Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Surface Mount: YES;
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EPROM EPC1441TI32N attributes and parameters. Explore more EPROM devices from Altera
Additional Features:
JESD-30 Code:
JESD-609 Code:
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Peak Reflow Temperature (C):
Power Supplies (V):
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Qualification:
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Maximum Supply Current:
Maximum Supply Voltage (Vsup):
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EPC1441TI32N Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
FDV303N
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
Silicon Transistor
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hy Electronic
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
TMS27LV010A-30JL
Texas Instruments
TMS27LV010A-30JL by Texas Instruments is a 128KX8 EPROM with 3.3V nominal voltage, operating in asynchronous mode. It features 300 ns max access time and is commonly used in commercial applications requiring reliable non-volatile memory storage.
TMS27C64-1JE4
TMS27C64-1JE4 by Texas Instruments is an 8KX8 EPROM with 150ns access time, 3-state output, and operates at -40 to 85°C. Commonly used in industrial applications, it features a parallel interface, 5V supply voltage, and through-hole terminal form.
TMS27C291JL
TMS27C291JL by Texas Instruments is a 2Kx8 EPROM with 3-STATE output, operating at 5V. It features a max access time of 45ns and memory density of 16384 bits. Ideal for commercial applications requiring fast and reliable non-volatile memory storage.
EPC1441PC8
Intel
EPC1441PC8 by Intel is an EPROM with 440800X1 organization, 440800-bit memory density, and operates at a synchronous mode. It has 8 terminals in an IN-LINE package style and is ideal for configuration memory applications due to its SERIAL technology.
D2764A
Rochester Electronics
D2764A EPROM by Rochester Electronics features 8KX8 organization, 65536 bit memory density, and 250 ns max access time. It is commonly used in applications requiring a 5V nominal voltage, such as commercial-grade MOS technology systems with a need for 3-STATE output characteristics.
M27C1001-15XF6X
STMicroelectronics
M27C1001-15XF6X EPROM by STMicroelectronics features 128KX8 organization, 120 ns access time, and 1048576 bit memory density. It is commonly used in industrial applications requiring reliable non-volatile memory storage with a parallel interface.
TMS27128T-25JL
TMS27128T-25JL by Texas Instruments is a 16KX8 EPROM with 131072 bit memory density and 250 ns max access time. It operates at temperatures b/w 0 to 70 °C, suitable for commercial applications requiring fast data retrieval in a 28-terminal IN-LINE package.
EPC2LI20
EPC2LI20 by Intel is a 20-terminal EPROM chip carrier with synchronous operation at 3.3V, featuring 1695680-bit memory density for configuration memory applications. It has a max operating temperature of 85°C and supports both serial and parallel programming modes, making it suitable for various electronic devices requiring non-volatile memory storage.
TMS27C256-150JL4
TMS27C256-150JL4 by Texas Instruments is a 32KX8 EPROM with 150 ns access time, 3-STATE output, and 5V nominal voltage. Commonly used in commercial applications for storing data securely due to its UVPROM memory IC type and CMOS technology.
TMS27C128-25JL4
TMS27C128-25JL4 by Texas Instruments is a 16KX8 EPROM with 250ns access time, 5V supply voltage, and 3-STATE output. It is used in commercial applications for memory storage due to its 131072-bit density and CMOS technology.
MD27512-20
The Intel MD27512-20 is a 64KX8 EPROM with 3-STATE output, MILITARY grade, and MOS technology. It operates b/w -55 to 125 °C with a supply voltage of 5V. Commonly used in applications requiring reliable non-volatile memory storage with fast access times.
M27C1001-15F3
STMicroelectronics' M27C1001-15F3 EPROM features 128KX8 organization, 150 ns access time, and 1048576 bit memory density. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C with a supply voltage of 4.5-5.5 V.
TMS27C291-45JL
TMS27C291-45JL by Texas Instruments is a 2KX8 EPROM with 45 ns access time, 5V supply voltage, and 3-STATE output. Commonly used in commercial applications, it features a CMOS technology, through-hole terminal form, and operates in parallel mode.
M27C1001-15L6TR
M27C1001-15L6TR by STMicroelectronics is a 128KX8 EPROM with 120 ns access time, operating at 5V. It features a ceramic, metal-sealed co-fired package and is suitable for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier form factor. With an asynchronous operating mode and 3-state output characteristics, this CMOS technology-based UVPROM offers parallel data transfer with common I/O type.
TMS2764A-45JP4
TMS2764A-45JP4 by Texas Instruments is an 8KX8 EPROM with 65536 bit memory density. It operates at 5V, has a max access time of 450ns, and features a 3-STATE output. This UVPROM is commonly used in applications requiring non-volatile memory storage.
TMS27C040-12JE4
TMS27C040-12JE4 by Texas Instruments is a 512KX8 EPROM with 120ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and IN-LINE package style. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact form factor.
TMS27C32-12JE4
TMS27C32-12JE4 by Texas Instruments is a 4KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 120ns and memory density of 32768 bit. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
M27C1024-70F1X
M27C1024-70F1X by STMicroelectronics is a 64Kx16 UVPROM with a max access time of 70 ns, operating at 5V. It features a ceramic, glass-sealed package and operates asynchronously. Ideal for commercial applications requiring reliable data storage.
TMS27C020-200JE
TMS27C020-200JE by Texas Instruments is a 256KX8 EPROM with 200 ns access time, 3-STATE output, and operates at -40 to 85 °C. Commonly used in industrial applications for storing data securely due to its UVPROM technology and parallel interface.
M27C256B-70XF1
STMicroelectronics M27C256B-70XF1 is a 32KX8 EPROM with 70ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and parallel interface. Commonly used in commercial applications requiring non-volatile memory storage.
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EPC1441PI8
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
EPC1441PI8 by Intel is an EPROM with 440800X1 organization, 440800-bit memory density, and operates at a synchronous mode. It is used for configuration memory applications due to its 3-STATE output characteristics and SERIAL interface.
EPC1441TC32N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3 V;
EPC1441TC32N by Intel is a 32-terminal EPROM with a square package and a max operating temperature of 70°C. It operates in synchronous mode and has a memory density of 440800 bits. This configuration memory IC is suitable for various applications requiring non-volatile storage.
EPC1PI8N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1046496 words;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
EPC1LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; JESD-609 Code: e3;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Package Style (Meter): IN-LINE;
EPC1LC20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Pitch: 1.27 mm; Terminal Position: QUAD;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL;
EPC1441LC20N
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Memory Width: 1;
EPC1PI8
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1; Surface Mount: NO;
EPC1441LI20
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Parallel or Serial: SERIAL; Terminal Pitch: 1.27 mm;
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Programming Voltage (V): 3.3;
EPC1PC8
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.318 mm;
CONFIGURATION MEMORY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp; Surface Mount: NO;
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