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SZESD5B5.0ST1G

Onsemi

SZESD5B5.0ST1G by Onsemi

SZESD5B5.0ST1G by Onsemi is a Transient Suppression Device with 6.8V Breakdown Voltage, 50W Power Dissipation, and -55 to 150°C Operating Temperature Range. Ideal for protecting electronic circuits from voltage spikes in automotive and industrial applications.

Median Price

$0.066

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,493 parts In-Stock

1+ parts

$0.270

100+ parts

$0.099

1k+ parts

$0.062

10k+ parts

$0.048

1,493

$0.270

$0.099

$0.062

$0.048

Rochester

USA . 4,620 parts In-Stock

1+ parts

-

100+ parts

$0.035

1k+ parts

$0.029

10k+ parts

$0.026

4,620

-

$0.035

$0.029

$0.026

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.091

3,000

-

-

-

$0.091

Flip Electronics (Authorized)

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,240

-

-

-

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DigiKey

USA . 1,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.042

1,950

-

-

-

$0.042

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 48 parts In-Stock

1+ parts

$0.051

100+ parts

$0.048

1k+ parts

$0.046

10k+ parts

$0.042

48

$0.051

$0.048

$0.046

$0.042

Digiode

USA . 1,278 parts In-Stock

1+ parts

$0.092

100+ parts

-

1k+ parts

-

10k+ parts

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1,278

$0.092

-

-

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.135

100+ parts

-

1k+ parts

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900

$0.135

-

-

-

Chip Stock

USA . 65,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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65,798

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Vyrian

USA . 12,770 parts In-Stock

1+ parts

-

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12,770

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.129

6,000

-

-

-

$0.129

IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.108

6,000

-

-

-

$0.108

Cyclops Electronics Ltd

UK . 5,995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,995

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Flip Electronics

USA . 2,240 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,240

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-

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SIE Connect GmbH - GreenChips

Germany . 48 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.025

100+ parts

$0.023

1k+ parts

$0.020

10k+ parts

-

20

$0.025

$0.023

$0.020

-

Corohmni

South Africa . 100 parts In-Stock

1+ parts

$0.058

100+ parts

-

1k+ parts

-

10k+ parts

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100

$0.058

-

-

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Ampacity Inc.

Singapore . 12,674 parts In-Stock

1+ parts

$0.082

100+ parts

-

1k+ parts

-

10k+ parts

-

12,674

$0.082

-

-

-

Semicontronic

India . 12,403 parts In-Stock

1+ parts

$0.082

100+ parts

$0.080

1k+ parts

$0.080

10k+ parts

-

12,403

$0.082

$0.080

$0.080

-

Corphita

USA . 1,837 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

-

10k+ parts

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1,837

$0.087

-

-

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Continental Prestige Electronics

USA . 6,092 parts In-Stock

1+ parts

$0.135

100+ parts

-

1k+ parts

-

10k+ parts

$0.132

6,092

$0.135

-

-

$0.132

Argo Parts USA

USA . 3,725 parts In-Stock

1+ parts

$0.135

100+ parts

-

1k+ parts

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10k+ parts

$0.131

3,725

$0.135

-

-

$0.131

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.135

100+ parts

-

1k+ parts

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10k+ parts

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2,000

$0.135

-

-

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Aztec Data Supply Inc.

USA . 1,430 parts In-Stock

1+ parts

$0.170

100+ parts

-

1k+ parts

-

10k+ parts

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1,430

$0.170

-

-

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Component Stockers USA

USA . 19,798 parts In-Stock

1+ parts

$0.410

100+ parts

$0.190

1k+ parts

$0.120

10k+ parts

$0.090

19,798

$0.410

$0.190

$0.120

$0.090

Perfect Parts

USA . 64,333 parts In-Stock

1+ parts

-

100+ parts

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64,333

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Kepictronics

USA . 51,000 parts In-Stock

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51,000

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SupplyDigital Components

Austria . 8,169 parts In-Stock

1+ parts

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8,169

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A-Z Elektronik GmbH

Germany . 6,912 parts In-Stock

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6,912

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ChipstoGo Electronic ltd

UK . 3,000 parts In-Stock

1+ parts

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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Problanco Electronics

Mexico . 2,301 parts In-Stock

1+ parts

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2,301

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-

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Lixinc

USA . 1,616 parts In-Stock

1+ parts

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100+ parts

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1,616

-

-

-

-

TANS Electronics

Latvia . 1,447 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,447

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-

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Kulean Microsystems

USA . 813 parts In-Stock

1+ parts

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100+ parts

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813

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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100+ parts

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350

-

-

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$6.036

1k+ parts

$6.036

10k+ parts

$6.036

350

-

$6.036

$6.036

$6.036

UHIMA Technologies

Türkiye . 8 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8

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Overview

Discover the SZESD5B5.0ST1G by Onsemi, a top-notch Transient Suppression Device designed for optimal performance and reliability. With a superior build quality and cutting-edge technology, this product offers unmatched protection against voltage spikes and surges in various applications. Trust Onsemi's reputation for excellence in manufacturing to deliver a high-quality solution that ensures your electronics stay safe and functional. Experience peace of mind knowing that the SZESD5B5.0ST1G provides the value, benefits, and advantages you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the device, making it suitable for various applications.

Config: SINGLE

Single configuration simplifies installation and maintenance of the device.

Surface Mount: YES

Surface mount design allows for easy and secure mounting on circuit boards.

Maximum Non Repetitive Peak Reverse Power Dissipation: 50 W

High power dissipation capability ensures effective transient suppression under extreme conditions.

Nominal Breakdown Voltage: 6.8 V

Optimal breakdown voltage level for efficient protection against voltage spikes.

Maximum Reverse Current: 1 uA

Low reverse current ensures minimal power loss and efficient operation of the device.

Package Shape: RECTANGULAR

Rectangular shape allows for space-efficient placement on circuit boards.

Reverse Test Voltage: 5 V

Reverse test voltage of 5V ensures reliable performance in preventing reverse currents.

No. of Terminals: 2

Two terminals for easy connection in circuitry.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact circuit design.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance makes the device suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable operation in cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for easy installation.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options.

Maximum Power Dissipation: 0.2 W

Efficient power dissipation capability ensures long-term reliability of the device.

Minimum Breakdown Voltage: 5.8 V

Minimum breakdown voltage level ensures protection against voltage surges.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature ensures proper installation and soldering of the device.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures stable performance during soldering processes.

Maximum Breakdown Voltage: 7.8 V

High maximum breakdown voltage level provides extra protection against high voltage spikes.

Reference Standard: AEC-Q101; IEC-61000-4-2

Meets industry standards for reliability and performance in transient suppression applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode ensures effective suppression of transient voltage spikes.

Maximum Forward Voltage (VF): 0.9 V

Low forward voltage drop ensures minimal power loss during operation.

Technology: AVALANCHE

Avalanche technology ensures rapid response to transient voltage spikes for efficient protection.

Terminal Form: FLAT

Flat terminal form provides easy and secure connection in circuitry.

Maximum Repetitive Peak Reverse Voltage: 5 V

High repetitive peak reverse voltage tolerance ensures long-term reliability of the device.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows for protection against voltage spikes in both directions.

Diode Element Material: SILICON

Silicon diode element material ensures durability and efficiency in transient suppression applications.

Technical Specifications

Transient Suppression Devices SZESD5B5.0ST1G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE

Maximum Breakdown Voltage:

7.8 V

Minimum Breakdown Voltage:

5.8 V

Nominal Breakdown Voltage:

6.8 V

Config:

SINGLE

Diode Element Material:

SILICON

Maximum Forward Voltage (VF):

.9 V

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

50 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Maximum Power Dissipation:

.2 W

Reference Standard:

AEC-Q101; IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

5 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SZESD5B5.0ST1G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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