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SPI310

Onsemi

SPI310 by Onsemi

SPI310 by Onsemi is a Linear Position Sensor with VCEsat of 0.6V, Output Voltage of 20V, and Operating Current of 50mA. Ideal for applications requiring precise gap sensing in environments ranging from -25 °C to 80°C.

Median Price

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Lifecycle Status

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2

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1k+

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Digiode

USA . 1,257 parts In-Stock

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Vyrian

USA . 969 parts In-Stock

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TANS Electronics

Latvia . 5,004 parts In-Stock

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Kulean Microsystems

USA . 3,035 parts In-Stock

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Corphita

USA . 1,925 parts In-Stock

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SupplyDigital Components

Austria . 459 parts In-Stock

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UHIMA Technologies

Türkiye . 414 parts In-Stock

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Problanco Electronics

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Corohmni

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Overview

Experience unparalleled precision and reliability with the SPI310 by Onsemi. As a leading manufacturer of linear position sensors, Onsemi's commitment to quality shines through in this product. Ideal for a wide range of applications, the SPI310 offers unmatched value with its precise output circuit type and high maximum output current. Say goodbye to guesswork and hello to accuracy with the SPI310 – trust Onsemi to deliver excellence every time.

Feature Benefit Bullets

Maximum VCEsat: 0.6 V

Low VCE saturation voltage ensures efficiency in operation and minimal power dissipation, making this linear position sensor a cost-effective choice.

Output Circuit Type: Transistor

Transistor output circuit provides reliable and accurate signal output, ensuring precise measurement of linear position.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows for use in various environmental conditions, enhancing the versatility of this linear position sensor.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature, this linear position sensor can be used in cold environments without any issues, increasing its usability.

Maximum Output Voltage: 20 V

High maximum output voltage enables this linear position sensor to be compatible with a wide range of systems and applications.

Maximum Operating Current: 50 mA

Low operating current requirement ensures energy efficiency and allows for use in battery-powered applications, making this linear position sensor a practical choice.

Maximum Output Current: 0.5 A

High maximum output current rating enables this linear position sensor to handle large loads, making it suitable for industrial applications.

Gap Size: 0.001 mm

With a minimal gap size, this linear position sensor offers high precision and accuracy in measuring linear position, making it a reliable choice for critical applications.

Technical Specifications

Linear Position Sensors SPI310 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Output Circuit Type:

Transistor

Maximum Output Current:

.5 A

Maximum Output Voltage:

20 V

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

.6 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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