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5962-8751502LX

STMicroelectronics

5962-8751502LX by STMicroelectronics

5962-8751502LX by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring an asynchronous operation mode and a max access time of 55 ns. It has an organization of 8Kx8, making it ideal for reliable data storage in harsh environments. This UVPROM is suitable for applications requiring robust performance at extreme temperatures (-55 °C to 125 °C).

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1k+

5962-8751502LX by STMicroelectronics
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Anansix

USA . 2,652 parts In-Stock

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2,652

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Digiode

USA . 2,515 parts In-Stock

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2,515

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Vyrian

USA . 152 parts In-Stock

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152

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IDEA Electronic Components Group

UK . 1,580 parts In-Stock

1+ parts

$4.891

100+ parts

-

1k+ parts

$4.402

10k+ parts

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1,580

$4.891

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$4.402

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MKK Technologies

India . 2,342 parts In-Stock

1+ parts

$9.197

100+ parts

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2,342

$9.197

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DigiPath Technology Company

USA . 2,342 parts In-Stock

1+ parts

$9.197

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2,342

$9.197

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Corphita

USA . 3,600 parts In-Stock

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3,600

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Parana Technologies

USA . 1,796 parts In-Stock

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$5.848

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1,796

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$5.848

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Supply Digital

USA . 1,333 parts In-Stock

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1,333

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Native Components

USA . 828 parts In-Stock

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828

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Northwest PG Solutions

USA . 688 parts In-Stock

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Overview

Unlock the potential of your projects with the 5962-8751502LX EPROM from STMicroelectronics. Renowned for their uncompromising quality and innovation, STMicroelectronics delivers a robust solution designed to perform in demanding environments, thanks to its military-grade reliability. Ideal for aerospace, defense, and industrial applications, this ceramic-glass sealed memory chip ensures durability and efficiency, empowering engineers to push boundaries while enjoying exceptional performance and stability. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package ensures robust durability and protection against environmental factors, making it suitable for military applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and integration into various designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access times, enhancing performance in time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V is common in many electronic systems, increasing compatibility with standard designs.

No. of Terminals: 24

With 24 terminals, this EPROM provides ample connectivity options for diverse applications.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window package style facilitates easy exposure to UV light for reprogramming, enhancing product flexibility.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C supports use in high-temperature environments, ideal for military-grade applications.

Organization: 8KX8

The 8Kx8 organization offers a balanced capacity and width for a variety of applications, ensuring efficient memory utilization.

Minimum Operating Temperature: -55 °C

Operational capability down to -55 °C expands its usability in extreme conditions typical of military and aerospace applications.

Terminal Position: DUAL

Dual terminal position enhances the EPROM's stability and solderability during assembly.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, this EPROM can fit into low-profile systems without taking up excessive space.

Width: 7.62 mm

The width of 7.62 mm is adequate for handling and manufacturing while ensuring effective memory functionality.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V provides flexibility in voltage supply design for various applications.

Length: 32.005 mm

The length of 32.005 mm offers a standard form factor suitable for a range of electronic design requirements.

Temperature Grade: MILITARY

Being military-grade means this EPROM meets rigorous standards for reliability and performance in critical applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher data retention, making it a power-efficient choice.

Parallel or Serial: PARALLEL

Parallel operation allows for multiple bits to be accessed simultaneously, resulting in faster data retrieval and processing.

Terminal Form: THROUGH-HOLE

The through-hole form enhances mechanical stability and makes soldering easier, ensuring durability in complex assemblies.

No. of Words: 8192 words

With 8192 words of storage, it provides a substantial amount of data capacity for various applications.

Memory Width: 8

An 8-bit memory width is a standard size that supports common data processing tasks in embedded systems.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm ensures compatibility with typical PCB designs and facilitates easier assembly.

No. of Words Code: 8K

This EPROM has an 8K word code, indicating its capability to store complex programs and data efficiently.

Maximum Supply Voltage (Vsup): 5.5 V

The upper supply voltage limit of 5.5 V allows for headroom in power supply designs, ensuring stable operation.

Memory Density: 65536 bit

With a memory density of 65536 bits, this EPROM provides significant storage capacity for a variety of applications.

Memory IC Type: UVPROM

As a UVPROM, it supports reprogrammability via UV light, making it suitable for applications requiring updates.

Maximum Access Time: 55 ns

A maximum access time of 55 ns ensures quick data retrieval, enhancing overall system responsiveness.

Technical Specifications

EPROM 5962-8751502LX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8751502LX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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