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74V1G70STR

STMicroelectronics

74V1G70STR by STMicroelectronics

74V1G70STR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns and operates b/w 2-5.5 V. It features a compact, low-profile design suitable for surface mounting in military applications. With a max temp of 125 °C and load capacitance of 50 pF, it's ideal for high-performance circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,965 parts In-Stock

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8,965

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Digiode

USA . 4,891 parts In-Stock

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4,891

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Component Electronics Inc.

Canada . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,211 parts In-Stock

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1,211

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Distributors (Availability)

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Microchip USA

USA . 442 parts In-Stock

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$0.194

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442

$0.194

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Benley Electronics

USA . 4 parts In-Stock

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$1.750

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4

$1.750

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AZTECH Wire

Italy . 923 parts In-Stock

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$12.260

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923

$12.260

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IDEA Electronic Components Group

UK . 2,199 parts In-Stock

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$26.989

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$24.290

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2,199

$26.989

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$24.290

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MKK Technologies

India . 137 parts In-Stock

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$50.751

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137

$50.751

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DigiPath Technology Company

USA . 137 parts In-Stock

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$50.751

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137

$50.751

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Component Stockers USA

USA . 395 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 18,769 parts In-Stock

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Metaverse IC Inc.

Canada . 13,999 parts In-Stock

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Corphita

USA . 4,010 parts In-Stock

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Northwest PG Solutions

USA . 785 parts In-Stock

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$3.900

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$3.900

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Parana Technologies

USA . 489 parts In-Stock

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$32.270

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$32.270

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Native Components

USA . 132 parts In-Stock

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$3.861

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132

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$3.861

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Overview

Unlock superior performance with the 74V1G70STR from STMicroelectronics—a leader in innovative semiconductor solutions. This versatile logic gate excels in demanding applications, delivering rapid propagation delays and robust operation across a wide temperature range. Its compact design is perfect for space-constrained projects, ensuring reliability and efficiency. Experience unmatched quality and support from a trusted manufacturer, empowering your designs to achieve new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic epoxy offers robust protection against environmental factors, enhancing reliability in various applications.

Propagation Delay At Nominal Supply: 10 ns

With a low propagation delay, this logic gate ensures quick response times, making it suitable for high-speed digital circuits.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling easier assembly and improved manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on printed circuit boards (PCBs), allowing for higher density designs.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at 3.3V makes it compatible with modern low-voltage applications, which helps in power conservation.

Load Capacitance (CL): 50 pF

A low load capacitance ensures better switching speed and reduces power consumption, ideal for high-performance circuits.

Power Supplies (V): 2/5.5

The device can operate within a wide supply voltage range, providing flexibility for various application requirements.

No. of Terminals: 5

Having five terminals ensures sufficient connectivity for various configurations while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design is advantageous for space-constrained applications, facilitating compact PCB layouts.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps makes this logic gate suitable for driving higher loads without requiring additional components.

Propagation Delay (tpd): 10 ns

Consistent propagation delay reinforces optimal performance in timing-sensitive applications, ensuring reliability.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature indicates robustness in harsh environments, suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

Operating in extremely low temperatures makes this logic gate ideal for applications in aerospace and other temperature-sensitive environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability, ensuring reliable connections during assembly processes.

Terminal Position: DUAL

Dual terminal positions enable versatile mounting options, simplifying PCB design and layout.

Maximum Seated Height: 1.45 mm

A low seated height allows for compatibility with space-restricted applications, ensuring ease of integration into compact devices.

Width: 1.625 mm

A narrow width contributes to a compact design, making it easy to incorporate into tightly packed circuits.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate at a minimum of 2V allows for greater design flexibility in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified peak reflow time ensures compatibility with standard soldering processes, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 260

This high peak reflow temperature indicates suitability for lead-free soldering processes, supporting modern manufacturing requirements.

Length: 2.9 mm

The compact length aids in reducing PCB space, making it an excellent choice for miniaturized electronic devices.

Temperature Grade: MILITARY

Rated for military specifications, it ensures superior performance and reliability in critical applications.

Technology: CMOS

Using CMOS technology results in lower power consumption, which is ideal for battery-operated and energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals provide a reliable mechanical and electrical connection, simplifying the soldering process.

Packing Method: TR

Tape and reel packing methods facilitate automated assembly, enhancing production efficiency.

Terminal Pitch: 0.95 mm

A 0.95 mm terminal pitch allows for high-density mounting while keeping components easily accessible for service and connections.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum of 5.5V provides flexibility for various analog and digital supply requirements, ensuring versatility in design.

Technical Specifications

Logic Gates 74V1G70STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V1G70STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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