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SPI315-55

Onsemi

SPI315-55 by Onsemi

SPI315-55 by Onsemi is a Linear Position Sensor with Max VCEsat of 1.2V, Darlington Output Circuit Type, and 80 °C Max Operating Temp. Ideal for applications requiring precise position sensing in tight spaces due to its 0.001mm Gap Size and Surface mounting Feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,330 parts In-Stock

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Vyrian

USA . 958 parts In-Stock

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TANS Electronics

Latvia . 8,042 parts In-Stock

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SupplyDigital Components

Austria . 4,445 parts In-Stock

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Kulean Microsystems

USA . 3,663 parts In-Stock

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Problanco Electronics

Mexico . 416 parts In-Stock

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UHIMA Technologies

Türkiye . 275 parts In-Stock

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Corphita

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Corohmni

South Africa . 139 parts In-Stock

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Overview

Elevate your projects with the SPI315-55 by Onsemi, a cutting-edge linear position sensor that delivers unparalleled precision and reliability. Manufactured by industry leader Onsemi, this sensor is designed to exceed expectations in a wide range of applications. Whether you're working on robotics, automotive systems, or industrial machinery, the SPI315-55 offers exceptional value by providing accurate measurements with a quick response time. Trust Onsemi's expertise and choose the SPI315-55 for your next project to experience the quality and performance that sets it apart from the competition.

Feature Benefit Bullets

Maximum VCEsat: 1.2 V

Low VCEsat value indicates minimal voltage drop across the sensor, leading to accurate and precise measurements.

Output Circuit Type: Darlington

Darlington circuit configuration provides high gain, making the sensor sensitive and efficient in translating position changes.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows the sensor to function reliably in various environmental conditions.

Response Time: 100 us

Fast response time ensures real-time data output for quick and dynamic position monitoring.

Minimum Operating Temperature: -20 °C

Handles low temperature environments, making it suitable for a variety of applications including industrial and automotive sectors.

Maximum Output Voltage: 20 V

High output voltage range allows for compatibility with a wide range of systems and devices.

Maximum Operating Current: 50 mA

Low operating current consumption results in energy-efficient operation and less strain on the power source.

Mounting Feature: SURFACE MOUNT

Surface mount design offers easy installation and integration into existing systems.

Gap Size: 0.001 mm

Ultra-precise gap size enables high-resolution measurements, making it suitable for applications requiring fine positional control.

Technical Specifications

Linear Position Sensors SPI315-55 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Darlington

Maximum Output Voltage:

20 V

Response Time:

100 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

1.2 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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