Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPC1441LC20 by Intel is a 20-terminal EPROM chip with 440800X1 organization, operating at 3.3V. It features synchronous mode, 440800-bit memory density, and serial programming. Ideal for configuration memory applications requiring a compact square chip carrier package with J bend terminals.
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Durable material that provides protection to the internal components of the EPROM.
Allows for easy integration onto a circuit board, saving space and simplifying assembly.
Ensures efficient data transfer and synchronization within the EPROM system.
Optimal voltage level for stable and reliable performance of the EPROM.
Low power consumption and high noise immunity, making it energy-efficient and reliable.
Designed specifically for storing configuration data, ensuring accurate and efficient system operation.
EPROM EPC1441LC20 attributes and parameters. Explore more EPROM devices from Intel
Additional Features:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Programming Voltage (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
EPC1441LC20 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LM2931AZ-5.0RPG
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
BAV99
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148
Renesas Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
MMBT2907ALT1G
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
SMJ27C512-25JM
Texas Instruments
The Texas Instruments SMJ27C512-25JM is a 64KX8 EPROM with 125°C max temp, -55°C min temp, and 250 ns access time. Commonly used in military applications due to its MIL-Grade tech, it operates at 5V with 524288-bit memory density and through-hole terminal form.
TMS27C510-20JE
TMS27C510-20JE by Texas Instruments is a 64KX8 EPROM with 3-STATE output, operating at 5V. It features an access time of 200ns, suitable for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package. With a memory density of 524288 bit and parallel interface, it offers fast and efficient data retrieval for various electronic systems.
TMS27C512-45JL
TMS27C512-45JL by Texas Instruments is a 64KX8 EPROM with 524288 bit memory density, 450 ns access time, and 3-STATE output. It operates at temperatures b/w 0 to 70 °C and has a supply voltage of 5V. Commonly used in commercial applications requiring reliable non-volatile memory storage.
TMS27C210A-120JE
TMS27C210A-120JE by Texas Instruments is a 64KX16 EPROM with 120 ns access time, 3-STATE output, and CMOS technology. It operates at -40 to 85 °C and has a memory density of 1048576 bit. Ideal for industrial applications requiring reliable non-volatile memory storage.
TMS2764A-25JP4
TMS2764A-25JP4 by Texas Instruments is an 8KX8 EPROM with 65536 bit memory density. It operates asynchronously at a max temperature of 85°C, with a supply voltage range of 4.75V to 5.25V. Ideal for applications requiring fast access times and reliable non-volatile memory storage in various electronic devices.
TMS27C512-1JE
TMS27C512-1JE by Texas Instruments is a 64KX8 EPROM with 170ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and INDUSTRIAL temperature grade. Ideal for applications requiring reliable non-volatile memory storage in industrial environments.
TMS27C512-15JL4
TMS27C512-15JL4 by Texas Instruments is a 64KX8 EPROM with 150 ns access time, 5V supply voltage, and 3-STATE output. It is used in commercial applications requiring reliable non-volatile memory storage.
M27C1001-20L3XTR
STMicroelectronics
STMicroelectronics' M27C1001-20L3XTR is a 128Kx8 EPROM chip with 120ns access time, 5V supply voltage, and 32 terminals. Ideal for automotive applications, it features a ceramic package body, common I/O type, and 3-state output characteristics.
TMS27C040-12JE
TMS27C040-12JE by Texas Instruments is a 512KX8 EPROM with 120 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Ideal for industrial applications requiring reliable memory storage in a compact IN-LINE package.
M27C1001-12XL3X
STMicroelectronics M27C1001-12XL3X is a 128Kx8 EPROM with 120ns access time, operating at 5V. It features a ceramic, metal-sealed co-fired package and is suitable for automotive applications due to its -40 to 125 °C temperature range. The device has a parallel interface with 32 terminals in a chip carrier package.
TMS27C240-10JL4
TMS27C240-10JL4 by Texas Instruments is a 256KX16 EPROM with 100ns access time, 3-STATE output, and operates at 5V. It is used in commercial applications requiring high memory density and parallel data transfer.
D27C256
Intel
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
SMJ2532-45JM
The Texas Instruments SMJ2532-45JM EPROM features 4Kx8 organization, 3-STATE output, and 32768-bit memory density. Ideal for military applications with a temperature range of -55 to 125°C, this UVPROM has a max access time of 450ns and comes in a ceramic rectangular package with 24 terminals.
TMS27C512-120JE
TMS27C512-120JE by Texas Instruments is a 64KX8 EPROM with 120 ns access time, operating at 5V. It features 3-STATE output and INDUSTRIAL temperature grade. Commonly used in applications requiring reliable non-volatile memory storage with parallel interface.
MX25UM25345GXDI00
Macronix
EPROMs;
TMS27C020-20JL4
TMS27C020-20JL4 by Texas Instruments is a 256KX8 EPROM with 200ns access time, 3-state output, and operates at 5V. It is used in commercial applications requiring fast memory access and offers a memory density of 2097152 bits.
SMJ27C128-120JM
The Texas Instruments SMJ27C128-120JM is a 16KX8 EPROM with 125°C max temp, 120 ns access time, and 5V supply. Ideal for military applications due to its MIL-Grade tech, it offers 131072-bit memory density in a ceramic-metal package with through-hole terminals.
EPC2LI20
EPC2LI20 by Intel is a 20-terminal EPROM chip carrier with synchronous operation at 3.3V, featuring 1695680-bit memory density for configuration memory applications. It has a max operating temperature of 85°C and supports both serial and parallel programming modes, making it suitable for various electronic devices requiring non-volatile memory storage.
TMS27C020-100JL
TMS27C020-100JL by Texas Instruments is a 256KX8 EPROM with 100 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Commonly used in commercial applications for storing data due to its 2097152 bit memory density.
TMS2764A-45JL
TMS2764A-45JL by Texas Instruments is an EPROM with 8KX8 organization, 65536 bit memory density, and 450 ns max access time. It operates in asynchronous mode at a supply voltage of 5V. Widely used in commercial applications requiring reliable non-volatile memory storage.
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EPC1441PI8
EPC1441PI8 by Intel is an EPROM with 440800X1 organization, 440800-bit memory density, and operates at a synchronous mode. It is used for configuration memory applications due to its 3-STATE output characteristics and SERIAL interface.
EPC1441TC32N
EPC1441TC32N by Intel is a 32-terminal EPROM with a square package and a max operating temperature of 70°C. It operates in synchronous mode and has a memory density of 440800 bits. This configuration memory IC is suitable for various applications requiring non-volatile storage.
EPC1PI8N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
EPC1441LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
EPC1LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
EPC1441PC8
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Package Style (Meter): IN-LINE;
EPC1LC20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Pitch: 1.27 mm; Terminal Position: QUAD;
EPC1PI8
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1; Surface Mount: NO;
EPC1441LI20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL; Terminal Pitch: 1.27 mm;
EPC1PC8
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp; Surface Mount: NO;
EPC1441LI20N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Standby Current: .00006 Amp;
EPC1441TI32N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Surface Mount: YES;
EPC1441TI32
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Parallel or Serial: SERIAL;
EPC1441TC32
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Terminal Form: GULL WING;
EPC1LI20N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Qualification: Not Qualified;
EPC1LI20
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Organization: 1046496X1;
EPC1441LC20
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Programming Voltage (V): 3.3;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Width: 1;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Seated Height: 4.572 mm;
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