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SPI315-15

Onsemi

SPI315-15 by Onsemi

SPI315-15 by Onsemi is a Linear Position Sensor with Max VCEsat of 1.2V, Darlington Output Circuit Type, and Response Time of 100us. Ideal for applications requiring precise position sensing in environments ranging from -20 °C to 80°C.

Median Price

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Lifecycle Status

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Digiode

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Kepictronics

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SupplyDigital Components

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Kulean Microsystems

USA . 6,049 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Corohmni

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Overview

Unlock precision and reliability with the SPI315-15 linear position sensor by Onsemi. As a leader in the industry, Onsemi guarantees top-notch quality and performance for all your sensing needs. Whether you're in automotive, industrial, or consumer electronics, this sensor offers unparalleled value with its fast response time, high output current, and wide operating temperature range. Trust Onsemi to deliver cutting-edge technology that brings efficiency and accuracy to your applications.

Feature Benefit Bullets

Maximum VCEsat: 1.2 V

Low VCEsat value indicates efficient power usage and reduced heat generation, making this product energy-efficient.

Output Circuit Type: Darlington

Darlington output circuit type provides high gain and low power consumption, ensuring accurate and reliable signal amplification.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows for reliable use in varying environmental conditions without loss of performance.

Response Time: 100 us

Fast response time enables quick and precise measurement, making this sensor suitable for applications requiring real-time data.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures the sensor can still perform reliably in cold environments without freezing or malfunctioning.

Maximum Output Voltage: 20 V

High output voltage capability allows for compatibility with a wide range of systems and devices, increasing the sensor's versatility.

Maximum Operating Current: 50 mA

Low operating current helps in reducing power consumption and heat dissipation, making the sensor energy-efficient and durable.

Maximum Output Current: 15 A

High output current rating enables the sensor to handle high current applications without risk of overheating or damage.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on various surfaces, making it convenient for different mounting applications.

Gap Size: 0.001 mm

Minimal gap size ensures precision in measurement and accurate readings, making this sensor suitable for high-precision applications.

Technical Specifications

Linear Position Sensors SPI315-15 attributes and parameters. Explore more Linear Position Sensors devices from Onsemi

Specs

Gap Size:

.001 mm

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Darlington

Maximum Output Current:

15 A

Maximum Output Voltage:

20 V

Response Time:

100 us

Sub-Category:

Position, Linear, Photoelectric Sensors

Maximum VCEsat:

1.2 V

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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