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74V1T08CTR

STMicroelectronics

74V1T08CTR by STMicroelectronics

74V1T08CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9.5 ns and operates at a nominal voltage of 5V. It features dual inputs and is ideal for high-speed applications in compact designs. Its military-grade specs ensure reliability in extreme temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,223 parts In-Stock

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Digiode

USA . 4,514 parts In-Stock

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Anansix

USA . 2,759 parts In-Stock

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2,759

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Microchip USA

USA . 357 parts In-Stock

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$6.603

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357

$6.603

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AZTECH Wire

Italy . 297 parts In-Stock

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$9.450

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297

$9.450

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IDEA Electronic Components Group

UK . 2,133 parts In-Stock

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$11.430

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$10.287

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$11.430

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$10.287

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Corohmni

South Africa . 901 parts In-Stock

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$16.243

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901

$16.243

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Native Components

USA . 480 parts In-Stock

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$16.605

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480

$16.605

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Northwest PG Solutions

USA . 965 parts In-Stock

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$18.265

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$16.439

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965

$18.265

$16.439

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MKK Technologies

India . 1,343 parts In-Stock

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$21.494

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$21.494

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DigiPath Technology Company

USA . 1,343 parts In-Stock

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$21.494

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$21.494

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$31.584

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$28.741

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$25.899

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$31.584

$28.741

$25.899

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Kepictronics

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,194 parts In-Stock

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Corphita

USA . 2,708 parts In-Stock

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Parana Technologies

USA . 2,254 parts In-Stock

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$13.666

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Perfect Parts

USA . 1,200 parts In-Stock

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Overview

Elevate your designs with the 74V1T08CTR from STMicroelectronics, a robust logic gate solution that combines exceptional reliability and performance. With a swift propagation delay of just 9.5 ns, this versatile component is perfect for a range of applications in automotive, industrial, and consumer electronics. Trust in ST's renowned quality and innovation to deliver superior efficiency and durability, ensuring your projects stand out and succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures longevity and reliability, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 9.5 ns

A low propagation delay means faster signal processing, which is essential for high-speed applications.

Surface Mount: YES

Support for surface mounting facilitates easy integration into modern circuit designs.

No. of Inputs: 2

Having two inputs allows for versatile logic operations, making it adaptable for various logic functions.

Package Shape: RECTANGULAR

The rectangular shape is compact and optimally designed for space-saving in PCB layouts.

Nominal Supply Voltage / Vsup (V): 5

A standard supply voltage ensures compatibility with a wide range of electronic devices and systems.

Load Capacitance (CL): 50 pF

Low load capacitance indicates efficient performance and reduced delay in high-frequency circuits.

Power Supplies (V): 5

Single power supply voltage simplifies the design and reduces the number of required components.

No. of Terminals: 5

A manageable number of terminals makes integration straightforward while providing necessary connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves board space, suitable for space-constrained applications.

Maximum I (ol): 8 Amp

High output current capacity allows reliable performance in applications requiring substantial load handling.

Propagation Delay (tpd): 9.5 ns

Consistent propagation delay reinforces the product’s suitability for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in challenging environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes this product ideal for extreme environments, including military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Robust terminal finish enhances contact reliability and is resistant to corrosion, ensuring longevity.

Terminal Position: DUAL

Dual terminal positions offer flexible mounting options, improving design versatility.

Maximum Seated Height: 1.1 mm

Low seated height supports dense packing of components on pcbs without compromising performance.

Width: 1.25 mm

Compact width allows for more components to fit on a PCB, optimizing space utilization.

Minimum Supply Voltage (Vsup): 4.5 V

Minimum voltage requirement ensures compatibility with lower power systems, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time is optimal for safe soldering without damaging the component.

Peak Reflow Temperature °C: 260

A high reflow temperature tolerance indicates the component can withstand rigorous manufacturing processes.

Length: 2 mm

Compact length supports high-density layouts, maximizing space efficiency on the circuit board.

Temperature Grade: MILITARY

MILITARY-grade specification ensures this product can perform reliably under extreme conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering stability, ensuring a strong electrical connection.

Terminal Pitch: 0.65 mm

Fine terminal pitch is suitable for high-density applications, allowing for advanced circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a slightly higher supply voltage adds to the product's flexibility in various powering scenarios.

Technical Specifications

Logic Gates 74V1T08CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1T08CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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