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5962-8751502LA

STMicroelectronics

5962-8751502LA by STMicroelectronics

5962-8751502LA by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring an asynchronous operating mode and a max access time of 55 ns. It has a memory density of 65536 bits organized as 8Kx8. Ideal for high-reliability applications in harsh environments.

Median Price

$143.830

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Freelance Electronics

USA . 12 parts In-Stock

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$143.830

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$151.022

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$142.392

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Digiode

USA . 3,496 parts In-Stock

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Anansix

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Vyrian

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Electronics Depot

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Mil-Aero Solutions, Inc.

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PC Components Company LLC

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Bristol Electronics

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ComSIT Distribution GmbH

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Resion

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Prism Electronics

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Quantum Digital Technology

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IDEA Electronic Components Group

UK . 1,435 parts In-Stock

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$4.722

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$4.250

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MKK Technologies

India . 1,628 parts In-Stock

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$8.880

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DigiPath Technology Company

USA . 1,628 parts In-Stock

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Native Components

USA . 189 parts In-Stock

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$103.603

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Northwest PG Solutions

USA . 12 parts In-Stock

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Corphita

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Supply Digital

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Parana Technologies

USA . 1,779 parts In-Stock

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Perfect Parts

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Overview

Unlock reliability and performance with the 5962-8751502LA EPROM from STMicroelectronics, a leader in semiconductor innovation. Engineered for military-grade applications, this high-quality UVPROM ensures exceptional endurance and efficiency across diverse environments. With its robust ceramic and glass-sealed construction, it operates seamlessly under extreme temperatures, providing unmatched data retention and speed. Elevate your projects with this dependable solution, backed by STMicroelectronics' commitment to excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package offers excellent durability and protection against environmental factors, making it ideal for military and aerospace applications.

Screening Level: 38535Q/M; 38534H; 883B

The high screening levels indicate rigorous testing standards, ensuring reliability and performance in critical applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, making it easier to integrate into various designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies design and improves performance by allowing data access without the need for a clock signal.

Input/Output Type: COMMON

Common I/O type ensures compatibility with a wide range of devices and simplicity in integration.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard supply voltage of 5V makes this EPROM compatible with numerous systems and power architectures.

Power Supplies (V): 5

Single power supply simplifies design and reduces component count in circuits.

No. of Terminals: 24

A 24-terminal configuration allows for multiple connections, enhancing flexibility in application.

Package Style (Meter): IN-LINE, WINDOW

The in-line, windowed package allows for ultraviolet (UV) erasure, facilitating easy reprogramming and updates of data.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this EPROM can function reliably in demanding environments without degrading.

Organization: 8KX8

The 8Kx8 organization enables efficient memory allocation, making it well-suited for applications requiring moderate data storage.

Output Characteristics: 3-STATE

3-state output characteristics enhance the device’s ability to operate in shared bus configurations, improving system design flexibility.

Minimum Operating Temperature: -55 °C

A wide operational temperature range ensures performance in extreme conditions, ideal for military and aerospace uses.

Terminal Finish: TIN LEAD

Tin-lead finish ensures good solderability, promoting reliable connections during the manufacturing process.

Terminal Position: DUAL

Dual terminal positioning provides better connection options for board layouts, enhancing design versatility.

Maximum Seated Height: 5.08 mm

A compact seated height supports efficient use of space on circuit boards, making it suitable for densely packed applications.

Width: 7.62 mm

This width allows for optimal placement and spacing on PCB layouts, aiding in the design of compact circuits.

Minimum Supply Voltage (Vsup): 4.5 V

A low minimum supply voltage allows for operation in lower-power environments, enhancing efficiency.

Length: 32.005 mm

The specific length fits standard footprints, making it easy to replace or upgrade existing components on boards.

Temperature Grade: MILITARY

The military temperature grade indicates robustness, making this EPROM highly reliable for defense applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving durability and performance.

Parallel or Serial: PARALLEL

Parallel operation allows for faster data access speeds, which is advantageous for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole connections provide stable and secure mounting on PCBs, ideal for rugged applications.

No. of Words: 8192 words

Offering 8192 words of storage, this EPROM is suitable for applications that require moderate data retention.

Memory Width: 8

An 8-bit memory width aligns with many standard data handling requirements, providing compatibility with various systems.

Terminal Pitch: 2.54 mm

A standard terminal pitch ensures compatibility with most PCB layouts, facilitating easier integration into existing designs.

No. of Words Code: 8K

The 8K words code supports a variety of applications, allowing efficient data storage and retrieval.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V accommodates a wide range of power supply options, enhancing versatility.

Memory Density: 65536 bit

With a memory density of 65536 bits, this EPROM can store substantial amounts of data, suitable for complex applications.

Memory IC Type: UVPROM

As a UVPROM, this device allows for easy data erasure and reprogramming, maximizing flexibility and utility.

Maximum Access Time: 55 ns

With a maximum access time of 55 ns, this EPROM ensures swift data access, enhancing overall system performance.

Technical Specifications

EPROM 5962-8751502LA attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

32.005 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

EPROMs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8751502LA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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