduces the footprint on the PCB, perfect for space-constrained applications.

Maximum I (ol): 8 Amp

Able to handle a maximum output current of 8 Amps, this product is suitable for driving larger loads without degradation.

Propagation Delay (tpd): 11.5 ns

A low propagation delay ensures minimal timing skew, which is essential for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

Rated for operation up to 125 °C, this component can perform reliably in high-temperature environments.

Minimum Operating Temperature: -55 °C

This wide temperature range allows the logic gate to be used in extreme conditions, ensuring versatility in diverse applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish offers good solderability and enhances corrosion resistance for reliable connections.

Terminal Position: DUAL

The dual terminal position makes it easy to integrate into various circuit layouts and supports effective signal routing.

Maximum Seated Height: 1.45 mm

With a maximum seated height of 1.45 mm, this low-profile design facilitates dense PCB layouts without compromising performance.

Width: 1.625 mm

The compact width allows this component to fit seamlessly into space-restricted areas of a circuit board.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V enhances flexibility in supply options for various application scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product is designed for compatibility with modern soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures resilience to high-temperature soldering processes during assembly.

Length: 2.9 mm

The compact length aids in optimizing circuit board space, making it an excellent choice for intricate electronic designs.

Temperature Grade: MILITARY

The military-grade temperature rating guarantees reliability and durability in demanding environments, suitable for defense and aerospace applications.

Schmitt Trigger: YES

Incorporating a Schmitt trigger enhances noise immunity and provides clean output signals, crucial for precise digital signal processing.

Technology: CMOS

Utilizing CMOS technology promotes low power consumption and high-speed operation, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form is favored for easy handling and reliable solder joints in surface mount applications.

Packing Method: TR

Packed using tape and reel (TR) ensures efficient handling and automated assembly in manufacturing processes.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for compact spacing of leads, making it suitable for high-density circuits.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V enhances its compatibility with a wide range of digital systems and ensures safe operation.

Technical Specifications

Logic Gates 74V1T14STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V1T14STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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