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74V1T14CTR

STMicroelectronics

74V1T14CTR by STMicroelectronics

74V1T14CTR by STMicroelectronics is a CMOS Schmitt Trigger logic gate with a propagation delay of just 11.5 ns, operating b/w 4.5-5.5 V. It features a compact SOIC package and supports applications in military-grade electronics due to its wide temperature range (-55 °C to 125°C). Ideal for high-speed signal processing, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,698 parts In-Stock

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6,698

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Digiode

USA . 2,628 parts In-Stock

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2,628

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Anansix

USA . 2,138 parts In-Stock

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2,138

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Q Components

USA . 19 parts In-Stock

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Microchip USA

USA . 437 parts In-Stock

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$0.138

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437

$0.138

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AZTECH Wire

Italy . 154 parts In-Stock

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$13.660

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154

$13.660

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Native Components

USA . 75 parts In-Stock

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$27.130

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75

$27.130

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IDEA Electronic Components Group

UK . 108 parts In-Stock

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$29.159

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$26.243

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108

$29.159

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$26.243

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Northwest PG Solutions

USA . 506 parts In-Stock

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$29.843

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$26.859

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506

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$26.859

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MKK Technologies

India . 725 parts In-Stock

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$54.832

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$54.832

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DigiPath Technology Company

USA . 725 parts In-Stock

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$54.832

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725

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Perfect Parts

USA . 36,107 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,659 parts In-Stock

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Corphita

USA . 3,873 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Parana Technologies

USA . 1,800 parts In-Stock

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$34.864

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$34.864

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Overview

Unlock unparalleled performance with the 74V1T14CTR from STMicroelectronics—your go-to choice for reliable logic gate solutions. Crafted with precision, this CMOS Schmitt Trigger delivers rapid response times and exceptional durability, ensuring optimal operation in even the most demanding environments. Perfectly suited for automotive, industrial, and consumer applications, it offers unmatched value, reliability, and innovation, empowering your designs to excel. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors.

Propagation Delay At Nominal Supply: 11.5 ns

Fast propagation delay makes this product suitable for high-speed applications, ensuring quick signal processing.

Surface Mount: YES

Surface mount design allows for easier integration into compact circuit boards, saving space.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout efficiency on PCBs and facilitates modular design.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage simplifies compatibility with a wide range of existing systems.

Load Capacitance (CL): 50 pF

Low load capacitance enhances performance in high-frequency applications, reducing signal degradation.

Power Supplies (V): 5

Consistent power supply requirement further allows for straightforward system design and stability.

No. of Terminals: 5

Five terminals provide flexibility in circuit design, allowing for various configurations and applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is ideal for space-constrained designs, providing a slim profile with high terminal density.

Maximum I (ol): 8 Amp

High output current capability enables the gate to drive larger loads, making it versatile for various applications.

Propagation Delay (tpd): 11.5 ns

Stable propagation delay ensures reliable signal timing in applications, contributing to overall circuit efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, making it suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finish protects against corrosion and enhances solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position offers design flexibility, compatible with various PCB layouts.

Maximum Seated Height: 1.1 mm

Low seated height allows for a more compact design, saving precious space on the PCB.

Width: 1.25 mm

A narrow width supports high-density arrangements in compact electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

Lower supply voltage requirement ensures compatibility with a broader range of devices.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow time helps in the manufacturing process, reducing risk of damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures compatibility with lead-free soldering processes, aligning with modern manufacturing standards.

Length: 2 mm

Compact length aids in efficient space utilization on PCBs, beneficial for miniaturized devices.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability under extreme conditions, suitable for critical applications.

Schmitt Trigger: YES

Inclusion of Schmitt trigger provides enhanced noise immunity and faster switching speeds, improving performance in noisy environments.

Technology: CMOS

Using CMOS technology ensures low power consumption, high speed, and scalability for various applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy visual inspection and are suitable for automated assembly processes.

Packing Method: TR

Tape-and-reel packing method facilitates efficient automated handling and processing in manufacturing.

Terminal Pitch: 0.65 mm

Optimal terminal pitch supports high-density circuit designs where space is at a premium.

Maximum Supply Voltage (Vsup): 5.5 V

Allows flexibility in power supply options, making it adaptable to various engineering requirements.

Technical Specifications

Logic Gates 74V1T14CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1T14CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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