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SZNUP2301MW6T1G

Onsemi

SZNUP2301MW6T1G by Onsemi

SZNUP2301MW6T1G by Onsemi is a Transient Suppression Device with 70V reverse test voltage, 0.715V forward voltage, and 50uA max reverse current. It is a surface-mount diode ideal for protecting sensitive electronics from voltage spikes in various applications.

Median Price

$0.198

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,358 parts In-Stock

1+ parts

$0.165

100+ parts

-

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10k+ parts

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2,358

$0.165

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Mouser Electronics

USA . 7,971 parts In-Stock

1+ parts

$0.850

100+ parts

$0.356

1k+ parts

-

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7,971

$0.850

$0.356

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DigiKey

USA . 3,557 parts In-Stock

1+ parts

$0.990

100+ parts

$0.399

1k+ parts

$0.277

10k+ parts

-

3,557

$0.990

$0.399

$0.277

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Chip1Stop

Japan . 2,408 parts In-Stock

1+ parts

-

100+ parts

$0.198

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2,408

-

$0.198

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Verical

USA . 2,358 parts In-Stock

1+ parts

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$0.165

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2,358

-

$0.165

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.255

100+ parts

-

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50

$0.255

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Digiode

USA . 1,419 parts In-Stock

1+ parts

$0.317

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1,419

$0.317

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Flip Electronics

USA . 36,000 parts In-Stock

1+ parts

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36,000

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Chip Stock

USA . 35,000 parts In-Stock

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35,000

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ComSIT Distribution GmbH

Germany . 17,200 parts In-Stock

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17,200

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ComSIT USA

USA . 17,200 parts In-Stock

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17,200

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Vyrian

USA . 4,110 parts In-Stock

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4,110

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LIBRA Elektronik GmbH

Germany . 2,968 parts In-Stock

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2,968

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.033

100+ parts

$0.030

1k+ parts

$0.027

10k+ parts

-

350

$0.033

$0.030

$0.027

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Ampacity Inc.

Singapore . 3,632 parts In-Stock

1+ parts

$0.158

100+ parts

-

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3,632

$0.158

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Corohmni

South Africa . 307 parts In-Stock

1+ parts

$0.186

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307

$0.186

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Corphita

USA . 1,969 parts In-Stock

1+ parts

$0.301

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1,969

$0.301

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Kepictronics

USA . 66,540 parts In-Stock

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66,540

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Lixinc

USA . 9,860 parts In-Stock

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9,860

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Kulean Microsystems

USA . 3,062 parts In-Stock

1+ parts

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3,062

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TANS Electronics

Latvia . 2,344 parts In-Stock

1+ parts

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2,344

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Problanco Electronics

Mexico . 1,497 parts In-Stock

1+ parts

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1,497

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SupplyDigital Components

Austria . 581 parts In-Stock

1+ parts

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581

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UHIMA Technologies

Türkiye . 378 parts In-Stock

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378

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Overview

Unleash the power of protection with the SZNUP2301MW6T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Transient Suppression Devices that are essential for safeguarding your electronics. With its surface mount capability and high operating temperature range, this device is perfect for a wide range of applications. Offering maximum reverse current and exceptional reliability, the SZNUP2301MW6T1G provides peace of mind and superior performance. Trust Onsemi to provide you with the best protection for your valuable electronics.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Reverse Current: 50 uA

Low reverse current ensures minimal power loss and efficient performance in suppressing voltage spikes.

Reverse Test Voltage: 70 V

Capable of handling high reverse voltages, making it suitable for various applications requiring transient voltage suppression.

Maximum Operating Temperature: 150 °C

High operating temperature range allows for reliable performance in harsh environments.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in both extreme cold and hot conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable soldering during manufacturing.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Specifically designed for transient voltage suppression, ensuring effective protection against voltage spikes.

Maximum Forward Voltage (VF): 0.715 V

Low forward voltage drop minimizes power dissipation and heat generation for efficient operation.

Technology: AVALANCHE

Avalanche technology provides fast response time and high surge current capability for effective transient voltage suppression.

Maximum Repetitive Peak Reverse Voltage: 70 V

Can handle repetitive peak reverse voltages of up to 70 V, making it suitable for various high-voltage applications.

Diode Element Material: SILICON

Silicon diode element offers high reliability and performance in transient suppression applications.

Technical Specifications

Transient Suppression Devices SZNUP2301MW6T1G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Diode Element Material:

SILICON

Maximum Forward Voltage (VF):

.715 V

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Peak Reflow Temperature (C):

260

Maximum Repetitive Peak Reverse Voltage:

70 V

Maximum Reverse Current:

50 uA

Reverse Test Voltage:

70 V

Sub-Category:

Other Diodes

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SZNUP2301MW6T1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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