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SPI-336-99-T1

Onsemi

SPI-336-99-T1 by Onsemi

SPI-336-99-T1 by Onsemi is a linear position sensor with 1V-1.6V supply voltage range, 0.08-1.10mA analog current output, and 5us response time. Ideal for applications requiring precise photoelectric diffuse sensing in compact spaces with temperatures ranging from -20 °C to 80°C.

Median Price

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Lifecycle Status

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Vyrian

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TANS Electronics

Latvia . 3,977 parts In-Stock

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SupplyDigital Components

Austria . 3,100 parts In-Stock

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Kulean Microsystems

USA . 2,849 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 535 parts In-Stock

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Corohmni

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Problanco Electronics

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Overview

Enhance your industrial applications with the SPI-336-99-T1 linear position sensor by Onsemi. Manufactured with precision and reliability, this sensor offers unparalleled accuracy in measuring position changes. Ideal for a variety of applications, this sensor provides real-time data for enhanced performance and efficiency. Trust Onsemi to deliver high-quality products that meet your needs. Upgrade your systems today with the SPI-336-99-T1 and experience the difference in quality and performance.

Feature Benefit Bullets

Maximum Supply Voltage: 1.6 V

Low supply voltage helps in saving power and reducing heat generation, making it efficient for battery-powered applications.

Body Width: 2.7 inch

Wide body width provides stability and durability to the sensor, ensuring accurate and reliable measurements.

Sensors or Transducers Type: LINEAR POSITION SENSOR, PHOTOELECTRIC, DIFFUSE

Photoelectric sensors offer high precision and can detect small changes in position accurately, making them ideal for linear position sensing applications.

Body Height: 1.5 mm

Low body height makes the sensor compact and easy to integrate into various systems without taking up much space.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for easy mounting and alignment in systems, improving overall installation efficiency.

Minimum Supply Voltage: 1 V

The low minimum supply voltage ensures that the sensor can operate in a wide range of power supply conditions.

Maximum Operating Temperature: 80 °C

High operating temperature range allows the sensor to be used in a variety of industrial environments without risk of damage or malfunction.

Output Range: 0.08-1.10mA

Wide output range provides flexibility in measuring different positions and allows for precise control of the sensor output.

Output Type: ANALOG CURRENT

Analog current output allows for continuous and smooth signal transmission, ensuring accurate positional data without digital noise.

Response Time: 5 us

Fast response time enables real-time monitoring and control of position changes, making the sensor suitable for high-speed applications.

Minimum Operating Temperature: -20 °C

Low operating temperature range ensures the sensor can function in cold environments without any performance degradation.

Maximum Operating Current: 10 mA

The sensor can handle a maximum operating current of 10 mA, providing sufficient power for reliable operation in demanding applications.

Body Length/Diameter: 3.4 mm

Compact body length allows for easy integration and placement of the sensor in tight spaces, making it versatile for various mounting scenarios.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections for the sensor, preventing signal loss or intermittent connections.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies installation and maintenance, making it convenient for use in automated assembly processes.

Technical Specifications

Linear Position Sensors SPI-336-99-T1 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Additional Features:

0.50V VCE, 200NA DARK CURRENT

Body Width:

2.7 inch

Body Height:

1.5 mm

Body Length/Diameter:

3.4 mm

Mounting Feature:

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Range:

Output Type:

Package Shape or Style:

Response Time:

5 us

Sensors or Transducers Type:

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1 V

Termination Type:

SOLDER

Trade Compliance

SPI-336-99-T1 Sensors & Transducers trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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