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SPI335-05

Onsemi

SPI335-05 by Onsemi

SPI335-05 by Onsemi is a Linear Position Sensor with Max VCEsat of 1.2V, Darlington Output Circuit Type, and 80 °C Max Operating Temp. Ideal for applications requiring precise position sensing in harsh environments due to its fast response time of 100us and wide operating temperature range from -20°C to 80°C.

Median Price

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Lifecycle Status

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Digiode

USA . 1,452 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 7,400 parts In-Stock

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Kulean Microsystems

USA . 6,733 parts In-Stock

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SupplyDigital Components

Austria . 4,588 parts In-Stock

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Corphita

USA . 1,357 parts In-Stock

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Corohmni

South Africa . 351 parts In-Stock

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UHIMA Technologies

Türkiye . 335 parts In-Stock

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Problanco Electronics

Mexico . 148 parts In-Stock

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Overview

Discover the SPI335-05 by Onsemi, a top-quality linear position sensor designed to meet your needs with precision and reliability. Manufactured by Onsemi, a trusted industry leader, this sensor offers unparalleled performance in a variety of applications. From automotive to industrial automation, this sensor provides accurate measurements and fast response times. Improve your system's efficiency and accuracy with the SPI335-05, offering exceptional value and benefits to customers looking for quality sensors. Elevate your projects with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Maximum VCEsat: 1.2 V

With a low VCEsat, this linear position sensor offers efficient performance and minimal power consumption.

Output Circuit Type: Darlington

The Darlington output circuit provides high gain and better accuracy in detecting linear position, making it a reliable choice for precise applications.

Maximum Operating Temperature: 80 °C

Capable of operating in higher temperatures, this sensor can be used in a wide range of industrial environments without risk of overheating.

Response Time: 100 us

With a fast response time of 100 microseconds, this sensor can quickly detect changes in linear position, ensuring real-time feedback and control.

Minimum Operating Temperature: -20 °C

Designed to function in low temperatures, this sensor is suitable for use in cold storage facilities or outdoor applications.

Maximum Output Voltage: 20 V

The high output voltage capability allows this sensor to work with a variety of control systems and devices, offering flexibility in integration.

Maximum Operating Current: 50 mA

With a low operating current, this sensor helps in reducing power consumption and minimizing heat dissipation, making it energy-efficient.

Maximum Output Current: 15 A

Capable of handling high output currents, this sensor can be used in demanding applications without the risk of damage or failure.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature ensures secure installation and placement of the sensor, providing stability and accuracy in linear position detection.

Gap Size: 0.001 mm

With an extremely small gap size, this sensor offers precision in measuring linear position with minimal room for error, making it suitable for high-accuracy applications.

Technical Specifications

Linear Position Sensors SPI335-05 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Darlington

Maximum Output Current:

15 A

Maximum Output Voltage:

20 V

Response Time:

100 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

1.2 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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