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SZESD9101P2T5G

Onsemi

SZESD9101P2T5G by Onsemi

SZESD9101P2T5G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V breakdown voltage, ideal for transient suppression applications. It operates b/w -55°C to 150°C, complies with AEC-Q101 and IEC-61000-4-2 standards, and features avalanche technology for robust protection. This single-configured device comes in a small outline package suitable for surface mount assembly.

Median Price

$0.118

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 318,867 parts In-Stock

1+ parts

$0.420

100+ parts

$0.164

1k+ parts

$0.108

10k+ parts

$0.097

318,867

$0.420

$0.164

$0.108

$0.097

Mouser Electronics

USA . 122,002 parts In-Stock

1+ parts

$0.420

100+ parts

$0.164

1k+ parts

$0.097

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-

122,002

$0.420

$0.164

$0.097

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Arrow

USA . 56,000 parts In-Stock

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$0.067

56,000

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$0.067

Verical

USA . 40,000 parts In-Stock

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$0.128

10k+ parts

$0.085

40,000

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-

$0.128

$0.085

Master Electronics

USA . 40,000 parts In-Stock

1+ parts

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$0.109

10k+ parts

$0.072

40,000

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-

$0.109

$0.072

Element14

Singapore . 32,000 parts In-Stock

1+ parts

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$0.075

32,000

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$0.075

Chip1Stop

Japan . 13,394 parts In-Stock

1+ parts

-

100+ parts

$0.128

1k+ parts

$0.080

10k+ parts

$0.062

13,394

-

$0.128

$0.080

$0.062

Farnell

UK . 10,610 parts In-Stock

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$0.061

10k+ parts

$0.046

10,610

-

-

$0.061

$0.046

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$0.106

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-

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94

$0.106

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Digiode

USA . 458 parts In-Stock

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$0.287

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458

$0.287

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Ozdisan Elektronik

Türkiye . 3,697 parts In-Stock

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$62.731

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3,697

$62.731

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Chip Stock

USA . 254,135 parts In-Stock

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Flip Electronics

USA . 72,000 parts In-Stock

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Vyrian

USA . 71,840 parts In-Stock

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71,840

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NAC Semi

USA . 8,000 parts In-Stock

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$0.122

8,000

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$0.122

Sensible Micro Corp

USA . 5,875 parts In-Stock

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5,875

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Atlantic Semiconductor

USA . 1,872 parts In-Stock

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Bristol Electronics

USA . 1,870 parts In-Stock

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1,870

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 290 parts In-Stock

1+ parts

$0.010

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290

$0.010

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Ampacity Inc.

Singapore . 51,998 parts In-Stock

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$0.049

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51,998

$0.049

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Semicontronic

India . 51,813 parts In-Stock

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$0.049

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$0.048

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$0.048

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51,813

$0.049

$0.048

$0.048

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Corohmni

South Africa . 53 parts In-Stock

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$0.058

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53

$0.058

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Continental Prestige Electronics

USA . 5,067 parts In-Stock

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$0.105

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$0.103

5,067

$0.105

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$0.103

Argo Parts USA

USA . 4,725 parts In-Stock

1+ parts

$0.105

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$0.102

4,725

$0.105

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$0.102

Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.108

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$0.103

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$0.103

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350

$0.108

$0.103

$0.103

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Corphita

USA . 151 parts In-Stock

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$0.272

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Lixinc

USA . 17,850 parts In-Stock

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Authorized Procurement Solutions

USA . 16,100 parts In-Stock

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Futuretech Components

Singapore . 9,600 parts In-Stock

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TANS Electronics

Latvia . 7,295 parts In-Stock

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Problanco Electronics

Mexico . 4,511 parts In-Stock

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Kulean Microsystems

USA . 3,566 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.104

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$0.100

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$0.098

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$0.100

$0.098

Formix International (Excess)

India . 1,465 parts In-Stock

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1,465

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Infinite Electronics LLP (Excess)

. 734 parts In-Stock

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734

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SupplyDigital Components

Austria . 694 parts In-Stock

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UHIMA Technologies

Türkiye . 566 parts In-Stock

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566

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Kepictronics

USA . 500 parts In-Stock

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500

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Modulus Dynamics

Lithuania . 500 parts In-Stock

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500

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

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$1.006

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$1.006

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$1.006

450

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$1.006

$1.006

$1.006

Overview

Upgrade your electronics with the SZESD9101P2T5G by Onsemi, a top-of-the-line Transient Suppression Device designed to protect your devices from voltage spikes and surges. Manufactured by Onsemi, a trusted name in the industry known for their high-quality products, this device offers unparalleled reliability and performance. Ideal for a wide range of applications, this product is a must-have for anyone looking to safeguard their electronic equipment. Invest in the SZESD9101P2T5G today and enjoy peace of mind knowing your devices are protected against potential damage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and reliability to the product.

Config: SINGLE

The single configuration simplifies installation and maintenance of the device.

Surface Mount: YES

Being surface mountable makes this device easy to integrate into various electronic circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and ensures reliable performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it suitable for applications where space is limited.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this device can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the device can function in a wide range of temperatures.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a secure connection and prevents corrosion.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit design and installation.

Minimum Breakdown Voltage: 5.3 V

The minimum breakdown voltage of 5.3 V ensures protection against voltage spikes.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature of 30 seconds prevents damage to the device during assembly.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this device can withstand the soldering process without affecting performance.

Maximum Breakdown Voltage: 8 V

The maximum breakdown voltage of 8 V offers additional protection against voltage surges.

Reference Standard: AEC-Q101; IEC-61000-4-2

Compliant with industry standards, ensuring quality and reliability of the device.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The trans voltage suppressor diode type provides efficient transient voltage suppression for electronic circuits.

Technology: AVALANCHE

The avalanche technology used in this device enhances its performance and reliability in suppressing transient voltage spikes.

Terminal Form: FLAT

The flat terminal form simplifies installation and provides a secure connection to the circuit.

Maximum Repetitive Peak Reverse Voltage: 5 V

The maximum repetitive peak reverse voltage rating of 5 V ensures protection against reverse voltage conditions.

Polarity: UNIDIRECTIONAL

The unidirectional polarity of the device ensures consistent protection against voltage spikes in one direction only.

Diode Element Material: SILICON

The silicon diode element material offers high-performance characteristics and durability for long-lasting use.

Technical Specifications

Transient Suppression Devices SZESD9101P2T5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

8 V

Minimum Breakdown Voltage:

5.3 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

AEC-Q101; IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SZESD9101P2T5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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