Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPC1441LC20N by Intel is a 440800X1 EPROM chip carrier with 3-STATE output, operating at 3.3V in synchronous mode. Ideal for configuration memory applications, it features a 20-terminal quad package with a square shape and matte tin finish, suitable for commercial temperature grades.
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This material provides durability and protection for the EPROM chip, ensuring a longer lifespan.
Efficient power consumption at a nominal voltage, making it energy-efficient.
High memory density allows for storing a large amount of data or configurations in the EPROM.
CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the EPROM.
Serial communication allows for easier data transfer and programming of the EPROM chip.
EPROM EPC1441LC20N attributes and parameters. Explore more EPROM devices from Intel
Additional Features:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Programming Voltage (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
EPC1441LC20N Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
BAV99-7-F
Multicomp Pro
LM358AN
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Taiwan Semiconductor
MR27C6425
Intel
Intel's MR27C6425 EPROM features 8KX8 organization, 65536 bit memory density, and 250 ns access time. Ideal for military applications due to its MIL-graded temperature range of -55 to 125 °C and UVPROM technology. With a package style of CHIP CARRIER and common I/O type, it is suitable for various electronic systems requiring reliable non-volatile memory storage.
TMS27C512-3JE
TMS27C512-3JE by Texas Instruments is a 64KX8 EPROM with 300 ns access time, 5V supply voltage, and 85°C max operating temp. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
TMS27C040-120JL4
TMS27C040-120JL4 by Texas Instruments is a 512KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 120ns and memory density of 4194304 bit. Commonly used in commercial applications requiring fast parallel memory access.
TMS27C32-150JE
TMS27C32-150JE by Texas Instruments is a 4KX8 EPROM with 150 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and INDUSTRIAL temperature grade. Commonly used in parallel applications for memory storage due to its 32768-bit density and UVPROM type.
TMS27C512-20JE4
TMS27C512-20JE4 by Texas Instruments is a 64KX8 EPROM with 200ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and INDUSTRIAL temperature grade. Ideal for applications requiring fast memory access in industrial environments.
M27C1001-15XL1XTR
STMicroelectronics
STMicroelectronics' M27C1001-15XL1XTR is a 128Kx8 EPROM with 120ns access time, operating b/w 0-70 °C. It features 32 terminals in a chip carrier package, suitable for common I/O applications. With a memory density of 1048576 bits and low standby current of 0.0001A, it's ideal for commercial-grade CMOS technology projects.
M2732A-2F1
M2732A-2F1 EPROM by STMicroelectronics features 4KX8 organization, 3-STATE output, and 5V nominal voltage. It is commonly used in commercial applications requiring a memory density of 32768 bit with a max access time of 200 ns.
SMJ27C256-20J
SMJ27C256-20J by Texas Instruments is a 32KX8 EPROM with 3-STATE output, operating at -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and offers fast access time of 200 ns. Ideal for military-grade applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
SMJ27C512-20J
SMJ27C512-20J by Texas Instruments is a 64KX8 EPROM with 3-STATE output, operating at 5V. It features a max access time of 200ns and is designed for military-grade applications. The UVPROM technology offers a memory density of 524288 bits in a ceramic, metal-sealed package.
TMS27C128-15JL4
TMS27C128-15JL4 by Texas Instruments is a 16KX8 EPROM with 150 ns access time, 3-STATE output, and 5V supply voltage. It is used in commercial applications for storing data securely due to its UVPROM technology and through-hole terminal form.
SMJ27C128-2JM
The Texas Instruments SMJ27C128-2JM is a 16KX8 EPROM with 3-STATE output, operating at temperatures from -55 to 125 °C. It has a programming voltage of 12.5V and memory density of 131072 bits, suitable for military-grade applications requiring reliable non-volatile memory storage.
TMS27C256-12JL
TMS27C256-12JL by Texas Instruments is a 32KX8 EPROM with 120ns access time, 5V supply voltage, and 3-STATE output. Commonly used in commercial applications, it features a CMOS technology, through-hole terminal form, and operates in parallel mode for fast data retrieval.
TMS27C010A-10JE
TMS27C010A-10JE by Texas Instruments is a 128KX8 EPROM with 100ns access time, operating at 5V. It features a 32-terminal IN-LINE package and supports asynchronous mode. Ideal for industrial applications requiring reliable memory storage in a compact form factor.
NMC27C32BQE200
NMC27C32BQE200 by National Semiconductor is a 4KX8 EPROM with 3-STATE output, operating at 5V. It features an asynchronous mode, INDUSTRIAL temperature grade, and THROUGH-HOLE terminal form. Ideal for applications requiring fast access times and reliable memory storage in industrial settings.
TMS27C512-17JL4
TMS27C512-17JL4 by Texas Instruments is a 64KX8 EPROM with 170 ns access time, 3-STATE output, and operates at 5V. It is used in commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
NM27C128Q150
Rochester Electronics
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 16KX8;
D2764A-4
Intel D2764A-4 EPROM features 8KX8 organization, 3-STATE output, and 65536-bit memory density. Commonly used in commercial applications, it operates b/w 0 to 70°C with a programming voltage of 12.5V.
M27C1001-12XL1
M27C1001-12XL1 EPROM by STMicroelectronics features 128KX8 organization, 120 ns access time, and 1048576 bit memory density. Ideal for commercial applications, this CMOS technology chip operates at a temperature range of 0 to 70 °C with a supply voltage of 4.75V to 5.25V.
TMS27C040-100JL4
TMS27C040-100JL4 by Texas Instruments is a 512KX8 EPROM with 100 ns access time. Operating at 5V, it features 3-STATE output and CMOS technology. Ideal for commercial applications requiring fast memory access in a rectangular ceramic package.
M27C1001-20XF1X
STMicroelectronics M27C1001-20XF1X is a 128Kx8 EPROM with 120ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and common I/O type. Ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular ceramic package.
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EPC1441PI8
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
EPC1441PI8 by Intel is an EPROM with 440800X1 organization, 440800-bit memory density, and operates at a synchronous mode. It is used for configuration memory applications due to its 3-STATE output characteristics and SERIAL interface.
EPC1441TC32N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3 V;
EPC1441TC32N by Intel is a 32-terminal EPROM with a square package and a max operating temperature of 70°C. It operates in synchronous mode and has a memory density of 440800 bits. This configuration memory IC is suitable for various applications requiring non-volatile storage.
EPC1PI8N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1046496 words;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
EPC1LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; JESD-609 Code: e3;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
EPC1441PC8
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Package Style (Meter): IN-LINE;
EPC1LC20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Pitch: 1.27 mm; Terminal Position: QUAD;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL;
EPC1441LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Width: 1;
EPC1PI8
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1; Surface Mount: NO;
EPC1441LI20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL; Terminal Pitch: 1.27 mm;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Programming Voltage (V): 3.3;
EPC1PC8
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.318 mm;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp; Surface Mount: NO;
EPC1441LC20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 1; Minimum Operating Temperature: 0 Cel;
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