Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPC1LC20N by Intel is a 20-terminal EPROM chip carrier with 1046496-bit memory density. Operating at 3.3V, it features synchronous mode and 3-STATE output characteristics. Ideal for configuration memory applications, this CMOS technology device has a max operating temperature of 70°C.
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This material provides good protection for the EPROM chip inside, ensuring durability and longevity.
Allows for easy installation on circuit boards, saving time and effort in the assembly process.
Operates at a commonly used and stable voltage, ensuring compatibility with a wide range of systems.
Large memory density allows for storing a significant amount of data or configurations on the EPROM.
CMOS technology provides low power consumption and high noise immunity, making the EPROM efficient and reliable.
EPROM EPC1LC20N attributes and parameters. Explore more EPROM devices from Intel
Additional Features:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Programming Voltage (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
EPC1LC20N Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
BAV99
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
2N2222A
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
Vishay Telefunken
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
LM358N
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
New England Semiconductor
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
Diodes Incorporated
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
TMS2716-45JDL
TMS2716-45JDL by Texas Instruments is a 2KX8 EPROM with 3-STATE output, operating at 5V. It has a memory density of 16384 bit and max access time of 450 ns. Ideal for commercial applications requiring fast parallel memory access in devices with a supply voltage range of 4.75V to 5.25V.
TMS27C256-17JL
TMS27C256-17JL by Texas Instruments is a 32KX8 EPROM with 170 ns access time, operating at 5V. It features 3-STATE output and supports parallel mode. Ideal for commercial applications requiring reliable memory storage in a compact IN-LINE package.
TMS27LV010A-20JE
TMS27LV010A-20JE by Texas Instruments is a 128KX8 EPROM with 3.3V nominal voltage, operating in asynchronous mode. It features 200ns max access time and is commonly used in industrial applications requiring reliable non-volatile memory storage.
M27C4002-80XF1
STMicroelectronics
M27C4002-80XF1 EPROM by STMicroelectronics features 256KX16 organization, 80 ns access time, and 5V nominal voltage. Ideal for commercial applications requiring reliable non-volatile memory with a memory density of 4Mbit and parallel interface.
TMS27C256-12JE4
TMS27C256-12JE4 by Texas Instruments is a 32KX8 EPROM with 120ns access time, 3-state output, and operates at -40 to 85°C. Commonly used in industrial applications for storing data securely due to its UVPROM technology and parallel interface.
TMS27C512-30JL4
TMS27C512-30JL4 by Texas Instruments is a 64KX8 EPROM with 300 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and through-hole terminal form. Ideal for applications requiring fast memory access in commercial temperature environments.
M27C1001-12XL3XTR
STMicroelectronics' M27C1001-12XL3XTR is a 128Kx8 EPROM chip with 120ns access time, 125 °C max temp, and 5V supply. Ideal for automotive applications, it features common I/O type, 32 terminals in a rectangular chip carrier package.
TMS27C256-120JE
TMS27C256-120JE by Texas Instruments is a 32KX8 EPROM with 120 ns access time, 5V supply voltage, and 3-STATE output. Ideal for industrial applications requiring reliable non-volatile memory storage in a ceramic package with through-hole terminals.
D27C400-150V10
Intel
The Intel D27C400-150V10 is a 256KX16 EPROM with 3-STATE output, operating at 5V. It has a max access time of 150ns and memory density of 4Mb. Commonly used in commercial applications requiring reliable non-volatile memory storage.
MD27C64-35
Rochester Electronics
MD27C64-35 by Rochester Electronics is a MIL-PRF-38535 EPROM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates in asynchronous mode with a max access time of 350 ns. Ideal for military applications requiring reliable non-volatile memory solutions.
5962-8606301XX
Texas Instruments' 5962-8606301XX EPROM features 32KX8 organization, 3-STATE output, and MILITARY temperature grade. With a memory density of 262144 bit, it is ideal for applications requiring fast access times and reliable performance in harsh environments.
TMX27C512-20JL
TMX27C512-20JL EPROM by Texas Instruments features 64KX8 organization, 5V supply voltage, and 200 ns access time. It is used for storing data in applications requiring fast read/write operations and offers a memory density of 524288 bits.
SMJ27C256-25J
SMJ27C256-25J by Texas Instruments is a 32KX8 EPROM with 3-STATE output, operating at -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and offers a memory density of 262144 bit. Ideal for military-grade applications requiring fast access times within the CMOS technology framework.
TMS2532-30JL
TMS2532-30JL by Texas Instruments is a 4KX8 EPROM with 32768 bit memory density. It operates at 5V, has an access time of 300ns, and features a 3-STATE output. Commonly used in commercial applications, this UVPROM has a temperature range of 0-70°C and comes in a ceramic, metal-sealed co-fired package.
TMS27C256JL-25
TMS27C256JL-25 by Texas Instruments is a 32KX8 EPROM with 262144 bit memory density. It operates at 5V, has an access time of 250 ns, and uses CMOS technology. Ideal for commercial applications requiring fast parallel memory access in a rectangular ceramic package.
M27C256B-15F1
M27C256B-15F1 by STMicroelectronics is a 32KX8 EPROM with 150 ns access time, operating at 5V. It features a CMOS technology, through-hole terminal form, and 3-STATE output characteristics. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact rectangular package.
AM27C64-90DC
AM27C64-90DC by Rochester Electronics is an 8KX8 EPROM with 65536-bit memory density. It operates at 5V, has a max access time of 90ns, and is ideal for commercial applications requiring reliable non-volatile memory storage.
TMS27C256-10JL4
TMS27C256-10JL4 by Texas Instruments is a 32KX8 EPROM with 100ns access time, 3-state output, and operates at 5V. It is used in commercial applications for storing data securely due to its UVPROM technology and through-hole terminal form.
D2764A-4
Intel D2764A-4 EPROM features 8KX8 organization, 3-STATE output, and 65536-bit memory density. Commonly used in commercial applications, it operates b/w 0 to 70°C with a programming voltage of 12.5V.
TMS27C210-200JL
TMS27C210-200JL by Texas Instruments is a 64KX16 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and is suitable for commercial applications requiring UVPROM memory technology in a ceramic, metal-sealed co-fired package.
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EPC1441PI8
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
EPC1441PI8 by Intel is an EPROM with 440800X1 organization, 440800-bit memory density, and operates at a synchronous mode. It is used for configuration memory applications due to its 3-STATE output characteristics and SERIAL interface.
EPC1441TC32N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3 V;
EPC1441TC32N by Intel is a 32-terminal EPROM with a square package and a max operating temperature of 70°C. It operates in synchronous mode and has a memory density of 440800 bits. This configuration memory IC is suitable for various applications requiring non-volatile storage.
EPC1PI8N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1046496 words;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
EPC1LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; JESD-609 Code: e3;
EPC1441PC8
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Package Style (Meter): IN-LINE;
EPC1LC20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Pitch: 1.27 mm; Terminal Position: QUAD;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL;
EPC1441LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Width: 1;
EPC1PI8
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1; Surface Mount: NO;
EPC1441LI20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL; Terminal Pitch: 1.27 mm;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Programming Voltage (V): 3.3;
EPC1PC8
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.318 mm;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp; Surface Mount: NO;
EPC1LI20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Finish: TIN LEAD; Moisture Sensitivity Level (MSL): 1;
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